World's Best Scientists 2026 revealed!
IEEE

2022 International Conference on Computer-Aided Design (ICCAD)

Location: San Diego , United States

Submission deadline: 5/23/2022

Conference dates: 10/30/2022 - 11/3/2022

Research H-index
28

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Electronics and Electrical Engineering 28 97 290 24
Computer Science 85 157 344 26

Call for Papers

1.1 System Design

System-level specification, modeling, simulation, design flows
System-level issues for 3D integration
System-level design case studies and applications
HW/SW co-design, co-simulation, co-optimization, and co-exploration, platforms for emulation and rapid prototyping
Micro-architectural transformation
Multi-/many-core processor, GPU and heterogeneous SoC
Memory and storage architecture and system synthesis
System communication architecture, Network-on-chip design
Modeling, simulation, high-level synthesis, power/performance analysis, programming of heterogeneous computing platforms
Application driven system design for big data
Analysis and optimization of data centers
1.2 Embedded, Cyber-Physical (CPS), IoT

Systems and Software
AI and machine learning for embedded systems
HW/SW co-design for embedded systems
Compute, memory, storage, interconnect for embedded systems
Domain-specific accelerators
Energy/power management and energy harvesting
Real-time software and systems
Middleware, virtual machines, and runtime support
Dependable, safe, secure, trustworthy embedded systems
Embedded software: compilation, optimization, testing
CAD for IoT, edge and fog computing
Modeling, analysis, verification of CPS systems
Green computing (smart grid, energy, solar panels, etc.)
CAD for application domains including wearables, health care, autonomous systems, smart cities
1.3 Neural Networks and Deep Learning

Hardware and architecture for neural networks
Compilers for deep neural networks
Design method for learning on a chip
System-level design for (deep) neural computing
Neural network acceleration including GPU and ASICs
Safe and secure machine learning
Hardware accelerators for Artificial Intelligence
1.4 Reconfigurable Computing

Novel reconfigurable architectures (FPGA, CGRA, etc.)
Neural network acceleration on reconfigurable accelerators
High-level synthesis on reconfigurable architectures
Compilers for reconfigurable architectures
Reconfigurable fabric security
HW/SW prototyping and emulation on FPGAs
Post-synthesis optimization for FPGAs
FPGA-based prototyping for analog, mixed-signal, RF systems
1.5 Hardware Security, Security Architecture
and Systems

Hardware Trojans, side-channel attacks, fault attacks and countermeasures
New physical attack vectors or methods for ASICs
Nano electronic security
Hardware-based security (CAD for PUF’s, RNG, AES etc.)
Split Manufacturing for security
Supply chain security and anti-counterfeiting
Artificial Intelligence for attack prevention systems
Design and CAD for security
Security implications of CAD
Trusted execution environments
Privacy-preserving computation
Cloud Computing data security
Sensor network security
1.6 Low Power and Approximate Computing in
System Design

Power and thermal estimation, analysis, optimization, and management techniques for hardware and software systems
Energy- and thermal-aware application mapping and scheduling
Energy- and thermal-aware architectures, algorithms
Energy- and thermal-aware dark silicon system design
Hardware techniques for approximate/stochastic computing

2.1 High-Level, Behavioral, and Logic Synthesis and Optimization

High-level/Behavioral/Logic synthesis
Technology-independent optimization and technology mapping
Functional and logic timing ECO (engineering change order)
Resource scheduling, allocation, and synthesis
Interaction between logic synthesis and physical design
2.2 Testing, Validation, Simulation, and Verification

High-level/Behavioral/Logic modeling, validation, simulation
Formal, semi-formal, and assertion-based verification
Equivalence and property checking
Emulation and hardware simulation/acceleration
Post-silicon validation and debug
Digital fault modeling and simulation
Delay, current-based, low-power test
ATPG, BIST, DFT, and compression
Memory test and repair
Core, board, system, and 3D IC test
2.3 Cell-Library Design, Partitioning, Floorplanning, Placement

Cell-library design and optimization
Transistor and gate sizing
High-level physical design and synthesis
Estimation and hierarchy management
2D and 3D partitioning, floorplanning, and placement
Post-placement optimization
Buffer insertion and interconnect planning
2.4 Clock Network Synthesis, Routing, and Post-Layout Optimization and Verification

2D and 3D clock network synthesis
2D and 3D global and detailed routing
Package-/Board-level
Chip-package-board co-design
Post-layout/-silicon optimization
Layout and routing issues for optical interconnects
2.5 Design for Manufacturability and Design for Reliability

