International Symposium for Testing and Failure Analysis (ISTFA)

Original, unpublished abstracts are solicited in the follow topic areas:

NOTE: Authors are allowed to present a maximum of two papers (oral or poster).

Emerging FA Techniques and Concepts
New FA tools and methods up to TLR4
Quantum and neuromorphic circuit FA
Future challenges of FA
FA techniques addressing the challenges of heterogeneous systems in package
3D Devices Failure Analysis
3D defect localization
High throughput site specific sample prep
TSV and µ bump failure modes
3D stacking failure modes / thermo-mech. Issues
3D stacking failure modes / thermo-mech. Issues
AI Application for FA
Image recognition for defect and end point detection
Signal analysis for defect signature detection
Data correlation and FA date bases
Die Level Fault Isolation
LVP and LVI
Static and dynamic emission microscopy
Static and dynamic laser stimulation
Thermal lock-in thermography
E-beam probing
Package Level Fault Isolation
Thermal lock-in thermography
Acoustic microscopy
X-ray microscopy
Magnetic Field Imaging
Time domain reflectometry
Case Studies: Device Analysis
Wireless, self-powered device FA,
MEMS and sensor FA
Power, discrete and optoelectronic device FA
Organic electronic (OLED…)
Novel memory FA
Alternative energy (photovoltaics, solid state lighting, etc.)
Space application FA
Silicon photonics FA
Case Studies: FA Process
Packaging and Assembly Level FA
Interconnect failure modes
Delamination and die cracking
Any issues related to packaging process
Board and System Level FA
Thermomechanical issues
Board specific failure modes (CAF, etc.)
Advanced system level analysis
Microscopy and Material Analysis
Electron microscopy (SEM, EBSD, EDX, TEM, EELS)
Electronic device materials characterization (SIMS, RBS, XPS, Auger, etc...)
Mechanical testing and simulation
FIB Circuit Edit
Advanced Ga-FIB CE tools and workflows
Helium ion microscopy
New gas chemistries
FIB Sample Preparation
FIB prep for SEM/TEM
FIB related artefacts
Multi-ion source plasma-FIB
Sample Preparation and Device De-processing
Package opening and device de-processing
Chemical etching methods
Mechanical polishing and laser preparation
Product Yield, Test and Diagnostics
Yield and reliability enhancement
Metrology and in-line device characterization
Diagnostic testing, scanning and debug
Nanoprobing, Electrical Characterization
Scanning Probe Analysis
Detecting Counterfeit Microelectronics
Hardware Attacks, Security and Reverse Engineering
Competitive analysis and reverse engineering