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D-Index & Metrics

Engineering and Technology

D-Index
43
Citations
7817
World Ranking
6122
National Ranking
49

Overview

Frank Niklaus is affiliated with the Royal Institute of Technology in Sweden and specializes in Engineering, having contributed extensively with 87 publications in this field. Their research spans several subfields including Electrical and Electronic Engineering, Biomedical Engineering, Atomic and Molecular Physics and Optics, Materials Chemistry, and Artificial Intelligence.

The primary focus of their work includes topics such as Photonic and Optical Devices, Mechanical and Optical Resonators, Advanced MEMS and NEMS Technologies, Nanofabrication and Lithography Techniques, Neural Networks and Reservoir Computing, Nonlinear Optical Materials Studies, and Photonic Crystals and Applications.

Their notable recent publications include:

  • "Large-area integration of two-dimensional materials and their heterostructures by wafer bonding" (2021) published in Nature Communications
  • "Integrated silicon photonic MEMS" (2023) published in Microsystems & Nanoengineering
  • "3D Microvascularized Tissue Models by Laser-Based Cavitation Molding of Collagen" (2022) published in Advanced Materials
  • "Manufacture and characterization of graphene membranes with suspended silicon proof masses for MEMS and NEMS applications" (2020) published in Microsystems & Nanoengineering
  • "Three-dimensional printing of silica glass with sub-micrometer resolution" (2023) published in Nature Communications

Frequent co-authors collaborating with Frank Niklaus include:

  • Kristinn B. Gylfason
  • Göran Stemme
  • Pierre Edinger
  • Simon J. Bleiker
  • Po-Han Huang

The scientist has published multiple works in prominent venues. The most frequent publication venues are:

  • Microsystems & Nanoengineering (7 publications)
  • ACS Applied Materials & Interfaces (4 publications)
  • arXiv (Cornell University) (4 publications)
  • Nature Communications (3 publications)
  • ACS Nano (3 publications)

Best Publications

  • Adhesive wafer bonding

    Frank Niklaus;Göran Stemme;J. Q. Lu;R. J. Gutmann

  • Electromechanical Piezoresistive Sensing in Suspended Graphene Membranes

    Anderson Smith;Frank Niklaus;A. Paussa;Sam Vaziri

  • MEMS-based uncooled infrared bolometer arrays: a review

    Frank Niklaus;Christian Vieider;Henrik Jakobsen

  • Integrating MEMS and ICs

    Andreas C. Fischer;Fredrik Forsberg;Martin Lapisa;Simon J. Bleiker

  • Resistive graphene humidity sensors with rapid and direct electrical readout

    Anderson David Smith;Karim Elgammal;Frank Niklaus;Anna Delin;Anna Delin

  • Low temperature full wafer adhesive bonding

    Frank Niklaus;Peter Enoksson;Edvard Kälvesten;Göran Stemme

  • Nanoelectromechanical sensors based on suspended 2D materials

    Max C. Lemme;Stefan Wagner;Kangho Lee;Xuge Fan

  • Wearable All-Solid-State Potentiometric Microneedle Patch for Intradermal Potassium Detection.

    Marc Parrilla;Maria Cuartero;Sara Padrell Sanchez;Sara Padrell Sanchez;Mina Rajabi

  • Large-area integration of two-dimensional materials and their heterostructures by wafer bonding

    Arne Quellmalz;Xiaojing Wang;Simon Sawallich;Burkay Uzlu

  • Handbook of Wafer Bonding

    Frank Niklaus;J. Q. Lu

  • Method of joining components

    Edouard Kälvesten;Göran Stemme;Frank Niklaus

  • Piezoresistive Properties of Suspended Graphene Membranes under Uniaxial and Biaxial Strain in Nanoelectromechanical Pressure Sensors

    Anderson David Smith;Frank Niklaus;Alan Paussa;Stephan Schröder

  • Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS

    Martin Lapisa;Göran Stemme;Frank Niklaus

  • Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels

    Helene Andersson;Wouter van der Wijngaart;Patrick Griss;Frank Niklaus

  • Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities

    Joachim Oberhammer;Frank Niklaus;Göran Stemme

  • Low temperature full wafer adhesive bonding of structured wafers

    Frank Niklaus;Helene Andersson;Peter Enoksson;Göran Stemme

  • Integrated silicon photonic MEMS

    Unknown

  • Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure

    Frank Niklaus;Adit Decharat;Christer Jansson;Göran Stemme

  • 3D Microvascularized Tissue Models by Laser‐Based Cavitation Molding of Collagen

    Unknown

  • Sealing of adhesive bonded devices on wafer level

    Joachim Oberhammer;Frank Niklaus;Göran Stemme

  • Unconventional applications of wire bonding create opportunities for microsystem integration

    Andreas C. Fischer;Jan G. Korvink;Niclas Roxhed;Göran Stemme

  • Adhesive wafer bonding using partially cured benzocyclobutene for three-dimensional integration

    Frank Niklaus;R. J. Kumar;J. J. McMahon;J. Yu

  • Pressure sensors based on suspended graphene membranes

    Anderson.D. Smith;Sam Vaziri;Frank Niklaus;Andreas.C. Fischer

  • Graphene ribbons with suspended masses as transducers in ultra-small nanoelectromechanical accelerometers

    Xuge Fan;Fredrik Forsberg;Anderson D. Smith;Stephan Schröder

Frequent Co-Authors

Göran Stemme
Göran Stemme Royal Institute of Technology
Max C. Lemme
Max C. Lemme RWTH Aachen University
Mikael Östling
Mikael Östling Royal Institute of Technology
Stefan Wagner
Stefan Wagner University of Stuttgart
Joachim Oberhammer
Joachim Oberhammer Royal Institute of Technology
Wim Bogaerts
Wim Bogaerts Ghent University
Peter Enoksson
Peter Enoksson Chalmers University of Technology
Ronald J. Gutmann
Ronald J. Gutmann Rensselaer Polytechnic Institute
Georg S. Duesberg
Georg S. Duesberg Bundeswehr University Munich

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