Process technology characterization, extraction, and modeling
CAD for design/manufacturing interfaces
CAD for reticle enhancement and lithography-related design
Variability analysis and statistical design and optimization
Yield estimation and design for yield
Physical verification and design rule checking
Machine learning for smart manufacturing and process control
Analysis and optimization for device-level reliability issues
Analysis optimization for interconnect reliability issues
Reliability issues related to soft errors
Design for resilience and robustness
2.6 Timing, Power and Signal Integrity Analysis and Optimization

Deterministic and statistical static timing analysis, optimization
Power and leakage analysis and optimization
Circuit and interconnect-level low power design issues
Power/ground network analysis and synthesis
Signal integrity analysis and optimization
2.7 CAD for Analog/Mixed-Signal/RF and Multi-Domain Modeling

Analog, mixed-signal, and RF noise modeling, simulation, test
Electromagnetic simulation and optimization
Device, interconnect and circuit extraction and simulation
Behavior modeling of devices and interconnect
Package modeling and analysis
Modeling of complex dynamical systems (molecular dynamics, fluid dynamics, computational finance, etc.)

3.1 Bio-inspired and Neuromorphic Computing, Biological Systems and Electronics, and New Computing Paradigms

Network and neuron models
Devices and hardware for neuromorphic computing
Non-von Neumann architectures
PEvent or spike-based hardware systems
CAD for biological computing systems
CAD for synthetic biology
CAD for bio-electronic devices, bio-sensors, MEMS Systems

3.2 Nanoscale and Post-CMOS Systems

New device structures and process technologies
New memory technologies (flash, PCM, STT-RAM, memristor)
Nanotechnologies, nanowires, nanotubes, graphene, etc.
Quantum computing
CAD for mixed-domain (semiconductor, nanoelectronic, MEMS, and electro-optical) devices, circuits, and systems
CAD for nanophotonics and optical devices/ communication
DFM and reliability issues for emerging devices (3D, Nanophotonics, non-volatile logic/memory, etc.)
Device, interconnect and circuit extraction and simulation
Behavior modeling of devices and interconnect
Package modeling and analysis
Modeling of complex dynamical systems (molecular dynamics, fluid dynamics, computational finance, etc.)

Overview

This comprehensive ranking presents an authoritative list of scientific conferences in the field of Computer Science, meticulously curated by Research.com—one of the leading platforms for science research across all major disciplines. Since 2014, Research.com has been dedicated to providing trusted, data-driven insights into scientific contributions, with a rigorous commitment to accuracy and reliability.

The position of each conference in this ranking is determined by a unique bibliometric score, developed by Research.com. This score is calculated using both the estimated h-index and the number of leading scientists who have participated in the conference over the preceding three years, ensuring a nuanced and robust measure of academic impact. The Impact Score values featured herein were last collected on 2024-11-27, offering an up-to-date reflection of the current landscape.

The ranking is the result of an exhaustive analysis process. Experts at Research.com reviewed data from over 2,742 scientific conferences, selected through an exceptionally thorough inspection and critical examination of more than 148,739 scientific documents published within the last three years. These publications were authored by a distinguished cohort of 13,184 leading and well-respected scientists in the Computer Science domain, underscoring the academic rigor and depth underpinning this ranking.

To better understand the detailed methodology and analytical framework employed in the computation of conference ranking scores, we invite you to consult our Methodology Page.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing at International Conference on Computer Aided Design (based on the number of publications) are:

  • Alberto Sangiovanni-Vincentelli (78 papers) absent at the last edition,
  • Robert K. Brayton (73 papers) absent at the last edition,
  • Yao-Wen Chang (72 papers) published 2 papers at the last edition, 2 less than at the previous edition,
  • Jason Cong (70 papers) published 2 papers at the last edition, 1 more than at the previous edition,
  • David Z. Pan (57 papers) published 5 papers at the last edition, 1 less than at the previous edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing at International Conference on Computer Aided Design (based on the number of publications) are:

  • IBM (297 papers) published 5 papers at the last edition, 3 more than at the previous edition,
  • University of California, Berkeley (253 papers) absent at the last edition,
  • University of Illinois at Urbana–Champaign (212 papers) published 3 papers at the last edition, 2 more than at the previous edition,
  • University of California, Los Angeles (182 papers) published 3 papers at the last edition, 2 less than at the previous edition,
  • Carnegie Mellon University (181 papers) published 1 paper at the last edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2020 edition, 2.14% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 20.22% were posted by at least one author from the top 10 institutions publishing at the conference. Another 14.21% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 29.51% of all publications and 36.07% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

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