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D-Index & Metrics

Electronics and Electrical Engineering

D-Index
32
Citations
7135
World Ranking
6196
National Ranking
180

Overview

Ingmar Kallfass is affiliated with the University of Stuttgart in Germany. Their research primarily focuses on engineering, with a substantial emphasis on electrical and electronic engineering. They have also contributed to fields including aerospace engineering, condensed matter physics, atomic and molecular physics, optics, and biomedical engineering.

Their research spans several core topics, notably:

  • Radio Frequency Integrated Circuit Design
  • Silicon Carbide Semiconductor Technologies
  • GaN-based semiconductor devices and materials
  • Semiconductor materials and devices
  • Microwave Engineering and Waveguides
  • Advanced Photonic Communication Systems
  • Advancements in Semiconductor Devices and Circuit Design

Kallfass has a significant number of publications, with a concentration in well-regarded venues within their discipline, including:

  • IEEE Transactions on Terahertz Science and Technology
  • IEEE Transactions on Power Electronics
  • 2021 51st European Microwave Conference (EuMC)
  • Power Electronic Devices and Components
  • arXiv (Cornell University)

Recent papers authored or co-authored by Kallfass include:

  • The 2023 terahertz science and technology roadmap (2023), published in Journal of Physics D Applied Physics
  • A 300-GHz Wireless Link Employing a Photonic Transmitter and an Active Electronic Receiver With a Transmission Bandwidth of 54 GHz (2020), published in IEEE Transactions on Terahertz Science and Technology
  • PCB-Embedded GaN-on-Si Half-Bridge and Driver ICs With On-Package Gate and DC-Link Capacitors (2020), published in IEEE Transactions on Power Electronics
  • Large-Area Lateral AlGaN/GaN-on-Si Field-Effect Rectifier With Low Turn-On Voltage (2020), published in IEEE Electron Device Letters
  • THz Communications and the Demonstration in the ThoR-Backhaul Link (2024), published in IEEE Transactions on Terahertz Science and Technology

Frequent co-authors collaborating with Kallfass include:

  • Benjamin Schoch
  • Dominik Wrana
  • A. Tessmann
  • Simon Haußmann
  • R. Henneberger

Best Publications

  • Wireless sub-THz communication system with high data rate

    S. Koenig;D. Lopez-Diaz;J. Antes;J. Antes;F. Boes;F. Boes

  • The 2016 terahertz science and technology roadmap

    S. S. Dhillon;Vitiello;E. H. Linfield;A. G. Davies

  • All Active MMIC-Based Wireless Communication at 220 GHz

    I. Kallfass;J. Antes;T. Schneider;F. Kurz

  • 64 Gbit/s Transmission over 850 m Fixed Wireless Link at 240 GHz Carrier Frequency

    Ingmar Kallfass;Florian Boes;Tobias Messinger;Jochen Antes

  • Towards MMIC-Based 300GHz Indoor Wireless Communication Systems

    Ingmar Kallfass;Iulia Dan;Sebastian Rey;Parisa Harati

  • Single-Chip 220-GHz Active Heterodyne Receiver and Transmitter MMICs With On-Chip Integrated Antenna

    M Abbasi;S E Gunnarsson;N Wadefalk;R Kozhuharov

  • Ultra-broadband MMIC-based wireless link at 240 GHz enabled by 64GS/s DAC

    Florian Boes;Tobias Messinger;Jochen Antes;Dirk Meier

  • Microwave performance evaluation of diamond surface channel FETs

    M. Kubovic;M. Kasu;M. Kasu;I. Kallfass;M. Neuburger

  • 100 Gbit/s wireless link with mm-wave photonics

    S. Koenig;F. Boes;D. Lopez-Diaz;J. Antes

  • A Terahertz Wireless Communication Link Using a Superheterodyne Approach

    Iulia Dan;Guillaume Ducournau;Shintaro Hisatake;Pascal Szriftgiser

  • Metamorphic HEMT MMICs and Modules for Use in a High-Bandwidth 210 GHz Radar

    A. Tessmann;I. Kallfass;A. Leuther;H. Massler

  • Metamorphic HEMT technology for low-noise applications

    A. Leuther;A. Tessmann;I. Kallfass;R. Losch

  • Single-Chip Frequency Multiplier Chains for Millimeter-Wave Signal Generation

    M. Abbasi;R. Kozhuharov;C. Karnfelt;I. Angelov

  • A 220 GHz Single-Chip Receiver MMIC With Integrated Antenna

    S.E. Gunnarsson;N. Wadefalk;J. Svedin;S. Cherednichenko

  • Performance Estimation for Broadband Multi-Gigabit Millimeter- and Sub-Millimeter-Wave Wireless Communication Links

    Jochen Antes;Ingmar Kallfass

  • Metamorphic HEMT MMICs and Modules Operating Between 300 and 500 GHz

    A. Tessmann;A. Leuther;V. Hurm;I. Kallfass

  • Multiple-Throw Millimeter-Wave FET Switches for Frequencies from 60 up to 120 GHz

    I. Kallfass;S. Diebold;H. Massler;S. Koch

  • Probe based antenna measurements up to 325 GHz for upcoming millimeter-wave applications

    H. Gulan;S. Beer;S. Diebold;C. Rusch

  • A 300-GHz Wireless Link Employing a Photonic Transmitter and an Active Electronic Receiver With a Transmission Bandwidth of 54 GHz

    Iulia Dan;Pascal Szriftgiser;Emilien Peytavit;Jean-Francois Lampin

  • A subharmonic chipset for gigabit communication around 240 GHz

    D. Lopez-Diaz;I. Kallfass;A. Tessmann;A. Leuther

  • Transmission of an 8-PSK modulated 30 Gbit/s signal using an MMIC-based 240 GHz wireless link

    J. Antes;S. Koenig;D. Lopez-Diaz;F. Boes

  • 20 NM metamorphic HEMT WITH 660 GHZ FT

    A. Leuther;S. Koch;A. Tessmann;I. Kallfass

Frequent Co-Authors

Arnulf Leuther
Arnulf Leuther Fraunhofer Society
Axel Tessmann
Axel Tessmann Fraunhofer Society
Oliver Ambacher
Oliver Ambacher University of Freiburg
Thomas Zwick
Thomas Zwick Karlsruhe Institute of Technology
Michael Schlechtweg
Michael Schlechtweg Fraunhofer Institute for Applied Solid State Physics IAF
Herbert Zirath
Herbert Zirath Chalmers University of Technology
Juerg Leuthold
Juerg Leuthold ETH Zurich
Dan Ritter
Dan Ritter Technion – Israel Institute of Technology
Wolfgang Freude
Wolfgang Freude Karlsruhe Institute of Technology
Christian Koos
Christian Koos Karlsruhe Institute of Technology

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