Hong-Hui Wu is affiliated with the University of Science and Technology Beijing in China. Their research primarily spans the fields of Engineering and Materials Science, with a focus on several subfields including Mechanical Engineering, Materials Chemistry, Mechanics of Materials, Electrical and Electronic Engineering, and Electronic, Optical and Magnetic Materials.
The scientist's main topics of study cover Microstructure and Mechanical Properties of Steels, Metal Alloys Wear and Properties, Hydrogen Embrittlement and Corrosion Behaviors in Metals, High Entropy Alloys Studies, Metallurgy and Material Forming, High-Temperature Coating Behaviors, and Microstructure and Mechanical Properties.
Wu's recent publications feature research on mechanical and chemical properties of advanced materials and stretch across several notable journals:
Among frequent publication venues associated with Wu are:
Wu has collaborated extensively with a number of coauthors, highlighting cooperative research efforts across various projects. Frequent coauthors include Xinping Mao, Junheng Gao, Shuize Wang, Guilin Wu, and Chaolei Zhang.
The research contributions by Hong-Hui Wu cover both fundamental and applied aspects of materials science and engineering, with particular investigations into advanced alloys and coatings aimed at improving mechanical and electrochemical properties. The work addresses challenges such as oxygen embrittlement and mechanical durability in novel materials, including high-entropy alloys and layered cathodes.
Huiping Yang;Hong Hui Wu;Mingyuan Ge;Lingjun Li
Jin Leng;Zhixing Wang;Jiexi Wang;Hong-Hui Wu
Y. Wu;H. Wang;H.H. Wu;Z.Y. Zhang
Yuan Wu;Fei Zhang;Xiaoyuan Yuan;Hailong Huang
Jinghua Li;Zaichun Liu;Qiaobao Zhang;Yong Cheng
Zhiming Zheng;Hong-Hui Wu;Haodong Liu;Qiaobao Zhang
Xingyu Qu;He Huang;Tao Wan;Long Hu
Qiaobao Zhang;Qiaobao Zhang;Zaichun Liu;Bote Zhao;Yong Cheng
Longze Zhao;Hong Hui Wu;Chenghao Yang;Qiaobao Zhang
Yeqiang Bu;Yuan Wu;Zhifeng Lei;Xiaoyuan Yuan
Yanfei Zeng;Yudai Huang;Niantao Liu;Xingchao Wang
Hong-Hui Wu;Fangping Zhuo;Huimin Qiao;Lalitha Kodumudi Venkataraman
Yunjian Liu;Xiaojian Fan;Zhiqiang Zhang;Hong-Hui Wu
Hong-Hui Wu;Jiaming Zhu;Jiaming Zhu;Tong-Yi Zhang
Zegao Wang;Hong Hui Wu;Qiang Li;Qiang Li;Flemming Besenbacher
Zegao Wang;Zegao Wang;Hong‐Hui Wu;Hong‐Hui Wu;Qiang Li;Qiang Li;Flemming Besenbacher
Xiaoyu Feng;Xiaoyu Feng;Hong-Hui Wu;Biao Gao;Michał Świętosławski
Jiaming Zhu;Jiaming Zhu;Hong Hui Wu;Yuan Wu;Haoliang Wang
Yang Zhao;Shizhong Wei;Kunming Pan;Zhili Dong
Xiang Ao;Xiang Ao;Wei Zhang;Zhishan Li;Lin Lv
Zhiming Zheng;Hong Hui Wu;Huixin Chen;Yong Cheng
Guilong Liu;Hong Hu Wu;Hong Hu Wu;Qiangqiang Meng;Ting Zhang
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Universidade de São Paulo
King's College London
Tampere University
Eindhoven University of Technology
University of Pennsylvania
Rutgers, The State University of New Jersey
University Medical Center Groningen
Emory University
Academia Sinica
University of Science and Technology of China
Polytechnic University of Turin
Kyushu University
Universität Hamburg
East China Normal University
Magna Graecia University
University of Rhode Island
