World's Best Scientists 2026 revealed!

D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
42
Citations
5642
World Ranking
1863
National Ranking
224

Overview

Renke Kang is affiliated with Dalian University of Technology in China and has made significant contributions in the field of engineering, particularly within mechanical engineering. Their research encompasses advanced surface polishing techniques, machining processes and optimization, materials chemistry, and related areas of advanced manufacturing technologies.

Their recent scholarly output includes the following papers:

  • Grinding and lapping induced surface integrity of silicon wafers and its effect on chemical mechanical polishing, 2022, Applied Surface Science
  • Molecular simulation of the plastic deformation and crack formation in single grit grinding of 4H-SiC single crystal, 2023, International Journal of Mechanical Sciences
  • Recent progress in flexible supporting technology for aerospace thin-walled parts: A review, 2021, Chinese Journal of Aeronautics
  • On-line prediction of ultrasonic elliptical vibration cutting surface roughness of tungsten heavy alloy based on deep learning, 2020, Journal of Intelligent Manufacturing
  • Insight into the mechanism of low friction and wear during the chemical mechanical polishing process of diamond: A reactive molecular dynamics simulation, 2020, Tribology International

Renke Kang has collaborated frequently with several researchers, including:

  • Zhigang Dong
  • Xiaoguang Guo
  • Yan Bao
  • Shang Gao
  • Xianglong Zhu

They have published extensively in multiple venues known for engineering and manufacturing research. The most frequent publication venues are:

  • The International Journal of Advanced Manufacturing Technology
  • SSRN Electronic Journal
  • Precision Engineering
  • Applied Surface Science
  • Journal of Manufacturing Processes

Kang's work addresses key topics in engineering and mechanical disciplines, particularly:

  • Advanced Surface Polishing Techniques
  • Advanced machining processes and optimization
  • Advanced Machining and Optimization Techniques
  • Diamond and Carbon-based Materials Research
  • Advanced materials and composites
  • Laser Material Processing Techniques
  • Metal and Thin Film Mechanics

The research spans several subfields including mechanical engineering, biomedical engineering, materials chemistry, electrical and electronic engineering, and mechanics of materials. The largest volume of publications resides primarily within mechanical engineering, highlighting a focus on manufacturing technologies and materials science.

Best Publications

  • Recent progress of residual stress measurement methods: A review

    Jiang Guo;Haiyang Fu;Bo Pan;Renke Kang

  • Changes in surface layer of silicon wafers from diamond scratching

    Zhenyu Zhang;Zhenyu Zhang;Bo Wang;Renke Kang;Bi Zhang;Bi Zhang

  • A novel approach of mechanical chemical grinding

    Zhenyu Zhang;Zhenyu Zhang;Junfeng Cui;Bo Wang;Ziguang Wang

  • Grinding and lapping induced surface integrity of silicon wafers and its effect on chemical mechanical polishing

    Unknown

  • Novel rotating-vibrating magnetic abrasive polishing method for double-layered internal surface finishing

    Jiang Guo;Ka Hing Au;Chen-Nan Sun;Min Hao Goh

  • Molecular simulation of the plastic deformation and crack formation in single grit grinding of 4H-SiC single crystal

    Unknown

  • A novel approach of chemical mechanical polishing for cadmium zinc telluride wafers.

    Zhenyu Zhang;Bo Wang;Ping Zhou;Renke Kang

  • A novel approach of chemical mechanical polishing using environment-friendly slurry for mercury cadmium telluride semiconductors

    Zhenyu Zhang;Bo Wang;Ping Zhou;Dongming Guo

  • Recent progress in flexible supporting technology for aerospace thin-walled parts: A review

    Yan Bao;Bin Wang;Zengxu He;Renke Kang

  • Rotary ultrasonic machining of potassium dihydrogen phosphate (KDP) crystal: An experimental investigation on surface roughness

    Qiangguo Wang;Weilong Cong;Z.J. Pei;Hang Gao

  • On-line prediction of ultrasonic elliptical vibration cutting surface roughness of tungsten heavy alloy based on deep learning

