What is he best known for?
The fields of study he is best known for:
- Composite material
- Quantum mechanics
- Polymer
His main research concerns Composite material, Indentation, Fracture mechanics, Fracture and Toughness.
His work on Silicon expands to the thematically related Composite material.
His Indentation study combines topics in areas such as Stress, Cracking, Brittleness, Mineralogy and Modulus.
His research integrates issues of Residual stress and Ceramic in his study of Fracture mechanics.
His studies in Fracture integrate themes in fields like Deformation, Flexural strength, Strength of materials and Forensic engineering.
His Toughness course of study focuses on Fracture toughness and Composite number, Annealing and Silicon carbide.
His most cited work include:
- Direct Observation and Analysis of Indentation Cracking in Glasses and Ceramics (832 citations)
- Amorphization and conductivity of silicon and germanium induced by indentation. (345 citations)
- Mechanical behavior of alumina-silicon carbide «Nanocomposites» (298 citations)
What are the main themes of his work throughout his whole career to date?
Robert F. Cook mostly deals with Composite material, Indentation, Fracture, Fracture mechanics and Toughness.
His research on Composite material frequently connects to adjacent areas such as Silicon.
Robert F. Cook has researched Indentation in several fields, including Residual stress, Cracking, Raman spectroscopy, Brittleness and Modulus.
His Fracture study combines topics from a wide range of disciplines, such as Ultimate tensile strength, Flexural strength, Mineralogy and Forensic engineering.
His Fracture mechanics research is within the category of Structural engineering.
His work carried out in the field of Toughness brings together such families of science as Composite number and Microstructure.
He most often published in these fields:
- Composite material (57.60%)
- Indentation (35.69%)
- Fracture (20.85%)
What were the highlights of his more recent work (between 2013-2021)?
- Composite material (57.60%)
- Indentation (35.69%)
- Fracture (20.85%)
In recent papers he was focusing on the following fields of study:
The scientist’s investigation covers issues in Composite material, Indentation, Fracture, Raman spectroscopy and Silicon.
His Composite material research is multidisciplinary, relying on both Crystallography and Microscale chemistry.
His Indentation research is multidisciplinary, incorporating elements of Material properties, Deformation, Brittleness, Inert and Toughness.
His research in Fracture intersects with topics in Mechanical engineering, Statistical physics and Fracture mechanics.
Robert F. Cook combines subjects such as Deformation mechanism, Electron backscatter diffraction, Amorphous silicon and Microscopy with his study of Raman spectroscopy.
His Silicon study incorporates themes from Cubic zirconia, Nano-, Polycrystalline silicon and Crystallite.
Between 2013 and 2021, his most popular works were:
- The compelling case for indentation as a functional exploratory and characterization tool (55 citations)
- Fracture strength of micro- and nano-scale silicon components (51 citations)
- Mechanical measurements of heterogeneity and length scale effects in PEG-based hydrogels (22 citations)
In his most recent research, the most cited papers focused on:
- Quantum mechanics
- Composite material
- Polymer
His primary areas of study are Indentation, Composite material, Raman spectroscopy, Nanoindentation and Crystallography.
Robert F. Cook interconnects Rheology, Poromechanics, Hyperelastic material, Deformation and Self-healing hydrogels in the investigation of issues within Indentation.
His study in the field of Toughness, Fracture and Viscoelasticity is also linked to topics like Materials design and Scale effects.
The various areas that he examines in his Toughness study include Brittleness, Inert, Cracking and Ceramic.
The study incorporates disciplines such as Residual stress and Fracture mechanics in addition to Fracture.
His study in Raman spectroscopy is interdisciplinary in nature, drawing from both Deformation mechanism, Silicon and Microscopy.
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