The chart shows the distribution of publications by all Research.com ranked scientists in the field of Engineering and Technology in 2026. The highlighted bar marks where Ki-Dong Lee sits on this spectrum.
This scientist: 131 publications — 19th percentile
19% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 804 publications or more.
The chart shows the D-index (discipline H-index) distribution of Engineering and Technology scientists ranked by Research.com in 2026. The highlighted bar marks where Ki-Dong Lee sits on this spectrum.
This scientist: 34 D-Index — 7th percentile
7% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 107 D-Index or more.
Ki-Dong Lee is affiliated with LG Corporation in South Korea and has contributed extensively to the field of engineering, with a particular focus on mechanical engineering and its applications. Their research encompasses a range of topics related to welding techniques, non-destructive testing, and robotics.
The scientist has published notable research papers including:
Ki-Dong Lee has collaborated frequently with other researchers, with the most common co-authors being:
Their work is often published in key venues, highlighting a consistent focus on welding and joining technologies as well as interdisciplinary studies within engineering. The frequent publication venues are:
Ki-Dong Lee's research fields are concentrated primarily in engineering, with specific subfields including mechanical engineering, mechanics of materials, industrial and manufacturing engineering, automotive engineering, and social psychology. These diverse subfields reflect a blend of technical and applied research interests.
The main topics of research explored include:
This combination of topics indicates an emphasis on practical applications in welding technologies and automation, alongside the integration of advanced sensing and machine learning methods. The presence of investigations in social psychology suggests some interdisciplinary concerns intersecting with broader engineering themes.
Seh-Won Ahn;Ki-Dong Lee;Jin-Sung Kim;Sang Hoon Kim
Hanbyul Seo;Ki-Dong Lee;Shinpei Yasukawa;Ying Peng
Hong-Shik Lee;Yeo-Taek Yoon;Sang-Shin Lee;Sang-Hoon Kim
Ki-Dong Lee;Sang Kim;Byung Yi
Dae-Seob Han;Ja-Yeon Kim;Seok-In Na;Sang-Hoon Kim
Sang Hoon Kim;Ki-Dong Lee;Ja-Yeon Kim;Min-Ki Kwon
Hyun Kyong Cho;Junho Jang;Jeong-Hyeon Choi;Jaewan Choi
A. M. Munshi;D. L. Dheeraj;V. T. Fauske;D. C. Kim
Yeo-Taek Yoon;Hong-Shik Lee;Sang-Shin Lee;Sang Hoon Kim
Sang Hoon Kim;Joo-Do Park;Ki-Dong Lee
Ja-Yeon Kim;Min-Ki Kwon;Ki-Sung Lee;Seong-Ju Park
Kidong Lee;Sanggook Kim
Kidong Lee;Sanggook Kim
Seh-Won Ahn;Ki-Dong Lee;Jin-Sung Kim;Sang Hoon Kim
Sang Gook Kim;Ki Dong Lee;Dong Wook Roh;Li-Hsiang Sun
Wondong Kim;Hanchul Kim;Geunseop Lee;Young-Kyu Hong
Christos Trompoukis;Islam Abdo;Romain Cariou;Ismael Cosme
Ki-Dong Lee;Li-Hsiang Sun
Seh Won Ahn;Ki Dong Lee;Sung Eun Lee;Sang Soo Yoon
Revak R. Tyagi;Frank Aurzada;Ki-Dong Lee;Sang G. Kim
Hong-Shik Lee;Yeo-Taek Yoon;Sang-Shin Lee;Sang-Hoon Kim
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