World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
36
Citations
4412
World Ranking
5411
National Ranking
1863

Overview

What is he best known for?

The fields of study he is best known for:

  • Electrical engineering
  • Semiconductor
  • Transistor

David C. Ahlgren mostly deals with Heterojunction bipolar transistor, Electrical engineering, Optoelectronics, Bipolar junction transistor and Electronic engineering. David C. Ahlgren works mostly in the field of Heterojunction bipolar transistor, limiting it down to topics relating to Terahertz radiation and, in certain cases, Frequency divider, Multiplexer, Ring oscillator and Integrated circuit, as a part of the same area of interest. His Electrical engineering research focuses on CMOS and Wafer.

His CMOS research integrates issues from BiCMOS and Silicon-germanium. As a member of one scientific family, David C. Ahlgren mostly works in the field of Optoelectronics, focusing on Transistor and, on occasion, AND gate. His studies deal with areas such as Wireless and Design for manufacturability as well as Electronic engineering.

His most cited work include:

  • Self-aligned SiGe NPN transistors with 285 GHz f/sub MAX/ and 207 GHz f/sub T/ in a manufacturable technology (249 citations)
  • SiGe HBTs with cut-off frequency of 350 GHz (167 citations)
  • Current status and future trends of SiGe BiCMOS technology (148 citations)

What are the main themes of his work throughout his whole career to date?

David C. Ahlgren mainly focuses on Optoelectronics, Heterojunction bipolar transistor, Electrical engineering, Bipolar junction transistor and Silicon-germanium. In his research on the topic of Optoelectronics, Dram is strongly related with Transistor. His research in Heterojunction bipolar transistor intersects with topics in Bicmos technology, Electronic engineering, Breakdown voltage and Reliability.

His study connects Wireless and Electrical engineering. His Bipolar junction transistor research incorporates themes from Layer, Epitaxy, Cutoff frequency and Heterojunction. David C. Ahlgren focuses mostly in the field of Silicon-germanium, narrowing it down to matters related to Noise and, in some cases, Radio frequency.

He most often published in these fields:

  • Optoelectronics (67.96%)
  • Heterojunction bipolar transistor (51.46%)
  • Electrical engineering (43.69%)

What were the highlights of his more recent work (between 2005-2009)?

  • Optoelectronics (67.96%)
  • Heterojunction bipolar transistor (51.46%)
  • CMOS (25.24%)

In recent papers he was focusing on the following fields of study:

David C. Ahlgren mostly deals with Optoelectronics, Heterojunction bipolar transistor, CMOS, Electrical engineering and Electronic engineering. His Optoelectronics research is multidisciplinary, incorporating perspectives in Transistor and Miniaturization. His Heterojunction bipolar transistor study combines topics from a wide range of disciplines, such as Breakdown voltage, Bicmos technology, Silicon-germanium, Terahertz radiation and Extremely high frequency.

His Breakdown voltage study incorporates themes from Electric breakdown, Heterojunction and Bipolar junction transistor. As part of the same scientific family, he usually focuses on CMOS, concentrating on Current and intersecting with Doping. In general Electronic engineering, his work in Common emitter and Device simulation is often linked to Base and Vertical scaling linking many areas of study.

Between 2005 and 2009, his most popular works were:

  • Half-terahertz operation of SiGe HBTs (92 citations)
  • On the Performance Limits of Cryogenically Operated SiGe HBTs and Its Relation to Scaling for Terahertz Speeds (42 citations)
  • Gate-Induced-Drain-Leakage Current in 45-nm CMOS Technology (30 citations)

In his most recent research, the most cited papers focused on:

  • Semiconductor
  • Electrical engineering
  • Integrated circuit

Optoelectronics, Heterojunction bipolar transistor, Terahertz radiation, Breakdown voltage and Back end of line are his primary areas of study. His Optoelectronics research incorporates elements of Electrical engineering and Noise figure. In the subject of general Electrical engineering, his work in MOSFET and Voltage is often linked to Node and Electric field, thereby combining diverse domains of study.

His Noise figure research is multidisciplinary, incorporating elements of Operating temperature, Transistor, Miniaturization and Silicon-germanium. The concepts of his Breakdown voltage study are interwoven with issues in Cutoff frequency, Electric breakdown, Frequency response and Cryogenic temperature. His Back end of line study combines topics in areas such as Schottky diode, Diode, Bicmos technology and Bicmos integrated circuits.

