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Electronics and Electrical Engineering

D-Index
42
Citations
8241
World Ranking
4063
National Ranking
1452

Research.com Recognitions

  • 2020 - OSA Fellows Di Liang Hewlett Packard Labs, Hewlett Packard Enterprise, USA For seminal contributions to innovative photonic material and device integration for energy-efficient optical communication and volume production

Overview

Di Liang is affiliated with Hewlett-Packard in the United States. Their research primarily focuses on engineering, with a specialization in electrical and electronic engineering. Their work also spans subfields such as atomic and molecular physics and optics, artificial intelligence, instrumentation, and materials chemistry.

The main topics of their research include photonic and optical devices, optical network technologies, neural networks and reservoir computing, advanced photonic communication systems, advanced fiber laser technologies, semiconductor lasers and optical devices, and advanced memory and neural computing.

Recent publications by Di Liang include:

  • Recent Progress in Heterogeneous III-V-on-Silicon Photonic Integration, 2021, Light Advanced Manufacturing

Frequent coauthors in their research collaborations include Raymond G. Beausoleil, Yuan Yuan, Stanley Cheung, Géza Kurczveil, and Marco Fiorentino.

Di Liang has published multiple papers in notable venues such as the IEEE Journal of Selected Topics in Quantum Electronics, Photonics Research, Conference on Lasers and Electro-Optics, OSA Advanced Photonics Congress 2021, and Nature Communications.

In 2020, Di Liang was recognized as an OSA Fellow for contributions to photonic material and device integration aimed at energy-efficient optical communication and scalable production.

Best Publications

  • Recent progress in lasers on silicon

    Di Liang;John E. Bowers

  • III‐V/silicon photonics for on‐chip and intra‐chip optical interconnects

    Günther Roelkens;Liu Liu;Di Liang;Richard Jones

  • Hybrid Integrated Platforms for Silicon Photonics

    Di Liang;Gunther Roelkens;Roel Baets;John E. Bowers

  • A distributed feedback silicon evanescent laser

    Alexander W Fang;Erica Lively;Ying-Hao Kuo;Di Liang

  • Hybrid Silicon Photonics for Optical Interconnects

    Martijn J R Heck;Hui-Wen Chen;Alexander W Fang;Brian R Koch

  • Electrically-pumped compact hybrid silicon microring lasers for optical interconnects.

    Di Liang;Marco Fiorentino;Tadashi Okumura;Hsu-Hao Chang

  • 1.3 μm submilliamp threshold quantum dot micro-lasers on Si

    Yating Wan;Justin Norman;Qiang Li;M. J. Kennedy

  • Hybrid silicon evanescent devices

    Alexander W. Fang;Hyundai Park;Ying-hao Kuo;Richard Jones

  • A Distributed Bragg Reflector Silicon Evanescent Laser

    A.W. Fang;B.R. Koch;R. Jones;E. Lively

  • 25 Gbps low-voltage waveguide Si–Ge avalanche photodiode

    Zhihong Huang;Cheng Li;Di Liang;Kunzhi Yu

  • Highly efficient vertical outgassing channels for low-temperature InP-to-silicon direct wafer bonding on the silicon-on-insulator substrate

    D. Liang;J. E. Bowers

  • Recent Progress in Heterogeneous III-V-on-Silicon Photonic Integration

    Di Liang;John E. Bowers

  • High-performance silicon photonics using heterogeneous integration

    Chao Xiang;Warren Jin;Duanni Huang;Minh Anh Tran

  • Integrated finely tunable microring laser on silicon

    D. Liang;X. Huang;G. Kurczveil;M. Fiorentino

  • Low-Temperature, Strong SiO 2 -SiO 2 Covalent Wafer Bonding for III–V Compound Semiconductors-to-Silicon Photonic Integrated Circuits

    Di Liang;Alexander W. Fang;Hyundai Park;Tom E. Reynolds

  • Device and Integration Technology for Silicon Photonic Transmitters

    Hyundai Park;M N Sysak;Hui-Wen Chen;A W Fang

  • Realization of an ultra-short silicon polarization beam splitter with an asymmetrical bent directional coupler.

    Jian Wang;Di Liang;Yongbo Tang;Daoxin Dai

  • Photonic integration: Si or InP substrates?

    D. Liang;J.E. Bowers

  • Hybrid Silicon Laser Technology: A Thermal Perspective

    M. N. Sysak;Di Liang;R. Jones;G. Kurczveil

  • III/V-on-Si MQW lasers by using a novel photonic integration method of regrowth on a bonding template.

    Yingtao Hu;Di Liang;Kunal Mukherjee;Youli Li

  • Low Threshold Electrically-Pumped Hybrid Silicon Microring Lasers

    Di Liang;M. Fiorentino;S. Srinivasan;J. E. Bowers

Frequent Co-Authors

John E. Bowers
John E. Bowers University of California, Santa Barbara
Marco Fiorentino
Marco Fiorentino Hewlett Packard Enterprise (United States)
Arthur C. Gossard
Arthur C. Gossard University of California, Santa Barbara
Kei May Lau
Kei May Lau Hong Kong University of Science and Technology
Martijn J. R. Heck
Martijn J. R. Heck Eindhoven University of Technology
Jeffrey M. Bewley
Jeffrey M. Bewley University of Kentucky
Gunther Roelkens
Gunther Roelkens Ghent University
Joe C. Campbell
Joe C. Campbell University of Virginia
Robert J. Harmon
Robert J. Harmon University of Kentucky
Mario J. Paniccia
Mario J. Paniccia Anello Photonics

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