Duane S. Boning is affiliated with MIT in the United States and has a research portfolio spanning engineering and computer science with a focus on electrical and electronic engineering as well as artificial intelligence. Their work crosses several subfields including biomedical engineering, statistics, probability and uncertainty, and signal processing.
The primary topics addressed in their research include:
Boning's collaborations involve frequent coauthors such as Zhengqi Gao, Zhengxing Zhang, Fan-Keng Sun, Uttara Chakraborty, and Wim Bogaerts.
The main publication venues for their work include:
Notable recent papers include:
Duane S. Boning was awarded the IEEE Fellow in 2005 for contributions to modeling and control in semiconductor manufacturing.
Tsui-Wei Weng;Huan Zhang;Hongge Chen;Zhao Song
B.E. Stine;D.S. Boning;J.E. Chung
Michael Orshansky;Sani Nassif;Duane Boning
T.H. Smith;D.S. Boning
B.E. Stine;D.S. Boning;J.E. Chung;L. Camilletti
D. Boning;W. Moyne;T. Smith;J. Moyne
Huan Zhang;Hongge Chen;Chaowei Xiao;Sven Gowal
D.O. Ouma;D.S. Boning;J.E. Chung;W.G. Easter
B.E. Stine;D.O. Ouma;R.R. Divecha;D.S. Boning
Vikas Mehrotra;Shiou Lin Sam;Duane Boning;Anantha Chandrakasan
Huan Zhang;Hongge Chen;Chaowei Xiao;Bo Li
D.S. Boning;P.K. Mozumder
D. Ouma;D. Boning;J. Chung;G. Shin
Huan Zhang;Hongge Chen;Zhao Song;Duane S. Boning
V. Mehrotra;D. Boning
T.H. Smith;D.S. Boning;J. Stefani;S.W. Butler
Brian E. Goodlin;Duane S. Boning;Herbert H. Sawin;Barry M. Wise
D.A. White;B.E. Goodlin;A.E. Gower;D.S. Boning
D.A. White;D. Boning;S.W. Butler;G.G. Barna
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Hongge Chen;Huan Zhang;Duane S. Boning;Cho-Jui Hsieh
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