World's Best Scientists 2026 revealed!

D-Index & Metrics

Engineering and Technology

D-Index
56
Citations
10422
World Ranking
2868
National Ranking
872

Gary J. Cheng publication distribution in Engineering and Technology in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Engineering and Technology in 2026. The highlighted bar marks where Gary J. Cheng sits on this spectrum.

38–47 publications: 20 scientists 48–57 publications: 35 scientists 58–67 publications: 96 scientists 68–77 publications: 135 scientists 78–87 publications: 190 scientists 88–97 publications: 259 scientists 98–107 publications: 283 scientists 108–117 publications: 369 scientists 118–127 publications: 341 scientists 128–137 publications: 386 scientists 138–147 publications: 372 scientists 148–157 publications: 457 scientists 158–167 publications: 415 scientists 168–177 publications: 407 scientists 178–187 publications: 421 scientists 188–197 publications: 378 scientists 198–207 publications: 403 scientists 208–217 publications: 317 scientists 218–227 publications: 346 scientists 228–237 publications: 321 scientists 238–247 publications: 260 scientists 248–257 publications: 280 scientists 258–267 publications: 240 scientists 268–277 publications: 214 scientists 278–287 publications: 242 scientists 288–297 publications: 203 scientists 298–307 publications: 166 scientists 308–317 publications: 154 scientists 318–327 publications: 175 scientists 328–337 publications: 159 scientists 338–347 publications: 99 scientists 348–357 publications: 131 scientists 358–367 publications: 106 scientists 368–377 publications: 118 scientists 378–387 publications: 97 scientists 388–397 publications: 108 scientists 398–407 publications: 82 scientists 408–417 publications: 71 scientists 418–427 publications: 64 scientists 428–437 publications: 55 scientists 438–447 publications: 54 scientists 448–457 publications: 60 scientists 458–467 publications: 47 scientists 468–477 publications: 40 scientists 478–487 publications: 30 scientists 488–497 publications: 29 scientists 498–507 publications: 38 scientists 508–517 publications: 40 scientists 518–527 publications: 32 scientists 528–537 publications: 23 scientists 538–547 publications: 28 scientists 548–557 publications: 23 scientists 558–567 publications: 19 scientists 568–577 publications: 16 scientists 578–587 publications: 17 scientists 588–597 publications: 18 scientists 598–607 publications: 22 scientists 608–617 publications: 15 scientists 618–627 publications: 9 scientists 628–637 publications: 11 scientists 638–647 publications: 21 scientists 648–657 publications: 12 scientists 658–667 publications: 9 scientists 668–677 publications: 11 scientists 678–687 publications: 9 scientists 688–697 publications: 6 scientists 698–707 publications: 14 scientists 708–717 publications: 7 scientists 718–727 publications: 8 scientists 728–737 publications: 10 scientists 738–747 publications: 9 scientists 748–757 publications: 5 scientists 758–767 publications: 5 scientists 768–777 publications: 11 scientists 778–787 publications: 7 scientists 788–797 publications: 2 scientists 798–803 publications: 4 scientists 804+ publications: 100 scientists
38 publications 804+

This scientist: 242 publications — 62nd percentile

62% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 804 publications or more.

Gary J. Cheng D-index placement in Engineering and Technology in 2026

The chart shows the D-index (discipline H-index) distribution of Engineering and Technology scientists ranked by Research.com in 2026. The highlighted bar marks where Gary J. Cheng sits on this spectrum.

