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Materials Science

D-Index
40
Citations
10094
World Ranking
12778
National Ranking
2934

Overview

Mukul Kumar is affiliated with the Lawrence Livermore National Laboratory in the United States. Their academic focus lies primarily in the broad fields of engineering and materials science, with a specialization in mechanical engineering and materials chemistry. Their research also extends into plant science, mechanics of materials, and geophysics.

Their research topics cover several technical areas, including:

  • High-velocity impact and material behavior
  • Microstructure and mechanical properties
  • Cellular and composite structures
  • High-pressure geophysics and materials
  • Titanium alloys microstructure and properties
  • Additive manufacturing and 3D printing technologies
  • Welding techniques and residual stresses

Kumar has published numerous papers with a focus on material behavior under different conditions, microstructural analysis, and manufacturing processes. Some notable recent publications include:

  • "Microstructure, texture, mean free path of dislocations and mechanical properties of Ti-6Al-4V alloy during uniaxial compression at elevated temperatures" (2020) in Materials Science and Engineering A
  • "Incorporating defects into model predictions of metal lattice-structured materials" (2021) in Materials Science and Engineering A
  • "High-rate strength response of tantalum from dynamic hole closure experiments" (2022) in Journal of Applied Physics
  • "A description of structured waves in shock compressed particulate composites" (2020) in Journal of Applied Physics
  • "Comparing Scanning Electron Microscope and Transmission Electron Microscope Grain Mapping Techniques Applied to Well-Defined and Highly Irregular Nanoparticles" (2020) in ACS Omega

Thevenues where Kumar most frequently publishes include:

  • Journal of Applied Physics
  • Materials Today Proceedings
  • AIP Conference Proceedings
  • Materials Science and Engineering A
  • Journal of Materials Engineering and Performance

Kumar commonly collaborates with several researchers, including:

  • Jonathan Lind
  • David B. Bober
  • R. Vinjamuri
  • R.K. Sabat
  • Nathan R. Barton

Best Publications

  • Electron Backscatter Diffraction in Materials Science

    Adam J. Schwartz;Mukul Kumar;Brent L. Adams;David P. Field

  • An Experimental Investigation into Additive Manufacturing-Induced Residual Stresses in 316L Stainless Steel

    Amanda S. Wu;Donald W. Brown;Mukul Kumar;Gilbert F. Gallegos

  • Probing the Active Surface Sites for CO Reduction on Oxide-Derived Copper Electrocatalysts

    Arnau Verdaguer-Casadevall;Christina W. Li;Tobias P. Johansson;Soren B. Scott

  • Electron Backscatter Diffraction in Materials Science

    Unknown

  • Grain-boundary engineering markedly reduces susceptibility to intergranular hydrogen embrittlement in metallic materials

    Sabine Bechtle;Sabine Bechtle;Mukul Kumar;Brian P. Somerday;Maximilien E. Launey

  • Modifications to the microstructural topology in f.c.c. materials through thermomechanical processing

    Mukul Kumar;Wayne E. King;Adam J. Schwartz

  • Analysis of grain boundary networks and their evolution during grain boundary engineering

    Christopher A. Schuh;Mukul Kumar;Wayne E. King

  • Microstructural evolution during grain boundary engineering of low to medium stacking fault energy fcc materials

    Mukul Kumar;Adam J. Schwartz;Wayne E. King

  • Grain boundary energy function for fcc metals

    Vasily V. Bulatov;Bryan W. Reed;Mukul Kumar

  • Analysis of local orientation gradients in deformed single crystals

    D.P. Field;P.B. Trivedi;S.I. Wright;M. Kumar

  • High-Cycle Fatigue of Nickel-Based Superalloy ME3 at Ambient and Elevated Temperatures: Role of Grain-Boundary Engineering

    Yong Gao;R. O. Ritchie;Mukul Kumar;R. K. Nalla

  • High-cycle fatigue of nickel-base superalloy Rene ´ 104 (ME3): Interaction of microstructurally small cracks with grain boundaries of known character

    Yong Gao;J.S. Stölken;Mukul Kumar;R.O. Ritchie

  • Connectivity and percolation in simulated grain-boundary networks

    Christopher A. Schuh;Roger W. Minich;Mukul Kumar

  • Present State of Electron Backscatter Diffraction and Prospective Developments

    Robert A. Schwarzer;David P. Field;Brent L. Adams;Mukul Kumar

  • Atomistic modeling of shock-induced void collapse in copper

    L. P. Davila;Paul Erhart;E. M. Bringa;M. A. Meyers

  • Materials science under extreme conditions of pressure and strain rate

    B. A. Remington;G. Bazan;J. Belak;E. Bringa

  • Mathematical methods for analyzing highly-twinned grain boundary networks

    Bryan Walter Reed;Mukul Kumar

  • Universal features of grain boundary networks in FCC materials

    C. A. Schuh;M. Kumar;W. E. King

  • The α→ϵ phase transition in iron at strain rates up to ∼109 s−1

    Jonathan C. Crowhurst;Bryan W. Reed;Michael R. Armstrong;Harry B. Radousky

  • Surface grain boundary engineering of Alloy 600 for improved resistance to stress corrosion cracking

    Abhishek Telang;Amrinder S. Gill;Deepthi Tammana;Xingshuo Wen

  • Atomistic mechanism of shock-induced void collapse in nanoporous metals

    Paul Erhart;Eduardo M. Bringa;Mukul Kumar;Karsten Albe

Frequent Co-Authors

Wayne E. King
Wayne E. King Lawrence Livermore National Laboratory
Kevin J. Hemker
Kevin J. Hemker Johns Hopkins University
Eduardo M. Bringa
Eduardo M. Bringa National University of Cuyo
K.T. Ramesh
K.T. Ramesh Johns Hopkins University
Marc A. Meyers
Marc A. Meyers University of California, San Diego
Vijay K. Vasudevan
Vijay K. Vasudevan Google (United States)
Gene E. Ice
Gene E. Ice Oak Ridge National Laboratory
Robert O. Ritchie
Robert O. Ritchie Lawrence Berkeley National Laboratory
Bruce Remington
Bruce Remington Lawrence Livermore National Laboratory

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