Advanced Semiconductor Manufacturing Conference (ASMC)

ASMC 2023 Call for Paper Topics
AM: Advanced Metrology
Development of new metrology techniques and methodologies; in-situ monitoring
methods; metrology for process control; measuring critical dimensions, overlay, films;
metrology of next-generation materials, processes and architectures (TSV, FinFETs,
EUV, etc.); scatterometry with reflectometry or ellipsometry; pros and cons of
machine learning in measurement signal analysis wide-bandgap semiconductors;
novel extension of existing metrology tools as well as evaluation of upcoming
measurement technologies to meet HVM requirements.
AEPM: Advanced Equipment Processes and Materials
Development of new front- and back-end processes; characterization and integration
of barrier layers, advanced gates, high-K and low-K dielectrics, isolators, optical and
conducting materials; evaluation of novel substrates; methodologies for driving new
materials from R&D to mass production.
AP/DFM: Advanced Patterning / Design for Manufacturability
Immersion, double/multiple patterning, and EUV lithography; advanced resolution
enhancement techniques; source/mask optimization; alignment and overlay
enhancement solutions; edge placement error measurement; advanced reticles;
alternative patterning methods; directed self-assembly; feedforward control
solutions; high versus low volume manufacturing effects on lithography processes;
computational lithography; process models and process model files; optical proximity
correction and verification; design rule creation and verification; DFM in support of
yield learning through product cycle; early manufacturing involvement; integrated
product and process development (IPPD).
APC: Advanced Process Control
Advanced control techniques such as run-to-run control; model-based control; nonlinear control methods; application of advanced statistical methods to control;
advanced SPC techniques; fault detection and classification (FDC); virtual metrology;
machine learning and artificial intelligence (ML/AI) monitoring and control.
CFM: Contamination Free Manufacturing
Backside contamination, ultraclean technologies, materials, control of minienvironments, FOUP cleanliness and control, vibration monitoring, vibration control,
wafer and reticle carriers/transport, ESD control, EUV lithography.
DM: Big Data Management and Mining
Fab and test floor data collection methods and analysis; data format, volume and
interface challenges; fast drill-down to problem tools and sources; foundry-to-fabless
data transfers and information issues; new visualization methods for improved data
understanding; applying data mining techniques and machine learning based
approaches to isolate and utilize critical information from large data volumes; data
ownership.
DI: Defect Inspection and Reduction
New brightfield, darkfield, e-beam and other techniques and technologies for costeffective yield control; process development using defect detection and management;
new methodologies for detection, characterization, classification and disposition of
defect counts, types and distributions; diagnostic techniques to correlate in-line
inspection results to product yield and defectivity.
DP: Discrete and Power Devices
Solutions manufacturers facing challenges other than smallest feature sizes, including
analog/mixed-signal applications for automotive devices, power management and
display drivers, RF communications, and wireless charging.
EO: EquipmentOptimization
Efficiency/productivity measurements; optimizing and extending fab productivity
within the framework of existing wafer sizes; cycle time reduction; cost reduction;
best practices; customer-supplier continuous improvement programs; CMP
Development; high mix/high-volume factories with high-equipment productivity;
small-lot manufacturing and single-wafer/mini batch tools; fab conversions;
integration of factory control systems into complete supply chain.
FA: Factory Automation
Automation in fab; probe; assembly and test factories; e-diagnostics;
e-manufacturing; WIP management; scheduling; planning; logistics; modeling;
productivity; supply chain management; manufacturing performance; capacity,
metrics, supply/demand management; deployment, cycle time and time-to-market;
fully automated factory and remote operation center equipment and equipment
interfaces; data collection interfaces; automated material handling systems (AMHS)
challenges and carriers; standards and standardization.
FE: The Fabless Experience
Challenges faced by fabless semiconductor companies; integrating material from
multiple sources; strategies for managing risk due to supply shortages and out of spec.
parts; foundry strategies for effectively supplying many customers; foundry methods
for controlling costs for small orders; related topics of general interest to fabless
semiconductor companies or foundries.
GF: Green Factory
The role of environment; health and safety; emissions and effluents control; energy
saving; recycling; safety and health; community involvement; ergonomics; zero
emission; global environment protection; waste reduction; sustainability.
IE: Industrial Engineering
Facilities design and layout; equipment design and AMHS interactions; manufacturing
systems design; statistics/quality; computer modeling; simulation; systems
management; human factors in engineering; financial decision making; cost reduction;
supply chain.
ISD: Innovative Silicon Devices and Processes
MEMS, PCM, silicon photonics, magnetic heads, micro displays, sensors, DLP, MRAM,
organic semiconductor, silicon modulators, novel structures, carbon nanotube,
graphene, interconnects; novel and emerging applications of existing process
techniques, quantum computing and sensors, radiation imaging, harsh environment,
nanowires.
LM: Lean Manufacturing
Establishing flow; standards and standard work; value stream mapping; Kaizen;
Kaikaku; cycle times; WIP; 5S; continuous improvement; metrics, training within
industry (TWI); waste reduction.
NS/NC: Non-silicon and Non-CMOS
SiC, GaN, GaAs, glass and quartz wafers, heterogenous devices, sub-200-mm
manufacturing, analog/mixed signals, power devices, automotive, power management,
flexible substrates, display drivers
SM: Smart Manufacturing
Smart manufacturing systems, equipment and technologies; supply chain modeling
and networks; system integration for manufacturing integration; crowdsourcing design
for manufacturing; manufacturing process simulation and optimization; information
technology; smart and intelligent manufacturing processes; cloud-enabled
manufacturing systems and applications; industrial Internet of Things; next-generation
robotics/automation; measurement and systems monitoring; business, health & safety,
processes, and cost learnings.
YE: Yield Enhancement/Learning
Yield analysis tools and methods, including identifying root cause of yield loss and
reliability fails; failure analysis; defect-to-yield correlation; zonal and spatial pattern
analysis; slot signature analysis; use of volume diagnostics for pinpointing net failures;
determination of critical particle size and types.
YM: Yield Methodologies
Yield monitoring and modeling accuracy; model types; critical area extraction
techniques; yield-targeted data mining; modeling of systematic and parametric yield;
process sector analysis; short-flow yield programs, machine learning and artificial
intelligence (ML/AI) based algorithms.
3D/TSV: Packaging and Through Silicon Via
3D integration in general and associated topics like wire bonding, flip chip bonding
(bump metallization), micro-bump bonding, C4 New Process, through wafer vias,
silicon carrier; Novel approaches to global/local interconnect issues, power delivery,
thermal management, and high-density interconnects.
WFD: Workforce Development
Soliciting abstracts on workforce development. Contributions from thought leaders,
hiring managers and HR professionals regarding best practices, case studies and
industry/academia/government partnerships to create a workforce to address current
and future workforce needs throughout the semiconductor manufacturing supply
chain are welcome. Abstracts related to opportunities and challenges in talent
acquisition, hiring and retention, including development of a diverse and inclusive
workforce, Organizational Learning; Training Methodologies; Retirement & Knowledge
Transition; Systematic Cross-Training for Out-of-Industry; College, Education and
Industry Co-Development are encouraged.