J. R. Culham works mostly in the field of Telecommunications, limiting it down to topics relating to Channel (broadcasting) and, in certain cases, Electrical engineering, as a part of the same area of interest. Electrical engineering is closely attributed to Channel (broadcasting) in his work. Many of his studies on Mechanics involve topics that are commonly interrelated, such as Flow (mathematics). His study brings together the fields of Mechanics and Flow (mathematics). Much of his study explores Thermodynamics relationship to Shape optimization. With his scientific publications, his incorporates both Shape optimization and Finite element method. His studies link Orthotropic material with Finite element method. J. R. Culham conducted interdisciplinary study in his works that combined Heat transfer and Pressure drop. His work often combines Pressure drop and Heat transfer studies.
Composite material connects with themes related to Fin, Layer (electronics) and Thermal conduction in his study. The study of Layer (electronics) is intertwined with the study of Composite material in a number of ways. His Mechanics study frequently draws connections between related disciplines such as Natural convection. J. R. Culham integrates many fields, such as Thermodynamics and Isothermal process, in his works. In his works, he performs multidisciplinary study on Heat transfer and Heat transfer coefficient. His Thermal study frequently intersects with other fields, such as Thermal resistance. Many of his studies on Thermal resistance apply to Thermal as well. His Mechanical engineering study frequently draws connections to adjacent fields such as Heat sink. His Heat sink study frequently links to other fields, such as Mechanical engineering.
J. R. Culham conducts interdisciplinary study in the fields of Thermodynamics and Diffusion through his research. J. R. Culham incorporates Diffusion and Thermodynamics in his research. Mechanics and Mechanical engineering are two areas of study in which J. R. Culham engages in interdisciplinary work. J. R. Culham performs integrative Mechanical engineering and Mechanics research in his work. J. R. Culham merges many fields, such as Porous medium and Porosity, in his writings. In his articles, he combines various disciplines, including Porosity and Porous medium. Composite material and Layer (electronics) are frequently intertwined in his study. J. R. Culham regularly ties together related areas like Composite material in his Layer (electronics) studies. He undertakes multidisciplinary investigations into Heat transfer and Heat flux in his work.
This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.
ANALYTICAL FORCED CONVECTION MODELING OF PLATE FIN HEAT SINKS
P. Teertstra;M. M. Yovanovich;J. R. Culham.
Journal of Electronics Manufacturing (2000)
Convection heat transfer from tube banks in crossflow: Analytical approach
W.A. Khan;J.R. Culham;M.M. Yovanovich.
International Journal of Heat and Mass Transfer (2006)
Pressure Drop of Fully-Developed, Laminar Flow in Microchannels of Arbitrary Cross-Section
M. Bahrami;M. M. Yovanovich;J. R. Culham.
Journal of Fluids Engineering-transactions of The Asme (2006)
Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux Channels
Y. S. Muzychka;J. R. Culham;M. M. Yovanovich.
Journal of Electronic Packaging (2003)
Optimization of plate fin heat sinks using entropy generation minimization
W.A. Khan;J.R. Culham;M.M. Yovanovich.
IEEE Transactions on Components and Packaging Technologies (2001)
Pressure Drop of Fully-Developed, Laminar Flow in Microchannels of Arbitrary Cross-Section
M. Bahrami;M. M. Yovanovich;J. R. Culham.
ASME 3rd International Conference on Microchannels and Minichannels, Parts A and B (2005)
Spreading Resistance of Isoflux Rectangles and Strips on Compound Flux Channels
M. M. Yovanovich;Y. S. Muzychka;J. R. Culham.
Journal of Thermophysics and Heat Transfer (1999)
Analytical forced convection modeling of plate fin heat sinks
P. Teertstra;M.M. Yovanovich;J.R. Culham;T. Lemczyk.
semiconductor thermal measurement and management symposium (1999)
Optimization of microchannel heat sinks using entropy generation minimization method
W.A. Khan;M.M. Yovanovich;J.R. Culham.
semiconductor thermal measurement and management symposium (2006)
Calculating interface resistance
M. M. Yovanovich;J. R. Culham;P. Teertstra.
(2004)
If you think any of the details on this page are incorrect, let us know.
We appreciate your kind effort to assist us to improve this page, it would be helpful providing us with as much detail as possible in the text box below:
University of Waterloo
Prince Mohammad bin Fahd University
Memorial University of Newfoundland
Stellenbosch University
Polytechnic University of Milan
BlackRock (United States)
University of California, San Diego
University of Ulm
University of Extremadura
University of Camerino
University of Bologna
Icahn School of Medicine at Mount Sinai
Tohoku University
University of Sydney
International Centre for Genetic Engineering and Biotechnology
University of Tasmania
Institute of Atmospheric Sciences and Climate
University of Melbourne
University of Porto
Spanish National Research Council