30 D-Index: 59 scientists 31 D-Index: 114 scientists 32 D-Index: 129 scientists 33 D-Index: 189 scientists 34 D-Index: 200 scientists 35 D-Index: 262 scientists 36 D-Index: 311 scientists 37 D-Index: 312 scientists 38 D-Index: 350 scientists 39 D-Index: 385 scientists 40 D-Index: 348 scientists 41 D-Index: 362 scientists 42 D-Index: 426 scientists 43 D-Index: 380 scientists 44 D-Index: 310 scientists 45 D-Index: 341 scientists 46 D-Index: 301 scientists 47 D-Index: 306 scientists 48 D-Index: 271 scientists 49 D-Index: 246 scientists 50 D-Index: 210 scientists 51 D-Index: 253 scientists 52 D-Index: 213 scientists 53 D-Index: 221 scientists 54 D-Index: 195 scientists 55 D-Index: 186 scientists 56 D-Index: 170 scientists 57 D-Index: 167 scientists 58 D-Index: 166 scientists 59 D-Index: 144 scientists 60 D-Index: 152 scientists 61 D-Index: 141 scientists 62 D-Index: 138 scientists 63 D-Index: 131 scientists 64 D-Index: 118 scientists 65 D-Index: 114 scientists 66 D-Index: 119 scientists 67 D-Index: 95 scientists 68 D-Index: 87 scientists 69 D-Index: 77 scientists 70 D-Index: 89 scientists 71 D-Index: 69 scientists 72 D-Index: 54 scientists 73 D-Index: 46 scientists 74 D-Index: 55 scientists 75 D-Index: 54 scientists 76 D-Index: 49 scientists 77 D-Index: 53 scientists 78 D-Index: 46 scientists 79 D-Index: 28 scientists 80 D-Index: 39 scientists 81 D-Index: 36 scientists 82 D-Index: 24 scientists 83 D-Index: 26 scientists 84 D-Index: 36 scientists 85 D-Index: 18 scientists 86 D-Index: 25 scientists 87 D-Index: 19 scientists 88 D-Index: 26 scientists 89 D-Index: 27 scientists 90 D-Index: 23 scientists 91 D-Index: 15 scientists 92 D-Index: 12 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 13 scientists 97 D-Index: 13 scientists 98 D-Index: 9 scientists 99 D-Index: 7 scientists 100 D-Index: 7 scientists 101 D-Index: 8 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 9 scientists 105 D-Index: 6 scientists 106 D-Index: 9 scientists 107+ D-Index: 99 scientists
30 D-Index 107+

This scientist: 56 D-Index — 72nd percentile

72% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 107 D-Index or more.

Overview

Gary J. Cheng is affiliated with Purdue University West Lafayette in the United States and has a research focus primarily in the fields of Engineering and Materials Science. Their work spans several subfields including Materials Chemistry, Biomedical Engineering, Mechanical Engineering, Electrical and Electronic Engineering, and Computational Mechanics.

Their publications address a range of topics related to advanced materials and manufacturing processes. Key areas of research include:

  • Diamond and Carbon-based Materials Research
  • High Entropy Alloys Studies
  • Advanced Sensor and Energy Harvesting Materials
  • Laser Material Processing Techniques
  • Laser-Ablation Synthesis of Nanoparticles
  • Additive Manufacturing Materials and Processes
  • Graphene research and applications

Gary J. Cheng has contributed to several papers with notable recent works such as:

  • Stable mid-infrared polarization imaging based on quasi-2D tellurium at room temperature, 2020, Nature Communications
  • 3D-printed hierarchical porous cellulose/alginate/carbon black hydrogel for high-efficiency solar steam generation, 2021, Chemical Engineering Journal
  • A review on microstructures and properties of high entropy alloys manufactured by selective laser melting, 2020, International Journal of Extreme Manufacturing
  • Highly Sensitive Flexible Piezoresistive Sensor with 3D Conductive Network, 2020, ACS Applied Materials & Interfaces
  • Electronic properties of 2D materials and their junctions, 2023, Nano Materials Science

Frequent collaborators in their research include:

  • Feng Liu
  • Haoqing Jiang
  • Xingtao Liu
  • Licong An
  • Jun Yuan

Gary J. Cheng's research has been published extensively in prominent journals and venues, with multiple contributions to:

  • Advanced Materials
  • Matter
  • SSRN Electronic Journal
  • Materials Science and Engineering A
  • International Journal of Extreme Manufacturing

Best Publications

  • Double-negative-index ceramic aerogels for thermal superinsulation

    Xiang Xu;Xiang Xu;Qiangqiang Zhang;Menglong Hao;Menglong Hao;Yuan Hu

  • Stable mid-infrared polarization imaging based on quasi-2D tellurium at room temperature

    Lei Tong;Xinyu Huang;Peng Wang;Lei Ye

  • Fatigue Performance Improvement in AISI 4140 Steel by Dynamic Strain Aging and Dynamic Precipitation During Warm Laser Shock Peening

    Chang Ye;Sergey Suslov;Bong Joong Kim;Eric A. Stach

  • Laser Sintering of Liquid Metal Nanoparticles for Scalable Manufacturing of Soft and Flexible Electronics.

    Shanliangzi Liu;Michelle C. Yuen;Edward L. White;J. William Boley

  • 3D-printed hierarchical porous cellulose/alginate/carbon black hydrogel for high-efficiency solar steam generation

    Jun Yuan;Xiao Lei;Chenqi Yi;Haoqing Jiang

  • 3D stereolithography printing of graphene oxide reinforced complex architectures.

