| Discipline name | Position | Best Scientists | Publications | D-Index |
|---|---|---|---|---|
| Electronics and Electrical Engineering | 172 | 126 | 323 | 20 |
| Mechanical and Aerospace Engineering | 227 | 37 | 90 | 12 |
| Materials Science | 383 | 65 | 113 | 18 |
IEEE Transactions on Components, Packaging and Manufacturing Technology focuses on Electronic engineering, Optoelectronics, Composite material, Electrical engineering and Soldering. While Electronic engineering is the focus of IEEE Transactions on Components, Packaging and Manufacturing Technology, it also provided insights into the studies of Chip, Printed circuit board, Integrated circuit, Electrical impedance and Interconnection. Optoelectronics, which encompasses Silicon, Insertion loss, Wafer, Light-emitting diode and Dielectric, is the main subject of the journal.
The in-depth study on Composite material also explores topics in the intersecting field of Temperature cycling. Soldering studies covered in IEEE Transactions on Components, Packaging and Manufacturing Technology falls within the purview of Metallurgy.
The most cited articles facilitate discussions on Electronic engineering, Optoelectronics, Electrical engineering, Composite material and Thermal resistance. The most cited papers focus on Electronic engineering but the discussions also offer insight into other areas such as Through-silicon via, Insertion loss and Integrated circuit. Issues in Optoelectronics were discussed in the most cited articles, taking into consideration concepts from other disciplines like Microstrip and Interposer.
The aim of the journal is to expand the discussion of research in Composite material, Optoelectronics, Mechanical engineering, Heat sink and Heat transfer. The presented Composite material research focuses mostly on Finite element method and, on occasion, topics in Molding (process). Optoelectronics works presented in the journal have a specific focus on Insertion loss.
Heat sink research presented in the journal encompasses a variety of subjects, including Electronics, Thermal resistance, Thermal and Thermal conductivity. The Heat transfer study featured falls within the wider field of Mechanics. The journal investigates Soldering research which frequently intersects with Chip.
A key indicator for each journal is its effectiveness in reaching other researchers with the papers published at that venue.
The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.
The top authors publishing in IEEE Transactions on Components, Packaging and Manufacturing Technology (based on the number of publications) are:
The overall trend for top authors publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top authors.
Only papers with recognized affiliations are considered
The top affiliations publishing in IEEE Transactions on Components, Packaging and Manufacturing Technology (based on the number of publications) are:
The overall trend for top affiliations publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top affiliations.
The publication chance index shows the ratio of articles published by the best research institutions in the journal edition to all articles published within that journal. The best research institutions were selected based on the largest number of articles published during all editions of the journal.
The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.
During the most recent 2021 edition, 22.57% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 21.14% were posted by at least one author from the top 10 institutions publishing in the journal. Another 10.86% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 19.43% of all publications and 48.57% were from other institutions.
A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of journals they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same journal from year to year.
The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the journal in relation to all participants in a given year.
The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.
Our experience to innovation index was created to show a cross-section of the experience level of authors publishing in a journal. The index includes the authors publishing at the last edition of a journal, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).
The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:
The chart below illustrates experience levels of first authors in cases of publications with multiple authors.
Atom O. Watanabe;Muhammad Ali;Sk Yeahia Been Sayeed;Rao R. Tummala
(2021)Swapnil S. Salvi;Ankur Jain
(2021)Kaladhar Radhakrishnan;Madhavan Swaminathan;Bidyut K. Bhattacharyya
(2021)Beomjin Kwon;Thomas Foulkes;Tianyu Yang;Nenad Miljkovic
(2020)Madhavan Swaminathan;Hakki Mert Torun;Huan Yu;Jose Ale Hejase
(2020)Hyunwook Park;Seongguk Kim;Youngwoo Kim;Joungho Kim
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