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IEEE

Hot Chips 2023 (HCS)

Location: Stanford , United States

Conference dates: 8/27/2023 - 8/29/2023

Research H-index
7

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Electronics and Electrical Engineering 355 14 21 6

Call for Papers

The HOT CHIPS conference typically attracts more than 500 attendees from all over the world. It provides an opportunity for chip designers, computer architects, system engineers, press and analysts, as well as attendees from national laboratories and academia to mix, mingle and see presentations on the latest technologies and products. The three days of the conference typically feature two tutorials, two keynotes, a panel discussion and around 25 presentations on a variety of subjects related to microprocessors and integrated circuits. It is widely covered by the media; last year, we had about 25 members of the industry and national press covering the conference.

Presentations at HOT CHIPS are in the form of 30-minute talks. Presentation slides are published in the HOT CHIPS proceedings and online in the archives section of the HOT CHIPS website. Participants are not required to submit written papers, but a select group are invited to submit a paper for inclusion in a special issue of IEEE Micro.

Overview

This ranking provides a comprehensive assessment of scientific conferences within the field of Electronics and Electrical Engineering, meticulously compiled by Research.com—one of the leading websites dedicated to science research across all major academic disciplines. Since 2014, Research.com has been recognized for delivering reliable and trusted data on scientific contributions, with a particular focus on areas such as Electronics and Electrical Engineering.

The position of each conference in this ranking is determined based on a unique bibliometric score formulated by Research.com. This score is calculated through a robust methodology that incorporates both the estimated h-index and the number of leading scientists who have presented at each conference over the past three years. This approach ensures a nuanced and comprehensive evaluation that reflects both the influence and the academic leadership present at these scientific gatherings.

The current ranking was developed using Impact Score values collected as of 2024-11-27. The selection and evaluation process involved a rigorous analysis of over 2,204 conferences, each subjected to detailed inspection and careful review. The assessment was grounded on an exhaustive examination of more than 95,378 scientific documents published over the last three years by 6,160 of the most prominent scientists in Electronics and Electrical Engineering. This level of scrutiny underscores both the depth of research and the complexity of expert analysis integral to the creation of this ranking.

For a comprehensive understanding of the detailed methodology and criteria employed in formulating these ranking scores, we encourage you to visit our Methodology Page.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing at IEEE Hot Chips Symposium (based on the number of publications) are:

  • David Moloney (8 papers) absent at the last edition,
  • Christos Kozyrakis (7 papers) absent at the last edition,
  • Krste Asanovic (7 papers) absent at the last edition,
  • David A. Patterson (6 papers) absent at the last edition,
  • Ralph D. Wittig (5 papers) absent at the last edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing at IEEE Hot Chips Symposium (based on the number of publications) are:

  • Intel (57 papers) published 3 papers at the last edition, 2 less than at the previous edition,
  • Advanced Micro Devices (30 papers) absent at the last edition,
  • IBM (25 papers) absent at the last edition,
  • Xilinx (17 papers) absent at the last edition,
  • Nvidia (14 papers) absent at the last edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2021 edition, 33.33% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 66.67% were posted by at least one author from the top 10 institutions publishing at the conference. Another 0.00% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 16.67% of all publications and 16.67% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

Related Online Degrees & Career Pathways

For students exploring Electronics and Electrical Engineering, flexible online degree options are increasingly attractive. Many institutions now offer affordable and self-paced learning formats, making programs accessible to a wider audience. If cost is a major consideration, researching the cheapest self paced online college options can help reduce financial barriers while maintaining quality education.

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