Lei Lu mainly focuses on Metallurgy, Composite material, Grain boundary, Grain size and Deformation. The study incorporates disciplines such as Stress concentration and Nanocrystalline material in addition to Metallurgy. Composite material is often connected to Copper in his work.
His studies in Copper integrate themes in fields like Creep and Macle. His research investigates the connection with Grain boundary and areas like Dislocation which intersect with concerns in Nucleation. He studies Deformation mechanism, a branch of Deformation.
The scientist’s investigation covers issues in Composite material, Metallurgy, Copper, Deformation and Nanocrystalline material. Dislocation, Plasticity, Deformation mechanism, Strain rate and Ductility are among the areas of Composite material where he concentrates his study. His is doing research in Grain size, Grain boundary, Microstructure, Ultimate tensile strength and Crystal twinning, both of which are found in Metallurgy.
Lei Lu works mostly in the field of Copper, limiting it down to concerns involving Strain hardening exponent and, occasionally, Stress–strain curve. Lei Lu works mostly in the field of Deformation, limiting it down to topics relating to Fracture toughness and, in certain cases, Damage tolerance, as a part of the same area of interest. Lei Lu combines subjects such as Stress relaxation, Nanocrystal, Creep, Grain boundary strengthening and Grain growth with his study of Nanocrystalline material.
Lei Lu mainly investigates Composite material, Deformation, Ultimate tensile strength, Dislocation and Fracture. His research in Composite material intersects with topics in Copper and Nanostructure. His work on Deformation mechanism as part of general Deformation research is often related to Perpendicular, thus linking different fields of science.
His Ultimate tensile strength research is multidisciplinary, incorporating elements of Strain rate, Austenite, Shear and Recrystallization. His biological study spans a wide range of topics, including Void nucleation, Toughness and Grain size. His Fatigue testing study frequently links to adjacent areas such as Metallurgy.
His scientific interests lie mostly in Composite material, Dislocation, Surface roughening, Ultimate tensile strength and Volume fraction. His work on Homogenization, Tension and Lateral strain as part of general Composite material study is frequently linked to Soft core and Order, therefore connecting diverse disciplines of science. The study incorporates disciplines such as Characterization, Nanotechnology, Hydrogen embrittlement and Strain hardening exponent in addition to Dislocation.
His work carried out in the field of Surface roughening brings together such families of science as Fatigue resistance, Nanostructure, Fatigue damage and Copper. His research integrates issues of Plasticity, Stress, Tension, Compression and Crystallite in his study of Ultimate tensile strength. Lei Lu combines subjects such as Fatigue limit, Grinding, Volume, Fatigue testing and Surface layer with his study of Volume fraction.
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Ultrahigh strength and high electrical conductivity in copper
Lei Lu;Yongfeng Shen;Xianhua Chen;Lihua Qian.
Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale
K. Lu;K. Lu;L. Lu;L. Lu;S. Suresh;S. Suresh.
Revealing the Maximum Strength in Nanotwinned Copper
L. Lu;X. Chen;Xiaoxu Huang;K. Lu.
Toward a quantitative understanding of mechanical behavior of nanocrystalline metals
M. Dao;L. Lu;R. J. Asaro;J. T. M. De Hosson.
Acta Materialia (2007)
Dislocation nucleation governed softening and maximum strength in nano-twinned metals
Xiaoyan Li;Yujie Wei;Yujie Wei;Lei Lu;K e Lu.
Superplastic extensibility of nanocrystalline copper at room temperature
L. Lu;M. L. Sui;K. Lu.
Nano-sized twins induce high rate sensitivity of flow stress in pure copper
L. Lu;L. Lu;R. Schwaiger;Z.W. Shan;M. Dao.
Acta Materialia (2005)
Tensile properties of copper with nano-scale twins
Y.F. Shen;L. Lu;Q.H. Lu;Z.H. Jin.
Scripta Materialia (2005)
Hardness and strain rate sensitivity of nanocrystalline Cu
J. Chen;L. Lu;K. Lu.
Scripta Materialia (2006)
Strength, strain-rate sensitivity and ductility of copper with nanoscale twins
M. Dao;L. Lu;L. Lu;Y.F. Shen;S. Suresh.
Acta Materialia (2006)
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