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Materials Science

D-Index
47
Citations
7694
World Ranking
11185
National Ranking
175

Overview

Qing-Xiang Pei is affiliated with the Institute of High Performance Computing in Singapore. Their research primarily focuses on materials science and engineering, with particular attention to the thermal properties of materials and the mechanics of materials. Their contributions span 59 publications in materials science and 55 in engineering.

The scientist has specialized subfields that include materials chemistry, mechanical engineering, mechanics of materials, civil and structural engineering, and polymers and plastics. Key topics of Pei's research encompass thermal properties of materials, graphene research and applications, thermal radiation and cooling technologies, advanced thermoelectric materials and devices, high entropy alloys studies, diamond and carbon-based materials research, and boron and carbon nanomaterials research.

Pei has authored multiple papers, with notable recent publications such as:

  • "Recent progress in the development of thermal interface materials: a review" (2020), published in Physical Chemistry Chemical Physics
  • "Elastic properties of injection molded short glass fiber reinforced thermoplastic composites" (2020), published in Composite Structures
  • "Unusual thermal properties of graphene origami crease: A molecular dynamics study" (2020), published in Green Energy & Environment
  • "A systematic study of interatomic potentials for mechanical behaviours of Ti-Al alloys" (2020), published in Computational Materials Science
  • "Unraveling the Hall-Petch to inverse Hall-Petch transition in nanocrystalline high entropy alloys under shock loading" (2024), published in International Journal of Plasticity

Frequent coauthors who have collaborated with Pei include Yong-Wei Zhang, Huasong Qin, Yilun Liu, Zachary H. Aitken, and Yan Chen.

Pei's work has been published consistently in several recurring venues, including arXiv (Cornell University), The Journal of Physical Chemistry C, SSRN Electronic Journal, Physical Chemistry Chemical Physics, and Engineering Analysis with Boundary Elements.

Best Publications

  • A molecular dynamics study of the mechanical properties of hydrogen functionalized graphene

    Q.X. Pei;Y.W. Zhang;Y.W. Zhang;V.B. Shenoy

  • Mechanical properties of graphynes under tension: A molecular dynamics study

    Yingyan Zhang;Qingxiang Pei;Chen Wang

  • Controlling of residual stress in additive manufacturing of Ti6Al4V by finite element modeling

    G. Vastola;G. Zhang;Q.X. Pei;Y.-W. Zhang

  • Phonon thermal conductivity of monolayer MoS2 sheet and nanoribbons

    Xiangjun Liu;Gang Zhang;Qing-Xiang Pei;Yong-Wei Zhang

  • Manipulating the Thermal Conductivity of Monolayer MoS2 via Lattice Defect and Strain Engineering

    Zhiwei Ding;Qing-Xiang Pei;Jin-Wu Jiang;Yong-Wei Zhang

  • A theoretical analysis of the thermal conductivity of hydrogenated graphene

    Qing-Xiang Pei;Zhen-Dong Sha;Yong-Wei Zhang

  • Nanometric cutting of copper: A molecular dynamics study

    Q.X. Pei;C. Lu;F.Z. Fang;H. Wu

  • Effects of grain size, temperature and strain rate on the mechanical properties of polycrystalline graphene – A molecular dynamics study

    M.Q. Chen;M.Q. Chen;S.S. Quek;Z.D. Sha;C.H. Chiu

  • Thermal conductivities of single- and multi-layer phosphorene: a molecular dynamics study

    Ying-Yan Zhang;Qing-Xiang Pei;Jin-Wu Jiang;Ning Wei

  • An experimental and simulation study on build thickness dependent microstructure for electron beam melted Ti–6Al–4V

    Xipeng Tan;Yihong Kok;Yu Jun Tan;Guglielmo Vastola

  • Large scale molecular dynamics study of nanometric machining of copper

    Q.X. Pei;C. Lu;H.P. Lee;H.P. Lee

  • Mechanical properties of methyl functionalized graphene: a molecular dynamics study

    Qing-Xiang Pei;Yong-Wei Zhang;Yong-Wei Zhang;Vivek B Shenoy

  • Tuning the thermal conductivity of silicene with tensile strain and isotopic doping: A molecular dynamics study

    Qing-Xiang Pei;Yong-Wei Zhang;Zhen-Dong Sha;Vivek B. Shenoy

  • Mechanical properties and fracture behavior of single-layer phosphorene at finite temperatures

    Zhen-Dong Sha;Qing-Xiang Pei;Zhiwei Ding;Jin-Wu Jiang

  • Interfacial thermal conductance in graphene/MoS2 heterostructures

    Zhiwei Ding;Qing-Xiang Pei;Jin-Wu Jiang;Wenxuan Huang

  • Some Aspects of Thermal Transport across the Interface between Graphene and Epoxy in Nanocomposites.

    Yu Wang;Chunhui Yang;Qing-Xiang Pei;Yingyan Zhang

  • Thermal conductivity of defective graphene

    Yingyan Zhang;Yuan Cheng;Qingxiang Pei;C. M Wang

  • A molecular dynamics investigation on thermal conductivity of graphynes

    Y.Y. Zhang;Q.X. Pei;C.M. Wang

  • Effects of temperature and strain rate on the mechanical properties of silicene

    Qing-Xiang Pei;Zhen-Dong Sha;Ying-Yan Zhang;Yong-Wei Zhang

  • Study of Materials Deformation in Nanometric Cutting by Large-scale Molecular Dynamics Simulations

    QX Pei;C Lu;HP Lee;YW Zhang

  • Carbon isotope doping induced interfacial thermal resistance and thermal rectification in graphene

    Qing-Xiang Pei;Yong-Wei Zhang;Zhen-Dong Sha;Vivek B. Shenoy

Frequent Co-Authors

Yong-Wei Zhang
Yong-Wei Zhang Institute of High Performance Computing
Yingyan Zhang
Yingyan Zhang RMIT University
Zishun Liu
Zishun Liu Xi'an Jiaotong University
Gang Zhang
Gang Zhang Agency for Science, Technology and Research
Huajian Gao
Huajian Gao Tsinghua University
Vivek B. Shenoy
Vivek B. Shenoy University of Pennsylvania
Chaobin He
Chaobin He National University of Singapore
Jin-Wu Jiang
Jin-Wu Jiang Shanghai University
Yiu-Wing Mai
Yiu-Wing Mai Hong Kong Polytechnic University
David J. Srolovitz
David J. Srolovitz University of Hong Kong

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