The chart shows the distribution of publications by all Research.com ranked scientists in the field of Materials Science in 2026. The highlighted bar marks where Yanzhong Pei sits on this spectrum.
This scientist: 191 publications — 27th percentile
27% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 1,163 publications or more.
The chart shows the D-index (discipline H-index) distribution of Materials Science scientists ranked by Research.com in 2026. The highlighted bar marks where Yanzhong Pei sits on this spectrum.
This scientist: 87 D-Index — 85th percentile
85% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 165 D-Index or more.
Yanzhong Pei is affiliated with Tongji University in China and has a research profile primarily focused on materials science and engineering. Their publication record spans significant work in materials chemistry, electrical and electronic engineering, and aspects of civil and structural engineering.
The scientist's research interests center around advanced thermoelectric materials and devices, thermal properties of materials, thermal radiation and cooling technologies, chalcogenide semiconductor thin films, advanced thermodynamics and statistical mechanics, thermal expansion and ionic conductivity, as well as phase-change materials and chalcogenides.
Frequent coauthors in their publications include Wen Li, Zhiwei Chen, Xinyue Zhang, Siqi Lin, and Zhonglin Bu. These collaborations have contributed to a broad range of research outputs in related fields.
Yanzhong Pei's work is published in several notable venues, the most prominent being Materials Today Physics with 17 publications, followed by Nature Communications, Journal of Materials Chemistry A, SSRN Electronic Journal, and Advanced Materials.
Selected recent papers illustrate the scope and impact of their research:
The scientist's research integrates experimental and theoretical approaches to enhance the understanding and development of thermoelectric materials, targeting improvements in efficiency and device performance.
Yanzhong Pei;Xiaoya Shi;Aaron LaLonde;Heng Wang
Yanzhong Pei;Heng Wang;G. J. Snyder
Yanzhong Pei;Aaron LaLonde;Shiho Iwanaga;G. Jeffrey Snyder
Yanzhong Pei;Aaron D. LaLonde;Heng Wang;G. Jeffrey Snyder
Yanzhong Pei;Jessica Lensch-Falk;Eric S. Toberer;Douglas L. Medlin
Aaron D. LaLonde;Yanzhong Pei;Heng Wang;G. Jeffrey Snyder
Heng Wang;Yanzhong Pei;Aaron D. LaLonde;G. Jeffrey Snyder
Zhiwei Chen;Xinyue Zhang;Yanzhong Pei
Zhiwei Chen;Zhengzhong Jian;Wen Li;Yunjie Chang
Juan Li;Xinyue Zhang;Zhiwei Chen;Siqi Lin
Aaron D. LaLonde;Yanzhong Pei;G. Jeffrey Snyder
Yixuan Wu;Zhiwei Chen;Pengfei Nan;Fen Xiong
Zhiwei Chen;Binghui Ge;Wen Li;Siqi Lin
Yanhua Jia;Qinglin Jiang;Hengda Sun;Peipei Liu
Yanzhong Pei;Aaron D. LaLonde;Nicholas A. Heinz;Xiaoya Shi
Siqi Lin;Wen Li;Zhiwei Chen;Jiawen Shen
Heng Wang;Yanzhong Pei;Aaron D. LaLonde;G. Jeffrey Snyder
Hanhui Xie;Heng Wang;Yanzhong Pei;Chenguang Fu
Yanzhong Pei;Zachary M. Gibbs;Andrei Gloskovskii;Benjamin Balke
Wen Li;Linglang Zheng;Binghui Ge;Siqi Lin
Douglas L. Medlin;Jessica Leigh Lensch-Falk;Yanzhong Pei;G. Jeffrey Snyder
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