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IEEE

24th Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2022) (DTIP)

Location: Pont-à-Mousson , France

Conference dates: 7/11/2022 - 7/13/2022

Research H-index
2

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Materials Science 200 4 5 1
Electronics and Electrical Engineering 905 5 6 1

Call for Papers

NVITATION TO PARTICIPATE
DTIP'2022 will be the 24th anniversary edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique event brings together participants interested in MEMS/MOEMS processing and those interested in design tools and methods to facilitate the design of MEMS/MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems are addressed in two main Conferences, Special Sessions and Invited Talks. Papers presented at the conference will appear in IEEE Xplore and extended version of the presented papers may be submitted for inclusion in a special issue of an indexed journal.

We look forward to welcoming you in Pont-A-Mouson next summer.

Emile Martincic & Pascal Nouet

Research paper submission
DTIP aims to present the latest research in “Design, Integration, Test and Packaging of MEMS and MOEMS”. A program committee composed with international experts in their field will review all submitted papers. Even if abstracts of about 600 words will be considered, it is highly recommended to submit extended abstracts (up to 1500 words) plus one page of figures for efficient and fair scientific reviewing. Detailed instructions regarding electronic submissions are posted on the DTIP website.
Note: Companies that want to advertise their products are discouraged to submit a research paper if there is no revelation of any scientific contribution or rupture with respect to the state-of-the-art. In that later case, it is recommended to consider becoming a sponsor/exhibitor of the conference.

>>> Link to the DTIP authors instructions webpage <<<

>>> Link to the submission website <<<

Special sessions
For those of you, who intend to propose a special session, feel free to propose a topic by email ([email protected]) at your earliest convenience. When proposing a special session, please mention how many submissions are expected. Special session organizers will be in charge of attracting papers, organizing the review and making the final selection with the support of the DTIP organization. The coupling of a special session with an invited talk is strongly recommended.

Invited talks and panels
The symposium program will include three plenary sessions with invited talks and/or technical panels. Feel free to propose topics to be addressed and/or to nominate colleagues for an invited talk at: [email protected].

Venue and important dates
The 2022’s edition of DTIP will be held in Pont-A-Mousson, France, from July 11th to 13th, in an amazing abbey by the Moselle river.
Important dates are:
Extended paper Submission Deadline: April 3rd, 2022.
Notification of Acceptance: May 28th, 2022.
Early bird registration: April 12th, 2022.
Camera ready submission: July 8th, 2022.

Overview

This ranking presents a comprehensive evaluation of scientific conferences within the field of Electronics and Electrical Engineering. Developed by Research.com, recognized as one of the leading websites for science research across all major disciplines, it has been providing trusted data on scientific contributions since 2014. The ranking aims to offer researchers, academics, and professionals a transparent measure of academic excellence and impact among conferences in this domain.

The position of each conference in this ranking is determined by a unique bibliometric score, meticulously constructed by Research.com. This exclusive score is derived from a combination of the estimated h-index and the number of leading scientists who have contributed to the conference in the three most recent years. The dataset underpinning the ranking is robust: more than 2,204 conferences were reviewed after a comprehensive selection process, which included the detailed examination of over 95,378 scientific documents published in the last three years by 6,160 leading and widely respected scientists in Electronics and Electrical Engineering.

All Impact Score values featured in this ranking were collected as of 2024-11-27, ensuring the most up-to-date and relevant data are reflected. The rigorous approach and depth of analysis applied by subject matter experts guarantee an accurate and credible assessment of scientific impact and leadership within the field.

For further details regarding the methodology behind the computation of ranking scores and the selection procedure, please refer to our Methodology Page.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing at Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (based on the number of publications) are:

  • Toshihiro Itoh (32 papers) published 3 papers at the last edition, 1 more than at the previous edition,
  • Ryutaro Maeda (30 papers) published 2 papers at the last edition, 1 more than at the previous edition,
  • Arturo A. Ayon (17 papers) published 2 papers at the last edition the same number as at the previous edition,
  • Hsiharng Yang (15 papers) published 1 paper at the last edition the same number as at the previous edition,
  • Romolo Marcelli (15 papers) published 2 papers at the last edition the same number as at the previous edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing at Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (based on the number of publications) are:

  • National Chung Hsing University (40 papers) published 2 papers at the last edition the same number as at the previous edition,
  • National Institute of Advanced Industrial Science and Technology (35 papers) published 3 papers at the last edition the same number as at the previous edition,
  • Centre national de la recherche scientifique (31 papers) published 5 papers at the last edition the same number as at the previous edition,
  • University of Tokyo (25 papers) published 8 papers at the last edition, 6 more than at the previous edition,
  • Budapest University of Technology and Economics (22 papers) published 3 papers at the last edition the same number as at the previous edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2017 edition, 5.17% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 43.64% were posted by at least one author from the top 10 institutions publishing at the conference. Another 10.91% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 29.09% of all publications and 16.36% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

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