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IEEE

IEEE EMC+SIPI 2027 — IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC)

Location: Oregon Convention Center, Portland, Oregon , United States

Submission deadline: 12/20/2026

Conference dates: 7/12/2027 - 7/16/2027

Research H-index
7

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Electronics and Electrical Engineering 207 32 96 8

Call for Papers

EMC+SIPI is the annual flagship symposium of the IEEE Electromagnetic Compatibility Society, covering EMC and signal/power integrity. It invites original contributions on electromagnetic compatibility, EMI measurement and mitigation, signal integrity, power integrity, computational electromagnetics, shielding and grounding, EMC standards and testing. Submissions may take the form of full research papers, extended abstracts and poster presentations reporting theoretical, computational and experimental work, as well as industrial case studies and applications. The meeting brings together researchers, engineers, industry practitioners and students to exchange recent results and discuss emerging directions in the field. Accepted papers are published in the conference proceedings and submitted to IEEE Xplore.

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