World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
33
Citations
4106
World Ranking
6124
National Ranking
177

Overview

Mario Kupnik is affiliated with the Technical University of Darmstadt in Germany. Their work is situated primarily within the field of engineering, with a focused exploration of various subfields including biomedical engineering, mechanical engineering, mechanics of materials, electrical and electronic engineering, and human-computer interaction.

The research portfolio of Mario Kupnik spans a range of topics largely centered around sensor technology, acoustic methods, and material science. Key topics of their publications include:

  • Advanced Sensor and Energy Harvesting Materials
  • Ultrasonics and Acoustic Wave Propagation
  • Dielectric materials and actuators
  • Acoustic Wave Phenomena Research
  • Innovative Energy Harvesting Technologies
  • Ultrasound Imaging and Elastography
  • Muscle activation and electromyography studies

Kupnik has contributed to numerous scientific papers, several of which have been published in established venues. Recent publications include:

  • "Real-Time 3-D Imaging Using an Air-Coupled Ultrasonic Phased-Array" (2020), IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control
  • "Biodegradable cellular polylactic acid ferroelectrets with strong longitudinal and transverse piezoelectricity" (2020), Applied Physics Letters
  • "Review of the effects of soft robotic gloves for activity-based rehabilitation in individuals with reduced hand function and manual dexterity following a neurological event" (2020), Journal of Rehabilitation and Assistive Technologies Engineering
  • "Acousto-optic modulation of gigawatt-scale laser pulses in ambient air" (2023), Nature Photonics
  • "High performance fluorinated polyethylene propylene ferroelectrets with an air-filled parallel-tunnel structure" (2020), Smart Materials and Structures

The scientist has published frequently in venues such as:

  • 2022 IEEE International Ultrasonics Symposium (IUS)
  • IEEE Sensors Journal
  • IEEE Open Journal of Ultrasonics Ferroelectrics and Frequency Control
  • IEEE Sensors Letters
  • 2022 IEEE Sensors

Collaboration is a significant aspect of their research. Frequent coauthors include Matthias Rutsch, Heinz von Seggern, Gianni Allevato, G. M. Sessler, and Christoph Haugwitz, each contributing to numerous joint papers.

Best Publications

  • Analytically calculating membrane displacement and the equivalent circuit model of a circular CMUT cell

    I.O. Wygant;M. Kupnik;B.T. Khuri-Yakub

  • 50 kHz capacitive micromachined ultrasonic transducers for generation of highly directional sound with parametric arrays

    I.O. Wygant;M. Kupnik;J.C. Windsor;W.M. Wright

  • Experimental characterization of collapse-mode CMUT operation

    O. Oralkan;B. Bayram;G.G. Yaralioglu;A.S. Ergun

  • Fabrication of Capacitive Micromachined Ultrasonic Transducers via Local Oxidation and Direct Wafer Bonding

    Kwan Kyu Park;Hyunjoo Lee;M Kupnik;Butrus T Khuri-Yakub

  • Capacitive micromachined ultrasonic transducers for chemical detection in nitrogen

    K. K. Park;Hyunjoo Jenny Lee;G. G. Yaralioglu;A. S. Ergun

  • Finite element modeling and experimental characterization of crosstalk in 1-D CMUT arrays

    B. Bayram;M. Kupnik;G.G. Yaralioglu;O. Oralkan

  • Capacitive micromachined ultrasonic transducer (CMUT) as a chemical sensor for DMMP detection

    Kwan Kyu Park;Hyunjoo Lee;Mario Kupnik;Ömer Oralkan

  • Chemical vapor detection using a capacitive micromachined ultrasonic transducer.

    Hyunjoo J. Lee;Kwan Kyu Park;Mario Kupnik;Ö. Oralkan

  • Next-gen ultrasound

    B. Khuri-yakub;O. Oralkan;M. Kupnik

  • Platypus: Indoor Localization and Identification through Sensing of Electric Potential Changes in Human Bodies

    Tobias Grosse-Puppendahl;Xavier Dellangnol;Christian Hatzfeld;Biying Fu

  • High-temperature electrostatic transducers and fabrication method

    Mario Kupnik;Butrus T. Khuri-Yakub

  • CMUT-based resonant gas sensor array for VOC detection with low operating voltage

    Sangjun Park;Inug Yoon;Sungwoo Lee;Hyojung Kim

  • Real-Time 3-D Imaging Using an Air-Coupled Ultrasonic Phased-Array

    Gianni Allevato;Jan Hinrichs;Matthias Rutsch;Jan Philipp Adler

  • Mesoporous Thin-Film on Highly-Sensitive Resonant Chemical Sensor for Relative Humidity and CO2 Detection

    Hyunjoo J. Lee;Kwan Kyu Park;Mario Kupnik;Nicholas A. Melosh

  • Fabrication of capacitive micromachined ultrasonic transducers by local oxidation

    Kwan Kyu Park;Mario Kupnik;Butrus T. Khuri-Yakub

  • Feasibility of MR-temperature mapping of ultrasonic heating from a CMUT

    S.H. Wong;R.D. Watkins;M. Kupnik;K.B. Pauly

  • Monolithic integrated CMUTs fabricated by low-temperature wafer bonding

    Mario Kupnik;Butrus T. Khuri-Yakub

  • Wafer-bonded 2-D CMUT arrays incorporating through-wafer trench-isolated interconnects with a supporting frame

    Xuefeng Zhuang;I. Wygant;Der-Song Lin;M. Kupnik

  • Functionalization layers for CO2 sensing using capacitive micromachined ultrasonic transducers

    Hyunjoo J. Lee;Kwan Kyu Park;Mario Kupnik;Butrus T. Khuri-Yakub

  • Biodegradable cellular polylactic acid ferroelectrets with strong longitudinal and transverse piezoelectricity

    Sergey Zhukov;Xingchen Ma;Heinz von Seggern;Gerhard M. Sessler

  • Fabricating capacitive micromachined ultrasonic transducers with direct wafer-bonding and LOCOS technology

    K.K. Park;H.J. Lee;M. Kupnik;O. Oralkan

  • Finite element analysis of stress stiffening effects in CMUTS

    M. Kupnik;I.O. Wygant;B.T. Khuri-Yakub

  • Review of the effects of soft robotic gloves for activity-based rehabilitation in individuals with reduced hand function and manual dexterity following a neurological event:

    Camille E Proulx;Myrka Beaulac;Mélissa David;Catryne Deguire

Frequent Co-Authors

Butrus T. Khuri-Yakub
Butrus T. Khuri-Yakub Stanford University
Omer Oralkan
Omer Oralkan North Carolina State University
Gerhard M. Sessler
Gerhard M. Sessler Technical University of Darmstadt
Heinz von Seggern
Heinz von Seggern Technical University of Darmstadt
Hans Peter Lang
Hans Peter Lang University of Basel
James K. Gimzewski
James K. Gimzewski University of California, Los Angeles

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