Call for Papers
Solid State Lasers XXXII: Technology and Devices
Technical areas include (but are not limited to):
high-power solid state lasers and laser systems
visible and UV solid state lasers
eye-safe, mid- and far-IR solid state lasers
disk lasers
slab and rectangular waveguide lasers
single crystal (coilable & cladded) fiber lasers
seed lasers for solid state and fiber amplifiers
Q-switching and mode locking media and techniques
new gain materials and composites
novel resonator and pumping designs
donut mode and vortex beam lasers
resonantly pumped lasers
single-frequency and narrow line lasers
lasers using ceramic gain media
laser modeling, testing, and characterization methods
high-power beam delivery and characterization
techniques for improving laser system reliability and efficiency
compact laser devices and miniaturization efforts
hybrid fiber/bulk laser systems
intra-cavity and extra-cavity frequency-converted lasers
specially designed solid state lasers for specific applications including:
photoacoustic imaging
medical, life sciences, and biophotonics
industrial, microelectronic, imaging, and display
lidar, atmospheric, aerospace, and military systems.
Fiber Lasers XX: Technology and Systems
Submissions are solicited in all areas related to fibers and fiber lasers broadly categorized into the following four sub-categories:
Fiber Lasers and Amplifiers
Fiber Laser Materials, Design, Fabrication, and Characterization
Fiber Laser Devices and Sub-systems
Specially Designed Fiber Lasers for Specific Applications.
High Power Lasers for Fusion Research VII
Topics of interest include, but are not limited to, the following:
ENGINEERING CHALLENGES
laser architectures and large optical systems, evolution of design
laser system and subsystem performance
commissioning approach, results and challenges
material, manufacturing, and subsystems level challenges
diagnostic systems
control systems
performance modeling and simulation
secondary source generation for high energy density physics applications
high energy, high power, and ultrahigh intensity pulse generation
temporal and spatial pulse shaping and cleaning
advanced short pulse amplification materials and techniques.
FUTURE
fusion experiments and results
big data management and analysis
next-generation lasers: diode pumped, crystal/ceramic, high duty factor
high repetition rate laser systems
next generation optical systems
challenges in materials
high power density challenges
challenges in final-optics and target tracking, power plant design
machine learning in experiment design.
OPERATION AND MAINTENANCE
challenges of a national user facility
commissioning and maintenance issues
safety and workforce.
Components and Packaging for Laser Systems IX
A wide range of topics covers a variety of laser components and packaging technologies for semiconductor lasers, solid state lasers, fiber lasers, gas lasers, CW and pulsed lasers, ultra-short pulsed lasers, and others.
COMPONENTS FOR LASERS
components for high-power and high-energy laser systems
2 micron and mid-IR optical components and packaging
components integration for ultra-short pulsed laser (USPL) systems
optics for ultrafast lasers
beam-transforming components for laser diode arrays
diffractive optical elements (DOE) and holographic optical elements (HOE)
lenses and lens arrays
grating components for lasers: volume Bragg gratings, fiber Bragg gratings, blazed gratings, holographic phase gratings, and others
components for laser line narrowing, mode locking, and mode selection
components for coherent and spectral beam combining of CW and pulsed lasers
components for laser beam engineering
high-power and high-energy beam delivery components
high laser-induced damage threshold (LIDT) materials and components
frequency generation components: components integrating nonlinear optics and novel optical designs (e.g. gas-filled fibers, resonant cavities, etc.) for SHG, THG, OPG, Raman shift, etc.
space qualification of laser components
AR coating of components for high-power laser applications
UV laser-induced / photochemical contamination of laser optical components
polarization optics for lasers
recent advances in isolators, couplers, splitters, etc.
emerging laser components
advanced cooling components and solutions
novel optical component design methodologies
modeling of optical components in laser systems
advanced manufacturing techniques for laser optical components
novel materials for optical components (high index glasses, polymers, diamond, etc.).
LASER PACKAGING SOLUTIONS
packaging, assembly, and mounting solutions of optical components in lasers
packaging technologies for high-power lasers
theoretical and practical packaging solutions for fiber coupling
laser array packaging solutions
thermal management of high-power lasers
thermal and structural management for very narrow linewidth frequency-locked laser systems
materials for laser packaging
materials for component attachment (epoxies, solders, etc.)
novel active and passive alignment techniques
reliability of laser systems
modeling and design of laser packaging.
