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IEEE

International Workshop on Thermal Investigations of ICs and Systems (Therminic 2022) (THERMINIC)

Location: Dublin , Ireland

Submission deadline: 4/22/2022

Conference dates: 9/28/2022 - 9/30/2022

Research H-index
5

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Materials Science 138 8 9 2
Electronics and Electrical Engineering 521 16 18 4
Engineering and Technology 572 6 8 1
Mechanical and Aerospace Engineering 98 6 10 2

Call for Papers

We invite delegates to consider submitting abstracts that are related, but not limited to, the following topics:

Thermal Phenomena in Simulation & Experiment:
• Thermal management of electronic components and systems
• Classical and modern thermometry and thermography
• Thermal interface materials and their characterisation
• Thermal modelling and investigation of packages
• Nano-scale heat transfer
• Multi-physics simulation and field coupling
• Electro-thermal modelling and simulation
• CFD modelling and benchmarking
• Advanced thermal materials and technologies
• Numerical methods for multi-scale heat transfer

Electronics Cooling Concepts & Applications:
• Cooling concepts: air, liquid, 2-phase, etc.
• Power electronics
• High temperature electronics
• Solid state lighting / LEDs
• Thermo-electric and sub-ambient cooling
• Novel and advanced cooling technologies
• Heat pipe and vapour chambers
• 3D heterogenous integration and cooling
• Ultra low form factor air cooling
• Novel manufacturing methods
• Cooling for IoT, CPS, mobile, edge computing
• Thermal buffering for computational sprinting
• Battery thermal management

Thermo-Mechanical Reliability
• Thermo-mechanical reliability
• Prognostics and health monitoring
• Lifetime modelling and prediction
• Damage and fracture mechanics
• Failure analysis and inline inspection by thermal imaging

The technical Programme will include oral talks, poster presentations, special sessions and invited keynote talks given by renowned speakers. This time, we will again offer professional development courses (PDCs) on the day before the workshop.
Authors are invited to submit an abstract describing recent work. Abstracts must detail the objectives of the work presented and demonstrate new results. All abstracts will be double-blind reviewed. There will be best paper and best poster awards.

Please, refer to the www.therminic2022.eu web page for information on past THERMINIC workshops. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. THERMINIC papers can be searched through IEEE, Google scholar and other search engines. Vendors and Book Exhibitors are invited to offer products in the scope of the Workshop. Exhibitor space is available – please contact local committee for further details. Editors are invited to exhibit books.

Important Dates:
Deadline abstract submission: extended to April 22, 2022
Notification of acceptance: 3rd June 2022
Submission of paper for workshop proceedings: 22nd July 2022
Please check the Workshop website for details on hotel bookings and travel arrangements.

Overview

This comprehensive ranking presents a curated list of scientific conferences in the field of Engineering and Technology. The ranking has been meticulously prepared by Research.com, a leading platform known for providing trusted data on scientific contributions across all major fields, with a proven track record in Engineering and Technology research analytics since 2014.

The position of each conference in this ranking is determined by a distinctive bibliometric score developed by Research.com experts. This unique score is computed by integrating the estimated h-index and the number of prominent scientists who have participated in the conference over the previous three years. The combination of these metrics offers a robust assessment of the conference’s scientific impact and the quality of its contributors.

Impact Score values used in the ranking were systematically gathered on 2024-11-27, ensuring that the most recent and relevant data inform the evaluation process. The ranking methodology involved an intensive review of more than 2,262 conferences, each rigorously selected following a detailed scrutiny of over 26,934 scientific documents published in the last three years alone. This exhaustive analysis was conducted with input from 9,385 leading and highly respected scientists within the area of Engineering and Technology.

For readers seeking in-depth information about the calculation methods and criteria applied in establishing these ranking scores, a thorough explanation can be found on our Methodology Page.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing at International Workshop on Thermal Investigations of ICs and Systems (based on the number of publications) are:

  • Bernhard Wunderle (43 papers) published 3 papers at the last edition the same number as at the previous edition,
  • Daniel May (31 papers) published 3 papers at the last edition, 1 more than at the previous edition,
  • Andras Poppe (30 papers) absent at the last edition,
  • Lorenzo Codecasa (26 papers) published 2 papers at the last edition, 2 less than at the previous edition,
  • Andrzej Napieralski (23 papers) absent at the last edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing at International Workshop on Thermal Investigations of ICs and Systems (based on the number of publications) are:

  • Budapest University of Technology and Economics (84 papers) published 4 papers at the last edition the same number as at the previous edition,
  • Chemnitz University of Technology (33 papers) published 2 papers at the last edition, 1 less than at the previous edition,
  • Mentor Graphics (25 papers) absent at the last edition,
  • Fraunhofer Society (23 papers) published 1 paper at the last edition the same number as at the previous edition,
  • Polytechnic University of Milan (23 papers) published 2 papers at the last edition, 2 less than at the previous edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2020 edition, 23.26% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 27.27% were posted by at least one author from the top 10 institutions publishing at the conference. Another 21.21% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 24.24% of all publications and 27.27% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

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Best Scientists who published in this Conference