World's Best Scientists 2026 revealed!

D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
33
Citations
3635
World Ranking
3062
National Ranking
381

Overview

Xinchun Lu is affiliated with Tsinghua University in China and specializes in the field of Engineering, with a strong focus on subfields such as Biomedical Engineering, Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, and Electronic, Optical and Magnetic Materials. Their scholarly output includes 136 publications across these areas.

The scientist's research concentrates on several key topics, including:

  • Advanced Surface Polishing Techniques
  • Semiconductor materials and devices
  • Advanced machining processes and optimization
  • Copper Interconnects and Reliability
  • Diamond and Carbon-based Materials Research
  • Integrated Circuits and Semiconductor Failure Analysis
  • Electrodeposition and Electroless Coatings

Xinchun Lu has published frequently in venues such as:

  • SSRN Electronic Journal
  • ECS Journal of Solid State Science and Technology
  • The International Journal of Advanced Manufacturing Technology
  • Tribology International
  • Materials Science in Semiconductor Processing

Notable recent publications include:

  • "The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers," 2022, International Journal of Mechanical Sciences
  • "Preparation of Surface Modified Ceria Nanoparticles as Abrasives for the Application of Chemical Mechanical Polishing (CMP)," 2020, ECS Journal of Solid State Science and Technology
  • "Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process," 2023, Tribology International
  • "Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding process," 2022, Tribology International
  • "Mechanical wear behavior between CeO2(100), CeO2(110), CeO2(111), and silicon studied through atomic force microscopy," 2020, Tribology International

Xinchun Lu has collaborated extensively with peers, with frequent co-authors including:

  • Lifei Zhang
  • Dewen Zhao
  • Tongqing Wang
  • Zhimin Chai
  • Guangji Wang

The research contributions focus primarily on materials science and engineering applications relevant to semiconductor manufacturing and surface treatment techniques, aiming to better understand and optimize processes such as ultra-precision grinding, chemical mechanical polishing, and wear behaviors at the microscopic level.

Best Publications

  • Nanomanufacturing of silicon surface with a single atomic layer precision via mechanochemical reactions

    Lei Chen;Jialin Wen;Peng Zhang;Bingjun Yu

  • Chemical mechanical polishing: Theory and experiment

    Unknown

  • Synthesis, characterization and lithium-storage performance of MoO2/carbon hybrid nanowires

    Qingsheng Gao;Lichun Yang;Xinchun Lu;Jianjiang Mao

  • Atomic insight into tribochemical wear mechanism of silicon at the Si/SiO 2 interface in aqueous environment: Molecular dynamics simulations using ReaxFF reactive force field

    Jialin Wen;Tianbao Ma;Weiwei Zhang;George Psofogiannakis

  • Tribochemistry and superlubricity induced by hydrogen ions.

    Jinjin Li;Chenhui Zhang;Liang Sun;Xinchun Lu

  • RE (La, Nd and Yb) doped CeO2 Abrasive Particles for Chemical Mechanical Polishing of Dielectric Materials: Experimental and Computational Analysis

    Jie Cheng;Jie Cheng;Shuo Huang;Yang Li;Tongqing Wang

  • Ultrasonic flexural vibration assisted chemical mechanical polishing for sapphire substrate

    Wenhu Xu;Xinchun Lu;Guoshun Pan;Yuanzhong Lei

  • Film Thickness of Ionic Liquids Under High Contact Pressures as a Function of Alkyl Chain Length

    Huaping Xiao;Dan Guo;Shuhai Liu;Guoshun Pan

  • Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)

    Wenhu Xu;Xinchun Lu;Guoshun Pan;Yuanzhong Lei

  • Monoatomic layer removal mechanism in chemical mechanical polishing process: A molecular dynamics study

    Lina Si;Dan Guo;Jianbin Luo;Xinchun Lu

  • Rare earth effect on the microstructure and wear resistance of Ni-based coatings

