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IEEE Transactions on Semiconductor Manufacturing
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IEEE Transactions on Semiconductor Manufacturing

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Electronics and Electrical Engineering 410 30 28 6
Engineering and Technology 845 13 35 10

Additional Metrics

Number of Best Scientists*: 89
Documents by Best Scientists*: 106
Top 100 Ranked Scientists*: 3
SCIMAGO H-index: 83
SCIMAGO SJR: 0.67
Impact Factor: 2.3

Overview

Top Research Topics at IEEE Transactions on Semiconductor Manufacturing?

The journal covers a variety of subjects, including Electronic engineering, Wafer, Optoelectronics, Semiconductor device fabrication and Integrated circuit. IEEE Transactions on Semiconductor Manufacturing addresses concerns in Electronic engineering which are intertwined with other disciplines, such as Transistor and Process control, Process (computing). While it focused on Process control, it was also able to explore topics like Control engineering, Control theory and Control theory.

The concepts on Wafer presented in it can also apply to other research fields, including Etching (microfabrication), Chemical-mechanical planarization, Optics and Analytical chemistry. In addition to Optoelectronics research, the journal aims to explore topics under Electrical engineering and MOSFET. Topics in Semiconductor device fabrication were tackled in line with various other fields like Reliability engineering, Manufacturing engineering and Artificial intelligence.

The journal aims to investigate interdisciplinary topics such as Manufacturing engineering and Special section.

  • Electronic engineering (27.00%)
  • Wafer (22.51%)
  • Optoelectronics (16.44%)

What are the most cited papers published in the journal?

  • Scheduling semiconductor wafer fabrication (591 citations)
  • Material removal mechanism in chemical mechanical polishing: theory and modeling (456 citations)
  • VARIUS: A Model of Process Variation and Resulting Timing Errors for Microarchitects (372 citations)

Research areas of the most cited articles at IEEE Transactions on Semiconductor Manufacturing:

The most cited articles explore disciplines such as Electronic engineering, Semiconductor device fabrication, Wafer, Process control and Integrated circuit. While work presented in the journal publications provide substantial information on Electronic engineering, it also covers topics in Integrated circuit layout and Plasma etching. The works on Semiconductor device fabrication tackled in the most cited publications bring together disciplines like Petri net, Real-time computing, Artificial intelligence, Scheduling (production processes) and Production control.

What topics the last edition of the journal is best known for?

  • Statistics
  • Artificial intelligence
  • Electrical engineering

The previous edition focused in particular on these issues:

IEEE Transactions on Semiconductor Manufacturing mainly deals with areas of study such as Artificial intelligence, Wafer, Silicon, Semiconductor device fabrication and Pattern recognition. The journal addresses concerns in Artificial intelligence which are intertwined with other disciplines, such as Machine learning and Process (computing). The majority of Process (computing) studies in the journal are focused on the subject of Process control.

Issues in Wafer were discussed, taking into consideration concepts from other disciplines like Variation (game tree), Trench, Cluster analysis, Process optimization and MOSFET. The work on Silicon tackled in it brings together disciplines like Etching (microfabrication), Chemical vapor deposition, Doping and Analytical chemistry. The journal explores issues in Semiconductor device fabrication which can be linked to other research areas like Artificial neural network, Manufacturing engineering, Advanced manufacturing, Manufacturing technology and Semiconductor device modeling.

The most cited articles from the last journal are:

  • Self-Supervised Representation Learning for Wafer Bin Map Defect Pattern Classification (3 citations)
  • Methodology for Important Sensor Screening for Fault Detection and Classification in Semiconductor Manufacturing (3 citations)
  • Wafer Reflectance Prediction for Complex Etching Process Based on K -Means Clustering and Neural Network (1 citations)

Papers citation over time

A key indicator for each journal is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing in IEEE Transactions on Semiconductor Manufacturing (based on the number of publications) are:

  • Anthony J. Walton (31 papers) published 1 paper at the last edition, 1 less than at the previous edition,
  • Tadahiro Ohmi (26 papers) absent at the last edition,
  • Duane S. Boning (24 papers) absent at the last edition,
  • Stewart Smith (22 papers) published 1 paper at the last edition, 1 less than at the previous edition,
  • Costas J. Spanos (21 papers) absent at the last edition.

The overall trend for top authors publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing in IEEE Transactions on Semiconductor Manufacturing (based on the number of publications) are:

  • IBM (73 papers) absent at the last edition,
  • University of California, Berkeley (65 papers) published 1 paper at the last edition the same number as at the previous edition,
  • Intel (60 papers) published 1 paper at the last edition, 1 less than at the previous edition,
  • National Chiao Tung University (55 papers) published 1 paper at the last edition,
  • Texas Instruments (53 papers) absent at the last edition.

The overall trend for top affiliations publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions in the journal edition to all articles published within that journal. The best research institutions were selected based on the largest number of articles published during all editions of the journal.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2021 edition, 19.30% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 19.57% were posted by at least one author from the top 10 institutions publishing in the journal. Another 10.87% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 28.26% of all publications and 41.30% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of journals they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same journal from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the journal in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing in a journal. The index includes the authors publishing at the last edition of a journal, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

Top Publications

  • Deep Learning for Classification of the Chemical Composition of Particle Defects on Semiconductor Wafers

    Jared O'Leary;Kapil Sawlani;Ali Mesbah

    (2020)
    65 Citations
  • Data-Driven Framework for Tool Health Monitoring and Maintenance Strategy for Smart Manufacturing

    Chen-Fu Chien;Chia-Cheng Chen

    (2020)
    30 Citations
  • The Environmental Footprint of IC Production: Review, Analysis, and Lessons From Historical Trends

    (2023)
    28 Citations
  • CNNs Combined With a Conditional GAN for Mura Defect Classification in TFT-LCDs

    Hsueh-Ping Lu;Chao-Ton Su

    (2021)
    25 Citations
  • Simulation-Based Performance Assessment of Production Planning Models With Safety Stock and Forecast Evolution in Semiconductor Wafer Fabrication

    Timm Ziarnetzky;Lars Monch;Reha Uzsoy

    (2020)
    24 Citations
  • Redefining Monitoring Rules for Intelligent Fault Detection and Classification via CNN Transfer Learning for Smart Manufacturing

    (2022)
    23 Citations
  • Advanced Quality Control (AQC) of Silicon Wafer Specifications for Yield Enhancement for Smart Manufacturing

    Chen-Fu Chien;Yin-Hung Chen;Mei-Fang Lo

    (2020)
    22 Citations
  • One Class Process Anomaly Detection Using Kernel Density Estimation Methods

    (2022)
    18 Citations
  • Integration of 650 V GaN Power ICs on 200 mm Engineered Substrates

    Xiangdong Li;Karen Geens;Dirk Wellekens;Ming Zhao

    (2020)
    16 Citations

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Best Scientists Contributing to This Journal