Submit an Abstract
High-Power Diode Laser Technology XXI
Papers are solicited on a wide range of topics related to high-power diode laser technology:
HIGH-POWER VISIBLE AND MID-IR LASER DIODES FOR:
industrial materials processing, 3D printing, welding, cutting, brazing, and hardening
cinema and other display applications
automotive light sources and other lighting applications
medical therapeutic and bioinstrumentation applications
novel pumping applications
defense, security, environmental sensing, and imaging applications
reliability testing, modeling, expected lifetime assessments, and failure analysis.
HIGH-POWER INFRARED LASER DIODES FOR:
industrial materials processing, 3D printing, welding, cutting, cladding, brazing, and hardening
autonomous vehicle LIDAR and other applications for navigation, collision avoidance, and general 3D sensing illumination
pump sources for fiber lasers, solid-state lasers, and alkali lasers
surgical, aesthetic, and other medical applications
technology transitions in traditional applications now enabled by dramatic cost reduction of high-power laser diodes
quantum applications like computing and communications
large-scale pump arrays for fusion energy systems and high-energy physics research.
ADVANCES IN HIGH-POWER LASER DIODE DEVICES AND HIGH-BRIGHTNESS INTEGRATION
low-SWaP (Size, Weight, and Power consumption) diode lasers for defense applications
efforts towards $/W cost reduction via 6-inch GaAs wafer scaling, automation, the implementation of AI techniques, novel device design and heat transfer solutions
novel material systems for high-density packaging and thermal management
emerging high-power, high-efficiency sources, including InP and quantum cascade lasers, interband lasers, and novel hybrid materials
high-brightness beam combination architectures and fiber coupling schemes, including coherent beam combining
spectral control with on-chip gratings or external cavities
beam shaping and homogenization technologies
near- and far-field beam profile control leading to higher-brightness
device modeling and multi-physics simulation
novel resonator designs such as photonic-crystal, tapers, mode filters, and coherently-coupled arrays
high-efficiency epitaxy and low-loss optical coupling
improved or novel facet passivation, processes, or device design enabling higher power per component
reliability testing, modeling, expected lifetime assessments, and failure analysis.
Submit an Abstract
Vertical External Cavity Surface Emitting Lasers (VECSELs) XII
A selection of invited papers will provide a comprehensive overview of the latest progress in this fast-developing field. In addition, contributed papers are solicited on all aspects of VECSEL research, including:
novel architectures (MECSELs and MIXSELs)
numerical modeling
material engineering and wavelength tailoring
intracavity nonlinear frequency conversion
power scaling and novel thermal management
single frequency operation and stabilization
mode-locked operation
application specific designs
industrial developments.
Nonlinear Frequency Generation and Conversion: Materials and Devices XXII
Topics include:
DEVICES AND TECHNIQUES
nonlinear processes in bulk crystals, fibers, waveguides, and thin films
parametric frequency up and down conversion
sources based on parametric processes
sum and difference frequency generation, 2nd, 3rd, 4th, and 5th harmonic generation
high harmonic generation
optical parametric chirped pulse amplifiers
frequency combs and spectroscopy
supercontinuum generation
stimulated Raman and Brillouin scattering
four-wave mixing and other 3rd and higher-order nonlinear processes
THz generation based on nonlinear conversion, THz spectroscopy, and imaging
epsilon-near-zero materials
nonlinear plasmonics.
NONLINEAR MATERIALS
bulk inorganic and organic nonlinear materials
engineered nonlinear materials including quasi-phase-matched oxides and semiconductors
nanostructures, photonic bandgap structures
nonlinear fibers, waveguides and thin films
new measurements and measurement techniques of nonlinear optical and other material properties relevant to nonlinear frequency conversion.
Real-time Measurements, Rogue Phenomena, and Single-Shot Applications VIII
Topics of interest include but are not limited to:
high-throughput ultrafast spectroscopy and imaging
rapid terahertz waveform sampling
electron bunch characterization in accelerators
laser dynamics and ultrashort pulse characterization
optical rogue waves
real-time detection of optical-triggered phase transitions
high-speed Raman spectroscopy
time-stretch instruments
single-shot electro-optical sampling
real-time metrology
complex systems
dissipative solitons
soliton interactions and molecules
dual-comb spectroscopy and imaging
instabilities in linear and nonlinear systems
time-bandwidth engineering
real-time optical data analytics
real-time data compression
mathematical and analytical techniques.
