Location: Orlando , United States
Conference dates: 5/30/2023 - 6/2/2023
| Discipline name | Position | Best Scientists | Publications | D-Index |
|---|---|---|---|---|
| Materials Science | 55 | 22 | 38 | 4 |
| Electronics and Electrical Engineering | 99 | 26 | 203 | 12 |
| Engineering and Technology | 121 | 18 | 42 | 5 |
| Mechanical and Aerospace Engineering | 8 | 39 | 188 | 12 |
The conference ranking presented on this page offers a comprehensive assessment of scientific meetings within the discipline of Engineering and Technology. This ranking has been meticulously developed by Research.com, a prominent and trusted source of science research data spanning all major scientific fields since 2014, including in-depth coverage of the Engineering and Technology sector.
The position of each conference in the ranking is determined by a unique bibliometric score formulated by Research.com experts. This score is derived by considering both the estimated h-index and the number of leading scientists who have contributed to or appeared at the conference during the three most recent years. The Impact Score values featured here were collected as of 2024-11-27, ensuring the data's relevance and timeliness.
The development of this ranking involved an extensive analytical process. More than 2,262 conferences were evaluated following a rigorous selection procedure that scrutinized over 26,934 scientific documents published in the past three years. These documents reflect the contributions of 9,385 highly regarded and influential scientists within the broader Engineering and Technology community.
We invite readers seeking further insight into the ranking’s bibliometric approach to consult a detailed explanation of our evaluation process available on our Methodology Page. This resource elucidates the metrics, selection criteria, and computational methods underlying our rankings, contributing to transparency and confidence in the presented results.
A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.
The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.
The top authors publishing at Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (based on the number of publications) are:
The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.
Only papers with recognized affiliations are considered
The top affiliations publishing at Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (based on the number of publications) are:
The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.
The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.
The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.
During the most recent 2016 edition, 5.96% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 40.49% were posted by at least one author from the top 10 institutions publishing at the conference. Another 11.71% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 16.10% of all publications and 31.71% were from other institutions.
A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.
The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.
The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.
Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).
The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:
The chart below illustrates experience levels of first authors in cases of publications with multiple authors.
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