World's Best Scientists 2026 revealed!
Elsevier

International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Location: Graz , Austria

Conference dates: 4/16/2023 - 4/19/2023

Research H-index
6

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Materials Science 191 7 7 1
Electronics and Electrical Engineering 427 15 21 5
Engineering and Technology 288 7 30 3
Mechanical and Aerospace Engineering 41 5 22 5

Call for Papers

Single domain simulation
 Thermal, mechanical, thermo-mechanical, vibration
 Chip package interaction
 Advanced numerical and analytical simulations
methodologies and tools
 Behavioral & compact modelling and Model Order
Reduction (MOR)
 Advanced cooling concepts
Multi-physics simulation
 Multi-physics simulation (MEMS, manufacturing and
process models, electronic control unit/system level,
fluid structure interactions)
 Multi-scale modelling and simulation
 Integrated process modelling
 Simulation-based optimization, virtual prototyping
and pre-qualification in product and process design
Material characterization and validation
 Material characterization, experiments and modelling
 Bulk and interface toughness, characterization and
modeling
 Experimental methods for validation of simulation models
 Failure analysis and failure mode extraction
 Failure criteria and damage modelling for reliability
prediction
Emerging modeling methods and tools
 Condition monitoring
 Prognostics and Health Management (PHM)
 Development and implementation of artificial
intelligence and machine learning
 Use of big data in simulation & reliability applications
 3D packaging
 Additive manufacturing (3D printing)
Application domains
 Electronic components, packaging and system integration for applications including aerospace, agriculture, automotive,
energy, lightning, and medical
 MEMS sensors and actuators, piezoelectric, piezoresistive, functional ceramic sensors and components
 Advanced packaging including 3-D integration, TSV-technology, 3-D microsystems
 Opto-electronic packages, opto-mechanical devices
 Nano-electronic mechanical devices
 Microfluidics for novel cooling concepts

Overview

This ranking presents a comprehensive assessment of scientific conferences in the field of Engineering and Technology. The ranking has been meticulously prepared by Research.com, a leading authority in scientific research analytics across all major disciplines, including Engineering and Technology. Since 2014, Research.com has been recognized for providing trusted, data-driven insights into scientific contributions worldwide.

The position of each conference within this ranking is determined by a unique bibliometric score developed by Research.com. This robust metric combines the estimated h-index with the count of leading scientists who have actively contributed to the conference over the three most recent years. This approach ensures a multifaceted evaluation of academic impact and reputation within the scientific community.

Impact Score values for all conferences were gathered as of 2024-11-27. The ranking process entailed a thorough examination of more than 2,262 conferences, selected following a detailed and rigorous review of over 26,934 scientific documents published during the last three years by 9,385 leading and highly regarded scientists in Engineering and Technology. This exhaustive methodology serves to uphold the integrity and credibility of the ranking, reflecting the depth of research and the complexity of analysis conducted by domain experts.

For those interested in a detailed explanation of the methodology utilized in computing the ranking scores, further information is available on our Methodology Page.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing at International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (based on the number of publications) are:

  • Guoqi Zhang (69 papers) published 6 papers at the last edition, 6 less than at the previous edition,
  • Bernhard Wunderle (56 papers) published 4 papers at the last edition, 1 less than at the previous edition,
  • Steffen Wiese (35 papers) published 3 papers at the last edition, 1 less than at the previous edition,
  • Mike Roellig (32 papers) published 2 papers at the last edition, 3 less than at the previous edition,
  • W.D. van Driel (29 papers) published 3 papers at the last edition, 1 more than at the previous edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing at International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (based on the number of publications) are:

  • Delft University of Technology (105 papers) published 7 papers at the last edition, 5 less than at the previous edition,
  • Bosch (71 papers) published 4 papers at the last edition, 4 less than at the previous edition,
  • Fraunhofer Society (55 papers) published 3 papers at the last edition, 3 less than at the previous edition,
  • Infineon Technologies (51 papers) published 8 papers at the last edition, 1 more than at the previous edition,
  • Chemnitz University of Technology (46 papers) published 4 papers at the last edition the same number as at the previous edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2018 edition, 6.93% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 32.98% were posted by at least one author from the top 10 institutions publishing at the conference. Another 13.83% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 18.09% of all publications and 35.11% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

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