Laser Resonators, Microresonators, and Beam Control XXV
Conference papers are solicited on a wide range of topics related to the conference title, including but not limited to the following:
LASER RESONATORS
active and adaptive laser resonators
stable and unstable laser resonators for high-quality laser beams
resonators for gas, solid state, and fiber lasers
high-stability laser resonators.
MICRORESONATORS AND APPLICATIONS
novel microresonator topologies, fabrication and coupling methods, material platforms and packaging methods
dispersion management, nonlinear effects and functionalization
microcavities in optical frequency combs
microcavities in parametric oscillation and frequency conversion
microcavity lasers and optical micro-clocks
microresonators in RF photonics: oscillators, receivers, and signal processors
quantum optics with microresonators: single photon and correlated sources, qubits, switching and routing
microresonator optomechanics, Brillouin scattering, cooling, phonon lasers, particle manipulation
microresonators in biochemical, inertial, and other sensors, including LiDAR.
BEAM SHAPING AND BEAM CONTROL
fiber coupling of diode lasers
fiber coupling of laser radiation
lasers with phase conjugation
high-power femtosecond lasers: beam and pulse control and formation
laser beam homogenization
laser intensity distribution transformation
beam control of multi-KW lasers
new optical elements and systems for lasers
laser beam characterization and measurement of laser beam parameters
spatial stabilization of laser beam shapes
beam delivery systems
feedback and control systems for aiming, frequency stabilization, or energy absorption
high-power and high-brightness beam delivery optics, including advanced isolators, connectors, beam switches, etc.
high-speed beam steering devices, including KTN scanners, etc.
advanced beam shapers and spatial light modulators for smart laser processing, etc.
novel polarization and angular momentum state conversion devices and technologies.
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVIII
Papers are solicited on, but not limited to, the following topics within the broad area of microelectronics, photonic devices, and optoelectronics manufacturing. Papers will be solicited on the utility of lasers enabled advanced manufacturing.
DYNAMICS OF LASER-MATTER INTERACTION
fundamentals of laser-material interaction in manufacturing
generation and dynamics of laser ablation plumes, including gas-dynamic effects, charge generation, and charge transfer
modeling of laser-material and laser-plume interactions for quantitative prediction of process parameters
novel approaches for laser micro and nano-processing including temporal and spatial beam shaping, pulse bursts, etc.
novel analytical methods
Diagnostics to advance the understanding of laser matter interaction mechanisms.
LASER PROCESSES IN MANUFACTURING
AI for laser processing industry
laser modification of materials (structuring, annealing, doping, intermixing, photosensitivity)
laser polishing, figuring, cleaning, texturing, bending, and repair
laser nanoscale materials processing and manufacturing, including near-field nano-optical lithography
pulsed-laser deposition, laser-assisted thin-film epitaxy, atomic-layer epitaxy, resonant infrared pulsed-laser deposition, thin film and wafer processing
laser based surface patterning
laser direct writing (photonics, sensors, and structures)
laser additive manufacturing and rapid prototyping on micro- and nanoscale
laser-induced modification of glasses or transparent materials for applications in optoelectronics and photonics
laser transfer of materials (LIFT, BA-LIFT, etc.).
PRODUCTION TECHNOLOGIES
laser processing in microelectronic and optoelectronic manufacturing
parallel laser manufacturing
direct writing technologies for microelectronic and optoelectronic applications
laser processes for photonics and photovoltaic industry
digital photonic production
laser manufacture of microsystems, waveguide lasers and photonic and optoelectronic devices (LED, OLED)
novel systems and sub-systems for microelectronic and optoelectronic materials processing and device fabrication.
