Ranking & Metrics Conference Call for Papers Other Conferences in United States
Electronics Packaging Technology Conference (EPTC)

Electronics Packaging Technology Conference (EPTC)

Singapore, Singapore

Submission Deadline: Thursday 30 Jun 2022

Conference Dates: Dec 07, 2022 - Dec 09, 2022

Research
Impact Score 0.60

OFFICIAL WEBSITE

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Ranking & Metrics Impact Score is a novel metric devised to rank conferences based on the number of contributing the best scientists in addition to the h-index estimated from the scientific papers published by the best scientists. See more details on our methodology page.

Research Impact Score: 0.60
Contributing Best Scientists: 14
H5-index:
Papers published by Best Scientists 23
Research Ranking (Electronics and Electrical Engineering) 672
Research Ranking (Materials Science) 118

Conference Call for Papers

You are invited to submit an abstract between 500–750 words long and clearly state the purpose, methodology, results (which must include data, drawings, graphs and photographs) and conclusions of the work. Additional details on abstracts submission can be found on the EPTC website. Abstracts must be received by July 15, 2022. Your submission must be cleared by your management and co-authors as applicable and include the authors' affiliations and e-mail addresses. All submissions should be made in English, either in pdf or MS Words format. Please select the appropriate technical committee as per your abstract content from the drop-down list so that the right technical committee can evaluate your submission for acceptance. Accepted abstracts will be notified for the full paper submission with instructions for publication by August 1, 2022. At the discretion of the technical committee, submitted abstracts may be considered for interactive presentation. The final manuscript for publication in the conference proceedings is due on September 10, 2022. The conference proceeding is an official IEEE publication, and the accepted papers that are registered and presented (oral & interactive) will be available in IEEE Xplore.

Overview

Top Research Topics at Electronics Packaging Technology Conference?

  • Composite material (29.61%)
  • Electronic engineering (25.23%)
  • Soldering (21.68%)

Electronics Packaging Technology Conference generally zeroes in on subjects such as Composite material, Electronic engineering, Soldering, Metallurgy and Optoelectronics. Aside from discussions in Composite material, the conference also deals with the subject of Wire bonding which intersects with Aluminium disciplines. The research on Electronic engineering featured in it combines topics in other fields like Mechanical engineering, Die (integrated circuit), Integrated circuit packaging, Chip and Interconnection.

Electronics Packaging Technology Conference features Mechanical engineering research that overlaps with concepts in Finite element method. Electronics Packaging Technology Conference addresses concerns in Soldering which are intertwined with other disciplines, such as Reliability (semiconductor), Temperature cycling and Flip chip. The study on Flip chip presented in Electronics Packaging Technology Conference intersects with the topics under Chip-scale package.

It concentrates on Metallurgy topics that focus on Copper, Intermetallic, Microstructure, Tin and Alloy. It dives deep in exploring the relationship between the study of Optoelectronics and Electrical engineering. Wafer-level packaging, Wafer bonding and Wafer dicing are among the concentrations of Wafer that garnered much attention in Electronics Packaging Technology Conference.

What are the most cited papers published at the conference?

  • Embedded wafer level ball grid array (eWLB) (183 citations)
  • Embedded Wafer Level Ball Grid Array (eWLB) (128 citations)
  • Mixed-mode S-parameter characterization of differential structures (111 citations)

Research areas of the most cited articles at Electronics Packaging Technology Conference:

The published articles generally zeroe in on subjects such as Electronic engineering, Soldering, Metallurgy, Composite material and Integrated circuit packaging. In addition to Electronic engineering research, the conference papers aim to explore topics under Ball grid array, Mechanical engineering, Chip, Through-silicon via and Printed circuit board. The conference articles tackle studies in Interconnection and the interrelated subject of Die (integrated circuit) and Silicon to gain insights into Composite material.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

Research.com

The top authors publishing at Electronics Packaging Technology Conference (based on the number of publications) are:

  • John H. Lau (23 papers) published 2 papers at the last edition, 1 more than at the previous edition,
  • Xiaowu Zhang (17 papers) published 3 papers at the last edition, 3 less than at the previous edition,
  • V. Kripesh (10 papers) absent at the last edition,
  • Changqing Liu (10 papers) absent at the last edition,
  • Sung-Mao Wu (10 papers) published 6 papers at the last edition, 3 more than at the previous edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Research.com

Only papers with recognized affiliations are considered

The top affiliations publishing at Electronics Packaging Technology Conference (based on the number of publications) are:

  • Agency for Science, Technology and Research (63 papers) published 19 papers at the last edition, 5 less than at the previous edition,
  • Nanyang Technological University (28 papers) published 4 papers at the last edition, 4 less than at the previous edition,
  • Freescale Semiconductor (21 papers) absent at the last edition,
  • Loughborough University (16 papers) absent at the last edition,
  • Infineon Technologies (16 papers) published 6 papers at the last edition, 4 less than at the previous edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Research.com

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

Research.com

During the most recent 2017 edition, 16.89% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 29.27% were posted by at least one author from the top 10 institutions publishing at the conference. Another 18.70% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 17.07% of all publications and 34.96% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Research.com

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

Research.com

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

Research.com

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

Research.com

Other Conferences in Singapore

49th Annual Conference of the IEEE Industrial Electronics Society

Oct 16, 2023 - Oct 19, 2023

Singapore, Singapore

Deadline: Sunday 30 Apr 2023

International Conference on Materials for Advanced Technologies

Jun 26, 2023 - Jun 30, 2023

Singapore City, Singapore

Deadline: Monday 02 Jan 2023

Previous Editions

23rd Electronics Packaging Technology Conference

Dec 01, 2021 - Dec 03, 2021

Online

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