Best Publications

  • Self-aligned SiGe NPN transistors with 285 GHz f/sub MAX/ and 207 GHz f/sub T/ in a manufacturable technology

    B. Jagannathan;M. Khater;F. Pagette;J.-S. Rieh

  • SiGe HBTs with cut-off frequency of 350 GHz

    J.-S. Rieh;B. Jagannathan;H. Chen;K.T. Schonenberg

  • Current status and future trends of SiGe BiCMOS technology

    D.L. Harame;D.C. Ahlgren;D.D. Coolbaugh;J.S. Dunn

  • Semiconductor producing method and equipment

    Natzl Weisli C;Arglun David C;Babi Steven G

  • A 0.18 /spl mu/m BiCMOS technology featuring 120/100 GHz (f/sub T//f/sub max/) HBT and ASIC-compatible CMOS using copper interconnect

    A. Joseph;D. Coolbaugh;M. Zierak;R. Wuthrich

  • Half-terahertz operation of SiGe HBTs

    R. Krithivasan;Yuan Lu;J.D. Cressler;Jae-Sung Rieh

  • Foundation of rf CMOS and SiGe BiCMOS technologies

    J. S. Dunn;D. C. Ahlgren;D. Coolbaugh;N. B. Feilchenfeld

  • Status and Direction of Communication Technologies - SiGe BiCMOS and RFCMOS

    A.J. Joseph;D.L. Harame;B. Jagannathan;D. Coolbaugh

  • A 210-GHz f/sub T/ SiGe HBT with a non-self-aligned structure

    S.J. Jeng;B. Jagannathan;J.-S. Rieh;J. Johnson

  • SiGe HBT technology with f/sub max//f/sub T/=350/300 GHz and gate delay below 3.3 ps

    M. Khater;J.-S. Rieh;T. Adam;A. Chinthakindi

  • SiGe heterojunction bipolar transistors and circuits toward terahertz communication applications

    Jae-Sung Rieh;B. Jagannathan;D.R. Greenberg;M. Meghelli

  • Manufacturability demonstration of an integrated SiGe HBT technology for the analog and wireless marketplace

    D.C. Ahlgren;M. Gilbert;D. Greenberg;J. Jeng

  • A simple four-port parasitic deembedding methodology for high-frequency scattering parameter and noise characterization of SiGe HBTs

    Qingqing Liang;J.D. Cressler;Guofu Niu;Yuan Lu

  • A SiGe HBT BiCMOS technology for mixed signal RF applications

    D.C. Ahlgren;G. Freeman;S. Subbanna;R. Groves

  • Transistor design and application considerations for >200-GHz SiGe HBTs

    G. Freeman;B. Jagannathan;Shwu-Jen Jeng;Jae-Sung Rieh

  • SiGe HBTs for millimeter-wave applications with simultaneously optimized f/sub T/ and f/sub max/ of 300 GHz

    J.-S. Rieh;D. Greenberg;M. Khater;K.T. Schonenberg

  • The revolution in SiGe: Impact on device electronics

    D.L Harame;S.J Koester;G Freeman;P Cottrel

  • On the Performance Limits of Cryogenically Operated SiGe HBTs and Its Relation to Scaling for Terahertz Speeds

    Jiahui Yuan;J.D. Cressler;R. Krithivasan;T. Thrivikraman

  • Performance and design considerations for high speed SiGe HBTs of f/sub T//f/sub max/=375 GHz/210 GHz

    Jae-Sung Rieh;B. Jagannathan;Huajie Chen;K. Schonenberg

  • An investigation of the spatial location of proton-induced traps in SiGe HBTs

    J.M. Roldan;Guofu Niu;W.E. Ansley;J.D. Cressler

  • Structure optimization of trench-isolated SiGe HBTs for simultaneous improvements in thermal and electrical performances

    Jae-Sung Rieh;D. Greenberg;Qizhi Liu;A.J. Joseph

  • A 0.13 m BiCMOS technology featuring a 200/280 GHz (fT/fmax) SiGe HBT

    B. A. Orner;Q. Z. Liu;B. Rainey;A. Stricker

Frequent Co-Authors

Gregory G. Freeman
Gregory G. Freeman IBM (United States)
David L. Harame
David L. Harame IBM (United States)
Alvin J. Joseph
Alvin J. Joseph GlobalFoundries (United States)
John D. Cressler
John D. Cressler Georgia Institute of Technology
Robert A. Groves
Robert A. Groves IBM (United States)
Bernard S. Meyerson
Bernard S. Meyerson IBM (United States)
Guofu Niu
Guofu Niu Auburn University
Lawrence E. Larson
Lawrence E. Larson Brown University
Jean-Olivier Plouchart
Jean-Olivier Plouchart IBM (United States)
Steven H. Voldman
Steven H. Voldman Independent Scientist / Consultant, US

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