What is he best known for?
The fields of study he is best known for:
- Composite material
- Aluminium
- Polymer
Composite material, Fracture toughness, Fracture, Tension and Fracture mechanics are his primary areas of study.
Brian Cotterell conducts interdisciplinary study in the fields of Composite material and Conchoidal fracture through his works.
Brian Cotterell focuses mostly in the field of Fracture, narrowing it down to topics relating to Brittleness and, in certain cases, Delamination, Shear stress, Stress intensity factor and Stress concentration.
His biological study spans a wide range of topics, including Crack closure, Crack growth resistance curve, Crack tip opening displacement and Structural engineering.
His work in Tension addresses issues such as Plane stress, which are connected to fields such as Compact tension specimen and Edge.
His work carried out in the field of Fracture mechanics brings together such families of science as Polycarbonate and Forensic engineering.
His most cited work include:
- Slightly curved or kinked cracks (1479 citations)
- The essential work of plane stress ductile fracture (360 citations)
- On the essential work of ductile fracture in polymers (317 citations)
What are the main themes of his work throughout his whole career to date?
His primary areas of study are Composite material, Fracture, Fracture mechanics, Fracture toughness and Crack growth resistance curve.
In most of his Composite material studies, his work intersects topics such as Forensic engineering.
His studies in Fracture integrate themes in fields like Flexural strength, Plane stress, Cementitious and Brittleness, Metallurgy.
Brian Cotterell combines subjects such as Stress and Solid mechanics with his study of Fracture mechanics.
His Fracture toughness study incorporates themes from Microelectronics, Toughness and Soldering.
Crack growth resistance curve is the subject of his research, which falls under Crack closure.
He most often published in these fields:
- Composite material (79.20%)
- Fracture (40.00%)
- Fracture mechanics (36.00%)
What were the highlights of his more recent work (between 1999-2007)?
- Composite material (79.20%)
- Fracture toughness (28.80%)
- Fracture (40.00%)
In recent papers he was focusing on the following fields of study:
Brian Cotterell spends much of his time researching Composite material, Fracture toughness, Fracture, Delamination and Toughness.
His Composite material study combines topics from a wide range of disciplines, such as Edge, Mineralogy and Rotation.
His Fracture toughness research includes elements of Line, Stress intensity factor and Soldering.
The concepts of his Fracture study are interwoven with issues in Structural engineering, Plane stress and Forensic engineering.
His work deals with themes such as Brittleness and Buckling, which intersect with Delamination.
His Crack growth resistance curve study is concerned with the larger field of Fracture mechanics.
Between 1999 and 2007, his most popular works were:
- A mechanical assessment of flexible optoelectronic devices (277 citations)
- The fracture of brittle thin films on compliant substrates in flexible displays (223 citations)
- Buckling and cracking of thin films on compliant substrates under compression (156 citations)
In his most recent research, the most cited papers focused on:
- Composite material
- Aluminium
- Polymer
His main research concerns Composite material, Fracture toughness, Toughness, Delamination and Brittleness.
His work in Polymer nanocomposite, Polymer, Crystallinity, Nanocomposite and Polyethylene terephthalate is related to Composite material.
His research combines Embrittlement and Fracture toughness.
His Delamination study incorporates themes from Strain energy release rate, Deformation, Buckling, Substrate and Indium tin oxide.
His Brittleness study integrates concerns from other disciplines, such as Flexural strength, Flexible display, Tension and Fracture.
Fracture is closely attributed to Optoelectronics in his work.
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