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D-Index & Metrics

Materials Science

D-Index
44
Citations
7806
World Ranking
12025
National Ranking
3297

Overview

Dongming Guo is affiliated with Dalian University of Technology in China and has a substantial body of research in the field of Engineering. Their work spans various subfields including Biomedical Engineering, Mechanical Engineering, Mechanics of Materials, Electrical and Electronic Engineering, and Materials Chemistry.

The scientist has contributed extensively to topics centered on surface and material processing techniques. Their main areas of research include:

  • Advanced Surface Polishing Techniques
  • Advanced machining processes and optimization
  • Advanced Machining and Optimization Techniques
  • Diamond and Carbon-based Materials Research
  • Rock Mechanics and Modeling
  • Laser Material Processing Techniques
  • Geomechanics and Mining Engineering

Guo's publication record features a number of papers in notable venues:

  • "Green chemical mechanical polishing of sapphire wafers using a novel slurry," 2020, Nanoscale
  • "Macroscale Superlubricity Enabled by Graphene-Coated Surfaces," 2020, Advanced Science
  • "New insights into the methods for predicting ground surface roughness in the age of digitalisation," 2020, Precision Engineering
  • "Activation functions selection for BP neural network model of ground surface roughness," 2020, Journal of Intelligent Manufacturing
  • "Insight into the mechanism of low friction and wear during the chemical mechanical polishing process of diamond: A reactive molecular dynamics simulation," 2020, Tribology International

Frequently publishing in journals related to mechanical and precision engineering, the venues with the highest number of Guo's publications include:

  • Precision Engineering (7 publications)
  • Journal of Mechanical Engineering (6 publications)
  • Applied Surface Science (5 publications)
  • Nanoscale (4 publications)
  • Tribology International (3 publications)

Their collaborative network involves recurring partnerships with a number of coauthors, notably:

  • Ping Zhou (28 joint works)
  • Renke Kang (22 joint works)
  • Xiaoguang Guo (21 joint works)
  • Ying Yan (14 joint works)
  • Zhuji Jin (13 joint works)

The research contributions by Dongming Guo exhibit consistent focus on optimizing machining and surface polishing technologies, with an emphasis on the mechanics and chemistry involved in advanced material processing. This body of work contributes to both theoretical insights and practical applications in engineering disciplines.

Best Publications

  • Environment friendly chemical mechanical polishing of copper

    Zhenyu Zhang;Junfeng Cui;Jiabo Zhang;Dongdong Liu

  • A novel approach of chemical mechanical polishing for a titanium alloy using an environment-friendly slurry

    Zhenyu Zhang;Zhifeng Shi;Yuefeng Du;Yuefeng Du;Zhijian Yu

  • Changes in surface layer of silicon wafers from diamond scratching

    Zhenyu Zhang;Zhenyu Zhang;Bo Wang;Renke Kang;Bi Zhang;Bi Zhang

  • Development of a novel chemical mechanical polishing slurry and its polishing mechanisms on a nickel alloy

    Zhenyu Zhang;Longxing Liao;Xinze Wang;Wenxiang Xie

  • New Deformation-Induced Nanostructure in Silicon.

    Bo Wang;Bo Wang;Zhenyu Zhang;Keke Chang;Junfeng Cui;Junfeng Cui

  • High aspect ratio micro-hole drilling aided with ultrasonic vibration and planetary movement of electrode by micro-EDM

    Z.Y. Yu;Y. Zhang;J. Li;J. Luan

  • Green chemical mechanical polishing of sapphire wafers using a novel slurry.

    Wenxiang Xie;Zhenyu Zhang;Longxing Liao;Jie Liu

  • Design of Frequency Selective Surface Structure With High Angular Stability for Radome Application

    Ning Liu;Xianjun Sheng;Chunbo Zhang;Dongming Guo

  • Fabrication and size prediction of crystalline nanoparticles of silicon induced by nanogrinding with ultrafine diamond grits

    Zhenyu Zhang;Fengwei Huo;Xianzhong Zhang;Dongming Guo

  • A novel model for undeformed nanometer chips of soft-brittle HgCdTe films induced by ultrafine diamond grits

    Zhenyu Zhang;Yaxing Song;Chaoge Xu;Dongming Guo

  • A novel approach of mechanical chemical grinding

    Zhenyu Zhang;Zhenyu Zhang;Junfeng Cui;Bo Wang;Ziguang Wang

  • A model for nanogrinding based on direct evidence of ground chips of silicon wafers

    ZhenYu Zhang;YanXia Huo;DongMing Guo

  • A novel approach of high speed scratching on silicon wafers at nanoscale depths of cut

    Zhenyu Zhang;Dongming Guo;Bo Wang;Renke Kang

  • Macroscale Superlubricity Enabled by Graphene-Coated Surfaces.

    Zhenyu Zhang;Yuefeng Du;Siling Huang;Fanning Meng

  • Physics-Based Predictive Cutting Force Model in Ultrasonic-Vibration-Assisted Grinding for Titanium Drilling

    Na Qin;Z. J. Pei;C. Treadwell;D. M. Guo

  • A novel approach of chemical mechanical polishing for cadmium zinc telluride wafers.

    Zhenyu Zhang;Bo Wang;Ping Zhou;Renke Kang

  • Prediction of the cutting forces generated in the drilling of carbon-fibre-reinforced plastic composites using a twist drill

    D.-M. Guo;Q. Wen;H. Gao;Y.-J. Bao

  • A novel approach of chemical mechanical polishing using environment-friendly slurry for mercury cadmium telluride semiconductors

    Zhenyu Zhang;Bo Wang;Ping Zhou;Dongming Guo

  • Design and Synthesis of Band-Pass Frequency Selective Surface With Wideband Rejection and Fast Roll-Off Characteristics for Radome Applications

    Ning Liu;Xianjun Sheng;Chunbo Zhang;Dongming Guo

  • New insights into the methods for predicting ground surface roughness in the age of digitalisation

    Yuhang Pan;Ping Zhou;Ying Yan;Anupam Agrawal

  • A Miniaturized Triband Frequency Selective Surface Based on Convoluted Design

    Ning Liu;Xianjun Sheng;Chunbo Zhang;Jingjing Fan

  • A novel approach of high-performance grinding using developed diamond wheels

    Zhenyu Zhang;Siling Huang;Shaochen Wang;Bo Wang

Frequent Co-Authors

Renke Kang
Renke Kang Dalian University of Technology
Yuwen Sun
Yuwen Sun Dalian University of Technology
Fangyong Niu
Fangyong Niu Dalian University of Technology
Zhenyuan Jia
Zhenyuan Jia Dalian University of Technology
Jun Wang
Jun Wang University of New South Wales
Cheng-Te Lin
Cheng-Te Lin Chinese Academy of Sciences
Ivan P. Parkin
Ivan P. Parkin University College London
Jiang Guo
Jiang Guo California State University Los Angeles
Zhijian Pei
Zhijian Pei Texas A&M University
Andreas Rosenkranz
Andreas Rosenkranz University of Chile

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