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Engineering and Technology
China
2026

D-Index & Metrics

Engineering and Technology

D-Index
97
Citations
33694
World Ranking
177
National Ranking
28

Physics

D-Index
98
Citations
33676
World Ranking
1764
National Ranking
28

Research.com Recognitions

  • 2026 - Research.com Engineering and Technology in China Leader Award
  • 2025 - Research.com Engineering and Technology in China Leader Award
  • 2017 - Member of Academia Europaea
  • 2013 - Fellow of American Physical Society (APS) Citation For distinguished contributions to the field of phononics, particularly for conceiving phononic devices like thermal diodes, thermal transistors, logical thermal gates and memories and phonon transport in low dimensional systems

Overview

Baowen Li is affiliated with Southern University of Science and Technology in China. Their research focuses primarily on the fields of Materials Science and Engineering, with extensive work in related subfields including Materials Chemistry, Biomedical Engineering, Civil and Structural Engineering, Electrical and Electronic Engineering, and Mechanical Engineering.

The scientist's work emphasizes several key topics within these fields, notably Thermal properties of materials, Thermal Radiation and Cooling Technologies, Graphene research and applications, Advanced Thermoelectric Materials and Devices, Advanced Sensor and Energy Harvesting Materials, Advanced Thermodynamics and Statistical Mechanics, and Advanced Materials and Mechanics.

Baowen Li has published extensively in various venues, with frequent contributions to:

  • arXiv (Cornell University)
  • Nature Communications
  • Physical Review B
  • Physical Review Applied
  • Materials Today Physics

Recent published papers by Baowen Li include:

  • "Transforming heat transfer with thermal metamaterials and devices," 2021, Nature Reviews Materials
  • "Interfacial thermal resistance: Past, present, and future," 2022, Reviews of Modern Physics
  • "Machine Learning Aided Design and Optimization of Thermal Metamaterials," 2024, Chemical Reviews
  • "Thermal interface materials: From fundamental research to applications," 2024, SusMat
  • "Magic angle in thermal conductivity of twisted bilayer graphene," 2023, Materials Today Physics

The scientist has collaborated frequently with several co-authors, including:

  • Wanlin Guo
  • Xiangying Shen
  • Guimei Zhu
  • Yuyang Long

Baowen Li's achievements have been recognized with awards such as membership in Academia Europaea since 2017. In 2013, they were named a Fellow of the American Physical Society (APS) with a citation highlighting contributions to the field of phononics, including the conception of phononic devices such as thermal diodes, thermal transistors, logical thermal gates, memories, and phonon transport in low dimensional systems.

Best Publications

  • Colloquium : Phononics: Manipulating heat flow with electronic analogs and beyond

    Nianbei Li;Jie Ren;Lei Wang;Gang Zhang

  • Thermal diode: rectification of heat flux.

    Baowen Li;Lei Wang;Giulio Casati;Giulio Casati;Giulio Casati

  • Length-dependent thermal conductivity in suspended single-layer graphene.

    Xiangfan Xu;Luiz F. C. Pereira;Yu Wang;Jing Wu

  • Thermal Conductivity of Polymers and Their Nanocomposites.

    Xiangfan Xu;Jie Chen;Jun Zhou;Baowen Li

  • Negative differential thermal resistance and thermal transistor

    Baowen Li;Lei Wang;Giulio Casati

  • Thermal Logic Gates: Computation with Phonons

    Lei Wang;Baowen Li

  • Transforming heat transfer with thermal metamaterials and devices

    Ying Li;Ying Li;Wei Li;Wei Li;Tiancheng Han;Xu Zheng

  • Experimental demonstration of a bilayer thermal cloak

    Tiancheng Han;Xue Bai;Dongliang Gao;John T. L. Thong

  • Young's modulus of Graphene: a molecular dynamics study

    Jin-Wu Jiang;Jian-Sheng Wang;Baowen Li

  • Thermal memory: a storage of phononic information.

    Lei Wang;Lei Wang;Baowen Li

  • Interface thermal resistance between dissimilar anharmonic lattices.

    Baowen Li;Jinghua Lan;Lei Wang

  • Full control and manipulation of heat signatures: cloaking, camouflage and thermal metamaterials.

    Tiancheng Han;Xue Bai;John T. L. Thong;Baowen Li;Baowen Li

  • Controlling Complex Networks: How Much Energy Is Needed?

    Gang Yan;Jie Ren;Jie Ren;Ying-Cheng Lai;Choy Heng Lai

  • Thermal rectification in asymmetric graphene ribbons

    Nuo Yang;Gang Zhang;Baowen Li

  • Heat conduction in one-dimensional chains

    Bambi Hu;Bambi Hu;Baowen Li;Hong Zhao;Hong Zhao

  • Topological Magnon Insulator in Insulating Ferromagnet

    Lifa Zhang;Jie Ren;Jian-Sheng Wang;Baowen Li;Baowen Li

  • Thermal conductivity of nanotubes revisited: effects of chirality, isotope impurity, tube length, and temperature.

    Gang Zhang;Baowen Li

  • Anomalous heat conduction and anomalous diffusion in one-dimensional systems

    Baowen Li;Jiao Wang

  • Colloquium: Phononic thermal properties of two-dimensional materials

    Xiaokun Gu;Yujie Wei;Xiaobo Yin;Baowen Li

  • Topological nature of the phonon Hall effect.

    Lifa Zhang;Jie Ren;Jian-Sheng Wang;Baowen Li

  • Thermal rectification and negative differential thermal resistance in lattices with mass gradient

    Nuo Yang;Nianbei Li;Lei Wang;Baowen Li

  • Carbon nanocone: A promising thermal rectifier

    Nuo Yang;Gang Zhang;Baowen Li

Frequent Co-Authors

Gang Zhang
Gang Zhang Agency for Science, Technology and Research
Bambi Hu
Bambi Hu University of Houston
Jie Chen
Jie Chen Tongji University
Nuo Yang
Nuo Yang Huazhong University of Science and Technology
John T. L. Thong
John T. L. Thong National University of Singapore
Cheng-Wei Qiu
Cheng-Wei Qiu National University of Singapore
Peter Hänggi
Peter Hänggi University of Augsburg
Jin-Wu Jiang
Jin-Wu Jiang Shanghai University
Ying-Cheng Lai
Ying-Cheng Lai Arizona State University
Boris Podobnik
Boris Podobnik University of Zagreb

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