    Yanan Pan;Renke Kang;Zhigang Dong;Wenhao Du

  • A novel approach of high-performance grinding using developed diamond wheels

    Zhenyu Zhang;Siling Huang;Shaochen Wang;Bo Wang

  • A theoretical and experimental investigation on ultrasonic assisted grinding from the single-grain aspect

    Feifei Zheng;Renke Kang;Zhigang Dong;Jiang Guo

  • Effects of grinding speeds on the subsurface damage of single crystal silicon based on molecular dynamics simulations

    Penghui Li;Xiaoguang Guo;Song Yuan;Ming Li

  • Atomistic mechanisms of chemical mechanical polishing of diamond (1 0 0) in aqueous H2O2/pure H2O: Molecular dynamics simulations using reactive force field (ReaxFF)

    Xiaoguang Guo;Song Yuan;Xiaoli Wang;Zhuji Jin

  • Insight into the mechanism of low friction and wear during the chemical mechanical polishing process of diamond: A reactive molecular dynamics simulation

    Song Yuan;Xiaoguang Guo;Junxin Huang;Yonjun Gou

  • Warping of silicon wafers subjected to back-grinding process

    Shang Gao;Zhigang Dong;Renke Kang;Bi Zhang;Bi Zhang

  • Effects of pressure and velocity on the interface friction behavior of diamond utilizing ReaxFF simulations

    Song Yuan;Xiaoguang Guo;Qian Mao;Jiang Guo

  • Nanogrinding induced surface and deformation mechanism of single crystal β-Ga2O3

    Shang Gao;Shang Gao;Yueqin Wu;Renke Kang;Han Huang

  • Chemical–mechanical wear of monocrystalline silicon by a single pad asperity

    Lin Wang;Ping Zhou;Ying Yan;Bi Zhang;Bi Zhang

  • Finishing of rectangular microfeatures by localized vibration-assisted magnetic abrasive polishing method

    Jiang Guo;Wenhe Feng;Henry Jia Hua Jong;Hirofumi Suzuki

  • Precision Fabrication of Thin Copper Substrate by Double-sided Lapping and Chemical Mechanical Polishing

    Bo Pan;Renke Kang;Jiang Guo;Haiyang Fu

  • Topology optimization-based lightweight primary mirror design of a large-aperture space telescope.

    Shutian Liu;Rui Hu;Quhao Li;Ping Zhou

  • Simulation and experimental study of ultrasonic cutting for aluminum honeycomb by disc cutter.

    Jiansong Sun;Zhigang Dong;Xuanping Wang;Yidan Wang

  • Edge chipping of silicon wafers in diamond grinding

    Shang Gao;Renke Kang;Zhigang Dong;B. Zhang

  • Nanoscale Wear Layers on Silicon Wafers Induced by Mechanical Chemical Grinding

    Zhenyu Zhang;Yuefeng Du;Bo Wang;Ziguang Wang

  • Al2O3-ZrO2 eutectic ceramic via ultrasonic-assisted laser engineered net shaping

    Shuai Yan;Dongjiang Wu;Fangyong Niu;Guangyi Ma

  • Elimination of surface scratch/texture on the surface of single crystal Si substrate in chemo-mechanical grinding (CMG) process

    Y.B. Tian;Y.B. Tian;L. Zhou;J. Shimizu;Y. Tashiro

  • Characterization of material removal in ultrasonically assisted grinding of SiCp/Al with high volume fraction

    Zhigang Dong;Feifei Zheng;Xianglong Zhu;Renke Kang

Frequent Co-Authors

Dongming Guo
Dongming Guo Dalian University of Technology
Jiang Guo
Jiang Guo California State University Los Angeles
Zhenyuan Jia
Zhenyuan Jia Dalian University of Technology
Han Huang
Han Huang Central South University
Jun Wang
Jun Wang University of New South Wales
Xichun Luo
Xichun Luo University of Strathclyde
Zhijian Pei
Zhijian Pei Texas A&M University
Shutian Liu
Shutian Liu Harbin Institute of Technology
Jun Wei
Jun Wei Harbin Institute of Technology
Adri C. T. van Duin
Adri C. T. van Duin Pennsylvania State University

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