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IEEE

25th International Interconnect Technology Conference (IITC)

Location: San Jose , United States

Submission deadline: 3/28/2022

Conference dates: 6/27/2022 - 6/30/2022

Research H-index
7

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Materials Science 38 28 43 5
Electronics and Electrical Engineering 327 30 37 6
Engineering and Technology 278 9 14 3

Call for Papers

Applications of Interest

Advanced interconnects: low-k interconnects, optical, wireless, and carbon-based interconnects, 1D/2D interconnects, beyond Cu
Contacts on MOS devices: Silicide, III-V, 2D materials
Memory architecture: CBRAM, PCRAM, ReRAM, MRAM, FeRAM, DRAM, 3DNAND
3D integration & packaging concerns: WtW/CtW bonding, Interposer, Through Si Via, Non-destructive, high throughput methods to identify defects, CPI, backside power distribution net
Novel System and Emerging Technology: Energy harvesting, brain-inspired computing
Novel Form Factors: flexible electronics, wearables
Topics of Interest

Process integration, advanced patterning for MOL/BEOL
Materials and Unit Processes (Dielectrics, metals, barriers, Wet, CMP, PVD, CVD, ALD, selective deposition/SAMs, patterning)
Reliability and Failure analysis, characterization, techniques, and methods
Advanced material/process characterization, design-technology co-optimization, and modelling techniques

Overview

This ranking presents a comprehensive list of the leading scientific conferences in the field of Engineering and Technology. It has been meticulously compiled by Research.com, a prominent authority on science research and trusted provider of scientific data since 2014. The conferences featured have been evaluated based on their significant contributions to the advancement of Engineering and Technology research.

Each conference’s position in the ranking is determined using Research.com's unique bibliometric score, an advanced metric that integrates both the estimated h-index and the number of leading scientists who have participated in the conference over the previous three years. The Impact Score values included in this ranking were collected as of 2024-11-27, ensuring the most recent and relevant evaluation of conference impact.

The creation of this ranking involved an in-depth analysis of more than 2,262 conferences. These conferences were selected after a rigorous, multi-stage assessment process, which entailed a thorough review of 26,934 scientific documents published in the last three years by a distinguished cohort of 9,385 leading scientists in Engineering and Technology. This extensive research and evaluation bring forth a ranking that reflects both scholarly excellence and meaningful impact within the field.

For further details regarding the methodology and computation of the ranking scores, please visit our Methodology Page.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing at International Interconnect Technology Conference (based on the number of publications) are:

  • James D. Meindl (34 papers) absent at the last edition,
  • Yoshihiro Hayashi (25 papers) absent at the last edition,
  • Karen Maex (23 papers) absent at the last edition,
  • Paul S. Ho (20 papers) absent at the last edition,
  • Zsolt Tokei (20 papers) published 3 papers at the last edition, 1 more than at the previous edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing at International Interconnect Technology Conference (based on the number of publications) are:

  • Katholieke Universiteit Leuven (89 papers) published 10 papers at the last edition, 2 more than at the previous edition,
  • IBM (78 papers) published 14 papers at the last edition, 10 more than at the previous edition,
  • Georgia Institute of Technology (54 papers) published 1 paper at the last edition, 4 less than at the previous edition,
  • STMicroelectronics (40 papers) absent at the last edition,
  • Toshiba (39 papers) absent at the last edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2017 edition, 4.26% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 60.00% were posted by at least one author from the top 10 institutions publishing at the conference. Another 20.00% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 6.67% of all publications and 13.33% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

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