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IEEE

23rd International Conference on Electronic Packaging Technology (ICEPT)

Location: Dalian , China

Submission deadline: 3/31/2022

Conference dates: 8/10/2022 - 8/13/2022

Research H-index
6

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Materials Science 31 108 313 5
Electronics and Electrical Engineering 575 43 95 3
Engineering and Technology 143 36 105 4

Call for Papers

CONFERENCE TOPICS

■ Advanced Packaging: 2.5D and 3D packaging, wafer-level and panel-level packaging, flip chip, Fan-Out, system integration, heterogeneous/hybrid integration.

■ Packaging Materials & Processes: New packaging materials, advanced packaging substrate, green materials, nano-materials, and related packaging materials for packaging/assembly processes.

■ Packaging Design & Modeling: Design, modeling, methodology, and simulation for system integration and packaging; methodology and simulation for electrical/thermal/optical/mechanical models, multi-scale and multi-physics modeling, process simulation.

■ Interconnection Technologies: TSV, bumping and micro copper pillar technologies, high density inter-connection technologies, nano-materials bonding technologies, interposer, redistribution layer technologies for fan-in and fan-out packaging, chip-to-wafer/panel and wafer-to-wafer interconnect technologies, thermocompression bonding, non-conventional inter-connection technologies..

■ Advanced Manufacturing: Assembly, testing, manufacturing, automation technologies and equipment for Packaging manufacturing.

■ Quality & Reliability: Test technologies for packaging, quality monitoring and evaluation, methodologies for reliability data collection and analysis, reliability modeling, life prediction, failure analysis and non-destructive diagnose.

■ Power Electronics: Thermal management, interconnection and substrate technologies for power electronics, switch module, isolated/non-isolated power converter, inverter module, IPM, POL, PwrSoC, PSiP, open frame, electrical design, magnetic integration, control algorithm, firmware development, EMI modeling & optimization.

■ Optoelectronics and New Display: Optoelectronics and solid state lighting design, simulation, interconnection, packaging & integration, display module encapsulation & assembly, encapsulation of detector and imaging device at IR/VIS/UV or X-ray band, photo cell encapsulation, new display device and module encapsulation & assembly, mass Transfer of MicroLED, wearable, bendable, foldable and flexible electronics and display.

■ MEMS, Sensors and IoT: MEMS, NEMS, sensor, sensor packaging, implantable device packaging, microfluidics, nano-battery. 3D printing, self- alignment and assembly, wafer-level and panel-level packaging for MEMS and sensors.

■ Emerging Technologies: Electrical modeling, analysis, design, integration, fabrication and characterization of novel devices, packages, and systems for RF/microwave and high-speed I/O, component optimization and power management of computing/communication systems, 5G mobile networking, wearable/flexible electronics and bio-electronics, etc.

Overview

The scientific conference ranking presented on this page provides a comprehensive evaluation of leading conferences in the field of Engineering and Technology. This ranking has been meticulously compiled by Research.com, a recognized authority in science research analytics across major disciplines, including Engineering and Technology, and a trusted provider of scientific data since 2014.

The ordering of conferences in this ranking is determined using a unique bibliometric score established by Research.com. This proprietary score takes into account the estimated h-index of conferences and the number of leading scientists who have contributed to or presented at a given conference over the three most recent years. The Impact Score values represented in this listing are based on data aggregated as of 2024-11-27.

To ensure exceptional accuracy and depth, the evaluation process involved an in-depth analysis of over 2,262 conferences, each selected following a detailed review process. Additionally, more than 26,934 scientific documents published during the past three years were thoroughly examined, representing the scholarly output of 9,385 distinguished scientists within the Engineering and Technology domain.

This rigorous approach ensures that the ranking reflects both the scientific significance of the conferences and the influential contributions of participating researchers. For those interested in more information about the methodology employed in calculating the ranking scores, comprehensive details are available on our Methodology Page.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing at International Conference on Electronic Packaging Technology (based on the number of publications) are:

  • Sheng Liu (214 papers) absent at the last edition,
  • Ming Li (157 papers) absent at the last edition,
  • Rong Sun (121 papers) absent at the last edition,
  • Daoguo Yang (94 papers) absent at the last edition,
  • Chunqing Wang (92 papers) absent at the last edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing at International Conference on Electronic Packaging Technology (based on the number of publications) are:

  • Huazhong University of Science and Technology (377 papers) absent at the last edition,
  • Chinese Academy of Sciences (327 papers) absent at the last edition,
  • Guilin University of Electronic Technology (211 papers) absent at the last edition,
  • Harbin Institute of Technology (210 papers) absent at the last edition,
  • Shanghai Jiao Tong University (202 papers) published 1 paper at the last edition, 14 less than at the previous edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2021 edition, 9.38% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 3.45% were posted by at least one author from the top 10 institutions publishing at the conference. Another 0.00% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 0.00% of all publications and 96.55% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

Related Online Degrees & Career Pathways

For those interested in Materials Science, pursuing advanced education online can open doors to diverse career opportunities. Many students opt for a 1 year masters program to quickly deepen their expertise and accelerate career growth. These accelerated degrees offer the flexibility needed for working professionals or those looking to transition into new roles efficiently.

In addition to specialized technical fields, complementary skills such as communication are increasingly vital. Earning a communication master degree online enhances your ability to convey complex scientific concepts to varied audiences, a valuable asset in research and industry environments.

Choosing a program is often influenced by potential earnings and time investment. Fast-track options highlighted in fast online degrees that pay well provide insights into degrees balancing short duration with strong salary prospects, helping candidates make informed decisions.

Materials Science remains among the best majors for the future, driven by innovations in technology and sustainability. Combining this field with strategic online learning pathways ensures a robust foundation for dynamic and rewarding careers.

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