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IEEE

Electronics Packaging Technology Conference (EPTC) (EPTC)

Location: Singapore , Singapore

Conference dates: 12/7/2022 - 12/9/2022

Research H-index
6

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Materials Science 73 36 51 3
Electronics and Electrical Engineering 520 16 38 4
Engineering and Technology 277 9 15 3

Call for Papers

You are invited to submit an abstract between 500–750 words long and clearly state the purpose, methodology, results (which must include data, drawings, graphs and photographs) and conclusions of the work. Additional details on abstracts submission can be found on the EPTC website. Abstracts must be received by July 15, 2022. Your submission must be cleared by your management and co-authors as applicable and include the authors' affiliations and e-mail addresses. All submissions should be made in English, either in pdf or MS Words format. Please select the appropriate technical committee as per your abstract content from the drop-down list so that the right technical committee can evaluate your submission for acceptance. Accepted abstracts will be notified for the full paper submission with instructions for publication by August 1, 2022. At the discretion of the technical committee, submitted abstracts may be considered for interactive presentation. The final manuscript for publication in the conference proceedings is due on September 10, 2022. The conference proceeding is an official IEEE publication, and the accepted papers that are registered and presented (oral & interactive) will be available in IEEE Xplore.

Overview

This ranking presents a comprehensive list of scientific conferences within the field of Engineering and Technology. Compiled by Research.com, a leading authority in science research across all major disciplines and a trusted provider of scientific data since 2014, this ranking is the result of an exhaustive and meticulous analysis of scholarly activity and impact within the domain.

The position of each conference in the ranking is determined by a unique bibliometric score developed by Research.com. This metric takes into account both the estimated h-index and the number of leading scientists who have participated in each conference during the previous three years, offering a nuanced and reliable measure of influence and prestige within the scientific community.

The Impact Score values reported in this ranking were gathered as of 2024-11-27, ensuring all information is up-to-date and reflective of the most recent advancements. The process of ranking conferences involved the detailed examination of more than 2,262 events, rigorously selected from an initial pool based on a comprehensive review of over 26,934 scientific documents published by 9,385 leading and well-respected scientists in Engineering and Technology over the last three years.

This rigorous and scientifically grounded approach underscores the credibility of the ranking and highlights the depth of research and expert analysis that underpin it. For further details about the methodology employed in computing the ranking scores, please refer to our Methodology Page.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing at Electronics Packaging Technology Conference (based on the number of publications) are:

  • John H. Lau (23 papers) published 2 papers at the last edition, 1 more than at the previous edition,
  • Xiaowu Zhang (17 papers) published 3 papers at the last edition, 3 less than at the previous edition,
  • V. Kripesh (10 papers) absent at the last edition,
  • Changqing Liu (10 papers) absent at the last edition,
  • Sung-Mao Wu (10 papers) published 6 papers at the last edition, 3 more than at the previous edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing at Electronics Packaging Technology Conference (based on the number of publications) are:

  • Agency for Science, Technology and Research (63 papers) published 19 papers at the last edition, 5 less than at the previous edition,
  • Nanyang Technological University (28 papers) published 4 papers at the last edition, 4 less than at the previous edition,
  • Freescale Semiconductor (21 papers) absent at the last edition,
  • Loughborough University (16 papers) absent at the last edition,
  • Infineon Technologies (16 papers) published 6 papers at the last edition, 4 less than at the previous edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2017 edition, 16.89% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 29.27% were posted by at least one author from the top 10 institutions publishing at the conference. Another 18.70% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 17.07% of all publications and 34.96% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

Related Online Degrees & Career Pathways

For students interested in Electronics and Electrical Engineering, exploring related online degrees can provide flexible and affordable education options. Many platforms offer programs through the cheapest self-paced online college options, allowing learners to study at their own speed without compromising quality.

Applying for these programs is often streamlined, especially with institutions listed among the online colleges no application fee, significantly reducing the barriers to starting a new educational journey in technical fields like electronics or electrical engineering.

Additionally, interdisciplinary knowledge is increasingly valuable. Related healthcare technology fields such as medical billing and coding offer career pathways that combine technical skills with administrative expertise, broadening employment opportunities.

For those considering a blend of healthcare and technology, programs transitioning from ma to lpn provide practical advancement options, which can complement engineering and technical backgrounds through understanding medical instrumentation and support.

Best Scientists who published in this Conference