    Dong Lin;Shengyu Jin;Feng Zhang;Chao Wang

  • Large-scale nanoshaping of ultrasmooth 3D crystalline metallic structures

    Huang Gao;Yaowu Hu;Yi Xuan;Ji Li

  • Single-layer graphene oxide reinforced metal matrix composites by laser sintering: Microstructure and mechanical property enhancement

    Dong Lin;C. Richard Liu;Gary J. Cheng

  • Bimodal Nanocrystallization of NiTi Shape Memory Alloy by Laser Shock Peening and Post-deformation Annealing

    Chang Ye;Sergey Suslov;Xueling Fei;Gary J. Cheng

  • [INVITED] A review: Warm laser shock peening and related laser processing technique

    Yiliang Liao;Chang Ye;Gary J. Cheng

  • Warm Laser Shock Peening Driven Nanostructures and Their Effects on Fatigue Performance in Aluminum Alloy 6160

    Chang Ye;Yiliang Liao;Gary J. Cheng

  • A review on microstructures and properties of high entropy alloys manufactured by selective laser melting

    Chen Zhang;Junkai Zhu;Huai Zheng;Hui Li

  • Flyweight, Superelastic, Electrically Conductive, and Flame-Retardant 3D Multi-Nanolayer Graphene/Ceramic Metamaterial

    Qiangqiang Zhang;Qiangqiang Zhang;Dong Lin;Dong Lin;Biwei Deng;Xiang Xu

  • 3D nanostructured inkjet printed graphene via UV-pulsed laser irradiation enables paper-based electronics and electrochemical devices

    Suprem R. Das;Suprem R. Das;Qiong Nian;Allison A. Cargill;John A. Hondred

  • Electronic properties of 2D materials and their junctions

    Unknown

  • Bioceramic coating of hydroxyapatite on titanium substrate with Nd-YAG laser

    Gary J. Cheng;Daniel Pirzada;M. Cai;Pravansu Mohanty

  • Large-Area Direct Laser-Shock Imprinting of a 3D Biomimic Hierarchical Metal Surface for Triboelectric Nanogenerators.

    Shengyu Jin;Yixiu Wang;Maithilee Motlag;Shengjie Gao

  • Mesoporous nitrogen-doped carbon hollow spheres as high-performance anodes for lithium-ion batteries

    Kaifu Huo;Weili An;Jijiang Fu;Biao Gao

  • Ultrahigh dense and gradient nano-precipitates generated by warm laser shock peening for combination of high strength and ductility

    Chang Ye;Yiliang Liao;Sergey Suslov;Dong Lin

  • Microstructure and mechanical property characterizations of metal foil after microscale laser dynamic forming

    Gary J. Cheng;Daniel Pirzada;Zhou Ming

  • Ultrastrong nanocrystalline stainless steel and its Hall-Petch relationship in the nanoscale

    Fei Yin;Gary J. Cheng;Rong Xu;Kejie Zhao

  • Highly Sensitive Flexible Piezoresistive Sensor with 3D Conductive Network

    Rui Yu;Tiancheng Xia;Bang Wu;Jun Yuan

  • Three-dimensional printing of complex structures: man made or toward nature?

    Dong Lin;Qiong Nian;Biwei Deng;Shengyu Jin

  • Crystalline Nanojoining Silver Nanowire Percolated Networks on Flexible Substrate.

    Qiong Nian;Mojib Saei;Yang Xu;Ganguli Sabyasachi

  • A reusable laser wrapped graphene-Ag array based SERS sensor for trace detection of genomic DNA methylation.

    Lei Ouyang;Yaowu Hu;Lihua Zhu;Gary J. Cheng

  • Shock engineering the additive manufactured graphene-metal nanocomposite with high density nanotwins and dislocations for ultra-stable mechanical properties

    Dong Lin;Maithilee Motlag;Mojib Saei;Shengyu Jin

  • An eXtended Finite Element Method (XFEM) study on the effect of reinforcing particles on the crack propagation behavior in a metal–matrix composite

    Chang Ye;Jay Shi;Gary J. Cheng

  • Laser sintered graphene nickel nanocomposites

    Zengrong Hu;Guoquan Tong;Dong Lin;Qiong Nian

Frequent Co-Authors

Feng Liu
Feng Liu Shanghai Jiao Tong University
Joseph Irudayaraj
Joseph Irudayaraj University of Illinois at Urbana-Champaign
Yung C. Shin
Yung C. Shin Purdue University West Lafayette
Kejie Zhao
Kejie Zhao Purdue University West Lafayette
Lei Ye
Lei Ye Lund University
Yi Xuan
Yi Xuan Purdue University West Lafayette
Rong Xu
Rong Xu Case Western Reserve University
Wenzhuo Wu
Wenzhuo Wu Purdue University West Lafayette
Hanqing Jiang
Hanqing Jiang Westlake University
Swapan K. Pati
Swapan K. Pati Jawaharlal Nehru Centre for Advanced Scientific Research

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