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28th Asia and South Pacific Design Automation Conference

28th Asia and South Pacific Design Automation Conference (ASPDAC)

Name: Asia and South Pacific Design Automation Conference
Start: 2023-01-16
End: 2023-01-19
Location: Tokyo

Location: Tokyo , Japan

Submission deadline: 7/24/2022

Conference dates: 1/16/2023 - 1/19/2023

Research H-index

Official website

Ranking & Metrics

Discipline name	Position	Best Scientists	Publications	D-Index
Electronics and Electrical Engineering	31	87	201	22
Computer Science	96	112	240	24

Call for Papers

Original papers in, but not limited to, the following areas are invited.

1 System-Level Modeling and Design Methodology:
1.1. HW/SW co-design, co-simulation and co-verification
1.2. System-level design exploration, synthesis, and optimization
1.3. System-level formal verification
1.4. System-level modeling, simulation and validation
1.5. Networks-on-chip and NoC-based system design
2 Embedded, Cyberphysical (CSP) and IoT Systems:
2.1. Many- and multi-core SoC architecture
2.2. IP/platform-based SoC design
2.3. Domain-specific architecture
2.4. Dependable architecture
2.5. Cyber physical system
2.6. Internet of things
3 Embedded Systems Software:
3.1. Kernel, middleware, and virtual machine
3.2. Compiler and toolchain
3.3. Real-time system
3.4. Resource allocation for heterogeneous computing platform
3.5. Storage software and application
3.6. Human-computer interface
4 Memory Architecture and Near/In Memory Computing:
4.1. Storage system and memory architecture
4.2. On-chip memory architectures and management: Scratchpads, compiler, controlled memories, etc.
4.3. Memory/storage hierarchies with emerging memory technologies
4.4. Near-memory and in-memory computing
4.5. Memory architecture and management for emerging memory technologies
5 AI/Machine Learning Circuits, Architecture, System Designs and Applications:
5.1. Hardware and devices for deep neural networks
5.2. Design method for learning on a chip
5.3. Systems and design methods for deep neural computing
5.4. Neural network acceleration co-design techniques
5.5. Design techniques for AI of Things
5.6. Novel reconfigurable architectures including FPGAs for AI/MLs
5.7. Efficient ML training and inference
6 Photonic/RF/Analog-Mixed Signal Design:
6.1. Analog/mixed-signal/RF synthesis
6.2. Analog layout, verification, and simulation techniques
6.3. High-frequency electromagnetic simulation of circuit
6.4. Mixed-signal design consideration
6.5. Communication and computing using photonics
7 Approximate, Bio-Inspired and Neuromorphic Computing:
7.1. Circuit and system techniques for approximate and stochastic computing
7.2. Neuromorphic computing
7.3. CAD for approximate and stochastic systems
7.4. CAD for bio-inspired and neuromorphic systems
8 High-Level, Behavioral, and Logic Synthesis and Optimization:
8.1. High-level/Behavioral synthesis tool and methodology
8.2. Combinational, sequential and asynchronous logic synthesis
8.3. Technology mapping, resource scheduling, allocation and synthesis
8.4. Functional and logic timing ECO (Engineering change order)
8.5. Interaction between logic synthesis and physical design
9 Physical Design and Timing Analysis:
9.1. Floorplanning, partitioning and placement and routing optimization
9.2. Interconnect planning and synthesis
9.3. Clock network synthesis
9.4. Post layout and post-silicon optimization
9.5. Package/PCB/3D-IC routing
9.6. Extraction, TSV and package modeling
9.7. Deterministic/statistical timing analysis and optimization
9.8. Signal/Power integrity, EM modeling and analysis
10 Design for Manufacturability/Reliability and Low Power:
10.1. Reticle enhancement, lithography-related design and optimization
10.2. Resilience under manufacturing variation
10.3. Design for manufacturability, yield, and defect tolerance
10.4. Reliability, robustness, aging and soft error analysis
10.5. Power modeling, analysis and simulation
10.6. Low-power design and optimization at circuit and system levels
10.7. Thermal aware design and dynamic thermal management
10.8. Energy harvesting and battery management
11 Testing, Validation, Simulation, and Verification:
11.1. ATPG, BIST and DFT
11.2. System test and 3D IC test, Online test and fault tolerance
11.3. Memory test and repair
11.4. RTL and gate-leveling modeling, simulation, and verification
11.5. Circuit-level formal verification
11.6. Device/circuit-level simulation tool and methodology
12 Hardware and Embedded Security:
12.1. Hardware-based security
12.2. Detection and prevention of hardware Trojans
12.3. Side-channel attacks, fault attacks and countermeasures
12.4. Design and CAD for security
12.5. Cyberphysical system security
12.6. Nanoelectronic security
12.7. Supply chain security and anti-counterfeiting
13 Emerging Devices, Technologies and Applications:
13.1. Quantum and Ising computing
13.2. Nanotechnology, MEMS
13.3. Biomedical, biochip, and biodata processing
13.4. Edge, fog and cloud computing
13.5. Energy-storage/smart-grid/smart-building design and optimization
13.6. Automotive system design and optimization
13.7. New transistor/device and process technology: spintronic, phase-change, single-electron etc

Overview

This ranking showcases a comprehensive evaluation of scientific conferences within the field of Engineering and Technology. Developed by Research.com—one of the leading platforms committed to facilitating scientific research discoveries and providing reliable data on scientific contributions since 2014—the current list offers a trusted perspective on the most influential conferences in the discipline.

Each conference’s position in the ranking is determined by a proprietary bibliometric score, uniquely formulated by Research.com. This score is calculated based on a combination of the estimated h-index and the number of distinguished scientists who have participated in each conference over the preceding three years, ensuring that the impact and prestige of each event are rigorously assessed.

The results presented here incorporate Impact Score values as collected on 2024-11-27. The ranking process involved an exhaustive review of more than 2,262 conferences, carefully selected following a meticulous evaluation of over 26,934 scientific documents. These documents were published within the last three years by 9,385 esteemed and widely respected scientists in the fields of Engineering and Technology.

For further details regarding the precise methodology and underlying data used to compute the ranking scores, please refer to our Methodology Page.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

Top authors and change over time

The top authors publishing at Asia and South Pacific Design Automation Conference (based on the number of publications) are:

David Z. Pan (31 papers) published 7 papers at the last edition, 5 more than at the previous edition,
Yuan Xie (26 papers) published 1 paper at the last edition the same number as at the previous edition,
Yu Wang (24 papers) published 3 papers at the last edition, 2 more than at the previous edition,
Martin D. F. Wong (22 papers) absent at the last edition,
Kenichi Okada (21 papers) absent at the last edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Top affiliations and change over time

Only papers with recognized affiliations are considered

The top affiliations publishing at Asia and South Pacific Design Automation Conference (based on the number of publications) are:

Tsinghua University (87 papers) published 5 papers at the last edition, 3 less than at the previous edition,
National Tsing Hua University (65 papers) published 4 papers at the last edition, 5 less than at the previous edition,
National Taiwan University (54 papers) published 3 papers at the last edition, 4 less than at the previous edition,
National Chiao Tung University (51 papers) published 4 papers at the last edition the same number as at the previous edition,
University of Texas at Austin (47 papers) published 7 papers at the last edition, 5 more than at the previous edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2019 edition, 1.53% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 23.26% were posted by at least one author from the top 10 institutions publishing at the conference. Another 8.53% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 29.46% of all publications and 38.76% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

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