    Zhenyu Zhang;Xinchun Lu;Baolei Han;Jianbin Luo

  • Rare earth effect on microstructure, mechanical and tribological properties of CoCrW coatings

    Zhenyu Zhang;Xinchun Lu;Baolei Han;Jianbin Luo

  • Tribological properties of rare earth oxide added Cr3C2–NiCr coatings

    Zhenyu Zhang;Xinchun Lu;Jianbin Luo

  • Atomic scale deformation in the solid surface induced by nanoparticle impacts

    J Xu;J B Luo;X C Lu;L L Wang

  • The crystallographic change in sub-surface layer of the silicon single crystal polished by chemical mechanical polishing

    J. Xu;J.B. Luo;L.L. Wang;X.C. Lu

  • On the Lift-off Speed in Journal Bearings

    X. Lu;M.M. Khonsari

  • Abrasive rolling effects on material removal and surface finish in chemical mechanical polishing analyzed by molecular dynamics simulation

    Lina Si;Dan Guo;Jianbin Luo;Xinchun Lu

  • The Control and Prediction of End‐Point Phosphorus Content during BOF Steelmaking Process

    Unknown

  • Chemical roles on Cu-slurry interface during copper chemical mechanical planarization

    Jing Li;Jing Li;Yuhong Liu;Yan Pan;Xinchun Lu

  • Reducing Adhesion Force by Means of Atomic Layer Deposition of ZnO Films with Nanoscale Surface Roughness

    Zhimin Chai;Yuhong Liu;Xinchun Lu;Dannong He

  • Material Removal Mechanism of Copper CMP from a Chemical–Mechanical Synergy Perspective

    Jing Li;Yuhong Liu;Xinchun Lu;Jianbin Luo

  • The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers

    Unknown

  • Mechanisms for nano particle removal in brush scrubber cleaning

    Yating Huang;Dan Guo;Xinchun Lu;Jianbin Luo

  • Mechanical model of single abrasive during chemical mechanical polishing: Molecular dynamics simulation

    Ruling Chen;Shaoxian Li;Zhe Wang;Xinchun Lu

  • Atomic layer deposition of zinc oxide films: Effects of nanocrystalline characteristics on tribological performance

    Zhimin Chai;Xinchun Lu;Dannong He

  • Failure analysis of journal bearing used in turboset of a power plant

    Yongyong He;Zhongkai Zhao;Tianyu Luo;Xinchun Lu

  • Preparation of α-alumina-g-polyacrylamide composite abrasive and chemical mechanical polishing behavior

    Hong Lei;Haishen Lu;Jianbin Luo;Xinchun Lu

  • Extrusion formation mechanism on silicon surface under the silica cluster impact studied by molecular dynamics simulation

    Ruling Chen;Jianbin Luo;Dan Guo;Xinchun Lu

  • Mechanism of GaN CMP Based on H2O2 Slurry Combined with UV Light

    Jie Wang;Tongqing Wang;Guoshun Pan;Xinchun Lu

  • Nanoscale Effect on Ultrathin Gas Film Lubrication in Hard Disk Drive

    Yongqing Peng;Xinchun Lu;Jianbin Luo

  • Film Forming Characteristics of Oil-in-Water Emulsion with Super-Low Oil Concentration

    Liran Ma;Jianbin Luo;Chenhui Zhang;Shuhai Liu

Frequent Co-Authors

Jianbin Luo
Jianbin Luo Tsinghua University
Dannong He
Dannong He Shanghai Jiao Tong University
Yonggang Meng
Yonggang Meng Tsinghua University
Hong Liang
Hong Liang Texas A&M University
Yufeng Zheng
Yufeng Zheng Peking University
Ming Liu
Ming Liu Fudan University
Jinshan Pan
Jinshan Pan Royal Institute of Technology
Chunli Bai
Chunli Bai Chinese Academy of Sciences
Jiarui Xu
Jiarui Xu Sun Yat-sen University
Adri C. T. van Duin
Adri C. T. van Duin Pennsylvania State University

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