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D-Index & Metrics

Materials Science

D-Index
53
Citations
13721
World Ranking
9094
National Ranking
2214

Research.com Recognitions

  • 2003 - Von Hippel Award, Materials Research Society
  • 1986 - Fellow of John Simon Guggenheim Memorial Foundation

Overview

J.R. Weertman was affiliated with Northwestern University in the United States. The scientist's career involved contributions to academic research, although specific details regarding main fields of study, subfields, or main topics of work are not documented in the available data.

The record does not include any recent papers authored by the scientist, nor are there entries listing frequent co-authors or publication venues where their work appeared. Additionally, no book publications by J.R. Weertman are recorded in the source data.

Regarding recognition, J.R. Weertman received notable awards during their career. These include the Von Hippel Award from the Materials Research Society in 2003 and designation as a Fellow of the John Simon Guggenheim Memorial Foundation in 1986. The citations accompanying these awards were not specified.

J.R. Weertman is deceased. The information available does not specify the date of passing or provide detailed insight into the full scope of research contributions.

Best Publications

  • Elastic and tensile behavior of nanocrystalline copper and palladium

    P.G. Sanders;J.A. Eastman;J.R. Weertman

  • Mechanical behavior of nanocrystalline Cu and Pd

    G.W. Nieman;J.R. Weertman;R.W. Siegel

  • Theory of Steady-State Creep Based on Dislocation Climb

    Unknown

  • Dislocations, grain size and planar faults in nanostructured copper determined by high resolution X-ray diffraction and a new procedure of peak profile analysis

    T Ungár;S Ott;P.G Sanders;A Borbély

  • Steady-State Creep through Dislocation Climb

    Unknown

  • Structure and Mechanical Behavior of Bulk Nanocrystalline Materials

    J.R. Weertman;D. Farkas;K. Hemker;H. Kung

  • Rapid stress-driven grain coarsening in nanocrystalline Cu at ambient and cryogenic temperatures

    Kai Zhang;J. R. Weertman;J. A. Eastman

  • Deformation in nanocrystalline metals

    Helena Van Swygenhoven;Julia R. Weertman

  • Hall-Petch strengthening in nanocrystalline metals

    J.R. Weertman

  • Microsample tensile testing of nanocrystalline metals

    M. Legros;B. R. Elliott;M. N. Rittner;J. R. Weertman

  • Cyclic softening of ultrafine grain copper

    S.R Agnew;J.R Weertman

  • Controlled-size nanocapsules

    Vinayak P. Dravid;Jonathon J. Host;M. H. Teng;Brian Elliott Jinha Hwang

  • The strength of nanocrystalline metals with and without flaws

    Paul G. Sanders;C. J. Youngdahl;J. R. Weertman

  • Microhardness of nanocrystalline palladium and copper produced by inert-gas condensation

    G.W. Nieman;J.R. Weertman;R.W. Siegel

  • Grain-size dependent hardening and softening of nanocrystalline Cu and Pd

    G.E. Fougere;J.R. Weertman;R.W. Siegel;S. Kim

  • The influence of time, temperature, and grain size on indentation creep in high-purity nanocrystalline and ultrafine grain copper

    Kai Zhang;J. R. Weertman;J. A. Eastman

  • In-situ TEM tensile testing of DC magnetron sputtered and pulsed laser deposited Ni thin films

    R.C. Hugo;H. Kung;J.R. Weertman;R. Mitra

  • Overview of fatigue performance of Cu processed by severe plastic deformation

    S. R. Agnew;A. Yu. Vinogradov;S. Hashimoto;J. R. Weertman

  • Diffusion-controlled dislocation creep: a defense

    O.D. Sherby;J. Weertman

  • A dislocation model for twinning in f.c.c. metals

    Unknown

  • Mechanical behavior of nanocrystalline metals

    G.W. Nieman;J.R. Weertman;R.W. Siegel

  • Deformation behavior in nanocrystalline copper

    C.J Youngdahl;J.R Weertman;R.C Hugo;H.H Kung

  • Young's modulus of nanocrystalline Fe measured by nanoindentation

    G.E. Fougere;L. Riester;M. Ferber;J.R. Weertman

  • Tensile strength and creep properties of nanocrystalline palladium

    G.W. Nieman;J.R. Weertman;R.W. Siegel

  • Grain coarsening during compression of bulk nanocrystalline nickel and copper

    S. Brandstetter;Kai Zhang;A. Escuadro;J.R. Weertman

Frequent Co-Authors

Jeffrey A. Eastman
Jeffrey A. Eastman Argonne National Laboratory
Morris E. Fine
Morris E. Fine Northwestern University
Kevin J. Hemker
Kevin J. Hemker Johns Hopkins University
Sean R. Agnew
Sean R. Agnew University of Virginia
Vinayak P. Dravid
Vinayak P. Dravid Northwestern University
Thomas O. Mason
Thomas O. Mason Northwestern University
Tamás Ungár
Tamás Ungár Eötvös Loránd University
Ruslan Z. Valiev
Ruslan Z. Valiev Ufa State Aviation Technical University
Diana Farkas
Diana Farkas Virginia Tech
Andrea M. Hodge
Andrea M. Hodge University of Southern California

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