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Engineering and Technology

D-Index
31
Citations
6096
World Ranking
9644
National Ranking
2744

Overview

Matthew A. Hopcroft is affiliated with the University of California, Berkeley in the United States. Their research spans multiple fields including Biochemistry, Genetics and Molecular Biology, and Engineering, with particular focus on Cell Biology, Biomedical Engineering, Molecular Biology, Mechanical Engineering, and Atomic and Molecular Physics, and Optics.

The primary research topics covered by Matthew A. Hopcroft include:

  • Cellular Mechanics and Interactions
  • 3D Printing in Biomedical Research
  • Microfluidic and Bio-sensing Technologies
  • Force Microscopy Techniques and Applications
  • Advanced Electron Microscopy Techniques and Applications
  • Heat shock proteins research
  • Cell Adhesion Molecules Research

Matthew A. Hopcroft has contributed to studies that explore cellular mechanics and cell-cell signaling as well as mechanotransduction processes in epithelial tissues. Their recent publications include:

  • "An Easy-to-Fabricate Cell Stretcher Reveals Density-Dependent Mechanical Regulation of Collective Cell Movements in Epithelia," 2021, Cellular and Molecular Bioengineering
  • "Morphological control enables nanometer-scale dissection of cell-cell signaling complexes," 2022, Nature Communications
  • "E-cadherin mechanotransduction activates EGFR-ERK signaling in epithelial monolayers by inducing ADAM-mediated ligand shedding," 2025, Science Signaling
  • "Correction to: An Easy-to-Fabricate Cell Stretcher Reveals Density-Dependent Mechanical Regulation of Collective Cell Movements in Epithelia," 2021, PubMed
  • "E-cadherin mechanotransduction activates EGFR-ERK signaling in epithelial cells by inducing ADAM-mediated ligand shedding," 2025, bioRxiv (Cold Spring Harbor Laboratory)

The scientist collaborates regularly with a number of researchers in related fields. Frequent coauthors include Beth L. Pruitt, Joo Yong Sim, Kevin C. Hart, Daniel J. Cohen, and Jiongyi Tan. The venues where Matthew A. Hopcroft has published reflect interdisciplinary engagement and include Cellular and Molecular Bioengineering, Nature Communications, Science Signaling, PubMed, and bioRxiv (Cold Spring Harbor Laboratory).

Best Publications

  • What is the Young's Modulus of Silicon?

    M.A. Hopcroft;W.D. Nix;T.W. Kenny

  • Temperature Dependence of Quality Factor in MEMS Resonators

    Bongsang Kim;M.A. Hopcroft;R.N. Candler;C.M. Jha

  • Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators

    R.N. Candler;M.A. Hopcroft;Bongsang Kim;Woo-Tae Park

  • Temperature-Insensitive Composite Micromechanical Resonators

    R. Melamud;S.A. Chandorkar;Bongsang Kim;Hyung Kyu Lee

  • Temperature-compensated aluminum nitride lamb wave resonators

    Chih-ming Lin;Ting-ta Yen;Yun-ju Lai;V.V. Felmetsger

  • Frequency stability of wafer-scale film encapsulated silicon based MEMS resonators

    Bongsang Kim;Rob N. Candler;Matthew A. Hopcroft;Manu Agarwal

  • Impact of geometry on thermoelastic dissipation in micromechanical resonant beams

    R.N. Candler;A. Duwel;M. Varghese;S.A. Chandorkar

  • Micromechanical testing of SU-8 cantilevers

    Matthew Hopcroft;Tobias Kramer;Gyuman Kim;Gyuman Kim;Kazuki Takashima

  • Temperature-compensated high-stability silicon resonators

    Renata Melamud;Bongsang Kim;Saurabh A. Chandorkar;Matthew A. Hopcroft

  • Thermally compensated aluminum nitride Lamb wave resonators for high temperature applications

    Chih-Ming Lin;Ting-Ta Yen;Valery V. Felmetsger;Matthew A. Hopcroft

  • Thermal Isolation of Encapsulated MEMS Resonators

    C.M. Jha;M.A. Hopcroft;S.A. Chandorkar;J.C. Salvia

  • Using the temperature dependence of resonator quality factor as a thermometer

    M. A. Hopcroft;B. Kim;S. Chandorkar;R. Melamud

  • Optimal drive condition for nonlinearity reduction in electrostatic microresonators

    Manu Agarwal;Saurabh A. Chandorkar;Rob N. Candler;Bongsang Kim

  • AlN thin films grown on epitaxial 3C–SiC (100) for piezoelectric resonant devices

    Chih-Ming Lin;Wei-Cheng Lien;Valery V. Felmetsger;Matthew A. Hopcroft

  • Effects of stress on the temperature coefficient of frequency in double clamped resonators

    R. Melamud;M. Hopcroft;C. Jha;Bongsang Kim

  • Frequency stability of wafer-scale encapsulated MEMS resonators

    Bongsang Kim;R.N. Candler;M. Hopcroft;M. Agarwal

  • Cmos-Compatible Dual-Resonator MEMS Temperature Sensor with Milli-Degree Accuracy

    C.M. Jha;G. Bahl;R. Melamud;S.A. Chandorkar

  • High resolution microresonator-based digital temperature sensor

    C. M. Jha;G. Bahl;R. Melamud;S. A. Chandorkar

  • Scaling of amplitude-frequency-dependence nonlinearities in electrostatically transduced microresonators

    Manu Agarwal;Harsh Mehta;Robert N. Candler;Saurabh A. Chandorkar

  • Composite flexural-mode resonator with controllable turnover temperature

    R. Melamud;Bongsang Kim;M.A. Hopcroft;S. Chandorkar

  • A study of electrostatic force nonlinearities in resonant microstructures

    Manu Agarwal;Saurabh A. Chandorkar;Harsh Mehta;Robert N. Candler

  • Temperature Dependence of Quality Factor in MEMS Resonators

    B. Kim;C.M. Jha;T. White;R.N. Candler

Frequent Co-Authors

Thomas W. Kenny
Thomas W. Kenny Stanford University
Rob N. Candler
Rob N. Candler University of California, Los Angeles
Albert P. Pisano
Albert P. Pisano University of California, San Diego
Boris Murmann
Boris Murmann University of Hawaii at Manoa
Beth L. Pruitt
Beth L. Pruitt University of California, Santa Barbara
Sharad Singhal
Sharad Singhal Hewlett-Packard (United States)
Jerome Rolia
Jerome Rolia Hewlett-Packard (United States)
W. James Nelson
W. James Nelson Stanford University
Roger T. Howe
Roger T. Howe Stanford University

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