JOINT SESSIONS are planned with:
Laser-based Micro- and Nanoprocessing (LA302)
Synthesis and Photonics of Nanoscale Materials (LA303)
Frontiers in Ultrafast Optics (LA304)
Laser 3D Manufacturing (LA401)
Laser-based Micro- and Nanoprocessing XVII
Papers are solicited on the following application-oriented topics and other laser processing related issues:
Laser material processing for metals, polymers, ceramics, semiconductors, composites, or dissimilar materials:
laser ablation (cutting, scribing, dicing, drilling, cleaving, marking, engraving, milling) by high-power ultra-short-pulsed laser (kW-, mJ-class)
laser surface modification in the micro- and nanometer scale by direct laser interference patterning (DLIP), laser-induced periodic surface structures (LIPSS) etc.
laser micro-joining (welding, soldering, bonding, splicing, and sealing)
laser transformations and modification for integrated device functionalities (annealing, curing, alloying, doping, metallization, cleaning, polymerization, sintering, cladding, bending, forming change of chemical/physical properties, and transferring)
laser direct writing and micro- and nanostructuring relevant for device fabrication and processing
Laser processes for pushing Green Technologies such as next generation energy storage devices (e.g., batteries, supercapacitors, fuel cells), photovoltaics, power-to-gas, and hydrogen technology towards decarbonization
High-speed large-area laser processing and high-speed laser beam engineering systems, advanced adaptive optics and beam engineering methods for improving laser processes, yields, and throughput
Innovative "green photonics" for micro- and nanoprocessing and assembly
Innovative approaches for optimizing the use of lasers based on AI (machine learning, predictive modelling)
Laser processing and packaging of thin and flexible advanced electronic and photonic components (e.g., wearables)
Structuring, packaging, and assembling of components in microelectronic and photonic devices, microreaction technology, MOEMS, MEMS/bio-MEMS, NEMS, micro- and nanofluidic devices and analytical systems (e.g., lab-on-chip)
Fundamental physical and chemical issues in laser-based micro- and nanofabrication, processing, 3D laser processing, and assembly.
Submit an Abstract
Nanoscale and Quantum Materials: From Synthesis and Laser Processing to Applications 2023
Papers are solicited on the following topics:
Synthesis and Processing
laser-based synthesis (e.g., PLD, LCVD) of nanoscale and quantum materials and heterostructures ranging from 0D and 1D nanomaterials such as quantum dots, nanocrystals, nanoparticles, nanowires, nanotubes, to 2D layered materials such as graphene, metal chalcogenides, Mxenes, and their hybrid structures
laser-based processing and modification approaches (e.g., defect engineering, doping, thinning, direct writing) for tailoring the structure and properties of nanoscale and quantum materials
Novel strategies for integration of nanoscale and quantum materials into various substrates and device architectures
pulsed laser ablation in liquids to synthesize nanoscale materials for biomedical, optoelectronics, photovoltaics, catalytic and other applications
multiphoton / femtosecond laser energy localization for nanoscale laser processing
laser-synthesis of nanostructured surfaces, including sub-λ ablation, machining, LIPSS, and their applications
laser-assisted control of topological state in nanoscale and quantum materials
laser-based printing of nanoscale/quantum materials and architectures
laser-based 3D nanoprinting
laser-based surface modification and size manipulation of individual nanostructures (i.e., shaping, cutting, melting/recrystallization, doping, welding)
theory and modeling of light-metamaterial interactions.
Characterization and Applications
photon-based characterization methods (e.g., Raman, Photoluminescence, transient ultrafast absorption, and nonlinear spectroscopic techniques) for ex-situ, in-situ, and real-time investigation of the structure and properties of nanoscale/quantum materials and interfaces
optical properties of nanoscale/quantum materials and their applications in quantum information sciences and technologies
photonic properties of plasmonic nanoscale materials and their applications in photovoltaics, telecommunications, biosensing, bioimaging and therapies
photon-based manipulating the charge and spin in nanoscale and quantum materials
interaction of structured light (orbital angular momentum, polarization singularities, etc.) with nanostructures
photonic properties of nanostructured artificial materials (metamaterials) and 2D metasurfaces and their applications.
JOINT SESSION with LA301 and LA303
TOPIC: Laser Modification of Nanomaterials
The intent of this session is to present recent research in laser interactions with nanomaterials for the development of new laser-based processing techniques. This includes laser interactions with nanomaterials resulting in physical transformations such as melting, alloying, shaping, welding, sintering, and solidification, laser-induced chemical modifications to nanomaterials, mechanisms of laser-induced defect generation or healing, laser processing techniques to move, self-assemble, or separate nanomaterials.
Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XXIII
General topics include, but are not limited to, the following areas:
emerging ultrafast laser technologies and novel systems
ultrafast laser source engineering for industrial and biomedical use
manipulating ultrashort pulse propagation and nonlinear effects in materials
novel interactions of ultrashort pulses with materials
fundamentals of surface micro/nano-machining with ultrafast lasers
ultrafast laser processes inside of transparent materials
advances in direct writing of integrated photonic, opto-mechanical, and lab-on-chip devices
interactions and modification of biological tissues
tissue and surgical applications of ultrashort pulsed lasers
optical manipulation of biological systems with ultrashort pulses
novel medical applications of ultrafast lasers
new frontiers of ultrafast lasers in plasmonics, and interaction with nanoparticles
Generation and detection of THz radiation
generation and application of EUV and x-ray ultrashort pulses
novel characterization and measurement techniques for ultrashort pulses
ultrashort pulse delivery of burst-trains and shaped beams for manipulating interaction physics.
Laser 3D Manufacturing X
Papers are solicited on the following topics:
applications of laser-based 3D manufacturing
laser-based solid freeform fabrication
selective laser sintering (SLS)
direct metal laser sintering (DMLS)
laser powder bed fusion / selective laser melting (LPBF/SLM)
laser cladding and direct energy deposition (DED)
stereolithography (SLA)
multi-photon polymerization for micro-nano 3D fabrication
laser direct-write and laser-induced forward transfer (LIFT)
flexible electronics and wearable sensor laser printing
multi-materials additive manufacturing (grades, composition or phase change)
biomedical structures and devices generated by laser digital fabrication
micro-optics, 3D microrobotics and micromechanical sensors laser fabrication
process modeling and simulation of laser 3D process (additive & subtractive)
in-situ sensors, process monitoring and control for all 3D manufacturing technologies (e.g., SLS/DMLS/SLM/SLA)
computed tomography (CT) and metrology for 3D printing and additive manufacturing
cyber security issues in 3D printing and additive manufacturing.
Free-Space Laser Communications XXXV
Original papers are solicited on, but are not limited to, the following topics:
Free-space Laser Communication Technologies and Atmospheric Propagation
present and future laser communication systems; space-based systems, airborne links terrestrial/indoor/commercial links
next-generation lasercom technologies
modulation and error correction encoding
pointing, acquisition, and tracking
atmospheric propagation, transmission effects, and compensation techniques
transmitters for space, receivers, subsystems, optical and optoelectronic components
flight qualification, lifetime and reliability
ground networks supporting lasercom systems; ground terminal technologies; ground-based transmitters, receivers, optics
beyond-line-of-sight communications
quantum communication and cryptography
optics for electronic module interconnects
global communications systems that make use of wireless-terrestrial, air, and space optical connections
free-space-laser-based gravitational wave sensing systems.
High-Power Laser Materials Processing: Applications, Diagnostics, and Systems XII
Papers are solicited on a wide range of topics related to the conference title, including but not limited to the following:
APPLICATIONS:
high power ultra-short pulses laser processing
high power short wavelength, i.e., UV
large-scale (XXL), and high throughput additive manufacturing
laser applications for light-weight materials (e.g., cutting, structuring, joining)
laser processes for E-mobility, e.g., battery manufacturing
laser welding, remote welding, and hybrid welding
cutting, including remote cutting
brazing / soldering
joining of non-ferrous and dissimilar materials
laser welding of ceramics
surface treatment, e.g., laser shock peening, cleaning, and structuring
rapid prototyping and manufacturing
modeling of laser processes
laser-based reduction of drag on aircraft surfaces
use of lasers in nuclear waste management.
DIAGNOSTICS:
process monitoring
vision systems and tracking
high-speed imaging
laser-beam characterization and measurement of laser-beam parameters
destructive and non-destructive quality testing methods
particulate diagnostics.
SYSTEMS:
processing heads and accessories for cutting, welding, material deposition (LMD), and surface treatment
scanning heads
beam shaping and guiding devices, including fibers, connectors, and accessories
fibers and components for high peak power usage
thermal lensing and optics design approaches.
