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IEEE

2021 IEEE 14th International Conference on ASIC (ASICON)

Location: Kunming , China

Submission deadline: 7/15/2021

Conference dates: 10/26/2021 - 10/29/2021

Research H-index
4

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Materials Science 126 13 16 2
Electronics and Electrical Engineering 581 32 45 3
Engineering and Technology 359 17 18 2

Call for Papers

2021 IEEE 14th International Conference on ASIC (ASICON 2021) will be held in Kunming, China, during Oct.26-29, 2021. The conference is intended to provide an international forum for Integrated circuit designers, ASIC users, system integrators, IC manufacturers, process and device engineers, and CAD/CAE tool developers to present their latest progress, development and research results in their respective fields. The four-day event features keynote speeches, invited talks, regular paper presentations and tutorials, delivered by leading experts in the respective fields, on state-of-the-art Integrated circuits, design methodologies, devices, processes and manufacturing technologies. The Excellent Student Paper Award & Excellent Young Scholar Paper Award will be announced at the conference. Additionally, an exhibition on EDA tools, foundry technologies, IC processing/testing facilities, and novel ASIC products will be held during the conference.

Overview

The scientific conference ranking presented on this page provides an authoritative assessment of leading events within the field of Engineering and Technology. This comprehensive ranking has been meticulously developed by Research.com, a leading platform acclaimed for delivering trusted data and insights on scientific contributions since 2014 across all major research domains, including Engineering and Technology.

The position of each conference in this ranking is determined by a unique bibliometric score innovatively constructed by Research.com. This score incorporates both the estimated h-index and the number of renowned scientists who have participated in the respective conferences over the preceding three years, ensuring a robust and multidimensional evaluation of each event’s scholarly impact. The ranking includes Impact Score values that were compiled as of 2024-11-27, reflecting the most current and relevant measurements of scientific influence.

The rigorous process entailed the examination of more than 2,262 conferences, selected following an in-depth review and strict scrutiny of over 26,934 scientific documents published within the last three years. This extensive analysis involved contributions from 9,385 distinguished and reputable scientists in the sphere of Engineering and Technology, underscoring the profound depth and scholarly precision that characterize this ranking.

For a thorough understanding of the algorithms, criteria, and comprehensive methodology underpinning the computation of these ranking scores, readers are encouraged to consult our Methodology Page.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing at International Conference on ASIC (based on the number of publications) are:

  • Xianlong Hong (39 papers) absent at the last edition,
  • Xiaoyang Zeng (26 papers) published 6 papers at the last edition, 6 less than at the previous edition,
  • Yici Cai (20 papers) absent at the last edition,
  • Junyan Ren (20 papers) published 9 papers at the last edition, 6 more than at the previous edition,
  • Sheqin Dong (17 papers) absent at the last edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing at International Conference on ASIC (based on the number of publications) are:

  • Fudan University (159 papers) published 56 papers at the last edition, 18 more than at the previous edition,
  • Tsinghua University (154 papers) published 14 papers at the last edition, 27 less than at the previous edition,
  • Peking University (64 papers) published 22 papers at the last edition, 6 more than at the previous edition,
  • Chinese Academy of Sciences (39 papers) published 8 papers at the last edition, 10 less than at the previous edition,
  • Shanghai Jiao Tong University (36 papers) published 12 papers at the last edition, 5 more than at the previous edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2017 edition, 5.88% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 54.78% were posted by at least one author from the top 10 institutions publishing at the conference. Another 13.24% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 9.19% of all publications and 22.79% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

Related Online Degrees & Career Pathways

For students interested in Electronics and Electrical Engineering, exploring related online degrees can open diverse career pathways. Fields such as social work, psychology, and leadership complement technical expertise with essential interpersonal and management skills.

Those considering a blend of technology and social impact might find online MSW programs a valuable addition to their education. These programs offer flexible options that can be pursued alongside engineering studies, enhancing career versatility.

When selecting a program, it's important to focus on quality, which is why many students choose to attend the best online colleges. These institutions provide nationally accredited degrees ensuring credibility and recognition in the job market.

For engineers aiming to advance into leadership roles, an online masters in leadership can cultivate skills in strategic thinking and team management. Similarly, pursuing a Psyd in psychology online can equip professionals to better understand human behavior, beneficial for systems design and user-centered technology development.

Exploring these related disciplines through reputable online programs can greatly expand career opportunities beyond traditional engineering roles, making it easier to adapt to evolving industries and leadership demands.

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