International Symposium on Electromagnetic Compatibility, Signal, and Power Integrity (EMC)

The IEEE EMC Society’s Technical and Special Committees encompass most but not all of the possible topics of interest. These Committees are responsible for sponsoring Symposium content and reviewing papers within their scope. The Committees, their scopes, and their primary topics of interest are listed below:



TC-1 EMC Management

Personnel & Laboratory Accreditation
EMC Education
Legal Issues
TC-2 EMC Measurements

Test Instrumentation & Facilities
Measurement Techniques
Standards and Regulations
Measurement Uncertainty
TC-3 EM Environment

EM Signal Environment
Atmospheric & Man-Made Noise
Characterization of the EM environment
TC-4 EM Interference Control

Shielding, Gasketing & Filtering
Cables and Connectors
Circuit & System EMC Analysis
Grounding
PCB Layout
TC-5 High Power Electromagnetics

ESD & Transients
EMP, IEMI & Lightning
Information Leakage
Electric Power EMC
TC-6 Spectrum Engineering

Spectrum Characterization and Modeling
Design for Spectrally Efficient Systems
Adaptive Interference Mitigation
TC-7 Low Frequency EMC

Power Quality and Power System EMC
Conducted Emissions Due to Power Converters
Transportation and Electrical Vehicles
Renewables and Smart Grid
Topics for Future Standardization
TC-8 Aeronautics and Space EMC

Aircraft
Atmospheric environment
Drones (Unmanned Aerial Vehicles)
Spacecraft
Space Environment
Launch Vehicles
Missiles
Other Aerospace Topic
TC-9 Computational Electromagnetics

Computer Modeling and Circuit Simulation Methods
Multi-Physics Techniques, Tools and Applications
SI/PI/EMC Co-Simulation
Best Practice and Validation Methods
Surrogate Modeling and Optimization Techniques
Design of Experiments (DoE) and Statistical Analysis
TC-10 Signal and Power Integrity

High-Speed Interconnects
Device Modeling & Characterization
Crosstalk, Jitter, Noise Coupling, BER Analysis
3D IC & TSV
Power Distribution Networks & Decoupling
SI/PI/EMI Co-Design
Simulation and Modeling Techniques
Chip-level Advanced Packaging
Topics for Future Standardization
TC-11 Nanotechnology & Advanced Materials

Nanomaterials & Nanostructures
Smart Materials
Topics for Future Standardization
TC-12 EMC for Emerging Wireless Technologies

EMC Planning/Testing/Specifications
Wireless Coexistence
Intra-System Interference
RF Desense
SC-1 Smart Grid EMC

Renewable Generation
Grid Communications
SC-5 Power Electronics EMC

AC/DC, DC/DC, DC/AC and AC/DC Power Conversion
Passive Components and Semiconductor Devices
Automotive, Aerospace, and Communication Systems, Wireless Power Transfer
Wireless Power Transfer
Medical, Aviation, Consumer Electronics and Power Applications
Topics for Future Standardization