World's Best Scientists 2026 revealed!
IEEE

European Microelectronics & Packaging Conference (EMPC)

Location: Cambridge , United Kingdom

Conference dates: 9/11/2023 - 9/14/2023

Research H-index
3

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Electronics and Electrical Engineering 749 10 12 2

Call for Papers

Conference Themes

Semiconductor Industry
Trends Packaging Technologies Performance and Reliability Design & Process
Optimisation
Compound
Semiconductors
EV & Automotive
High speed Communications
AI and IoT
Smart Systems
Emerging Packaging
Technologies
Assembly Processes
Embedded
Technologies
System in Package
Equipment Developments
Reliability test development
Lifetime Prediction
Thermal Management
Failure Modes (e.g. Ageing, Thermal Shock)
Material Handling
Cooling Systems
Process Modelling
System Integration
Power Density
Electrical Characterisation
Packaging Developments
Markets and Developments Integration Materials Design and Test
High Performance
Computing
Internet of Things (IoT)
Automotive
Aerospace and Defence
Mobile/Comms
Medical
Industrial
Single Chip and Multi-chip
Photonics
Power Electronics
MEMS and Sensor
SiP and Module System
5G / 6G / RF / Microwave / mmwave
Wafer Level Packaging
2D and 3D Architectures
Emerging Research materials
Emerging Devices
Interconnects
Sustainability
Substrates
High Temperature Materials
Co-Design
Modelling and Simulation
Test Technology
Security
Design for Recycling and Re-Use

Overview

This comprehensive ranking presents a curated list of scientific conferences in the field of Electronics and Electrical Engineering, offering researchers and professionals a reliable resource for identifying high-impact academic venues. The ranking has been meticulously developed by Research.com, one of the foremost platforms recognized for delivering trusted data and insights on scientific contributions across all major disciplines, including Electronics and Electrical Engineering, since 2014.

Each conference’s position in the ranking is determined by a proprietary bibliometric score uniquely computed by Research.com. This score takes into account the estimated h-index, as well as the number of leading scientists who have contributed to the conference over the past three years. These measures ensure that the ranking accurately reflects both the scholarly influence and the dynamic participation of prominent experts.

The Impact Score values featured in this ranking were collected on 2024-11-27, providing the most up-to-date reflection of current trends and conference performance within the scientific community.

The ranking process was distinguished by its depth and rigor, involving a careful examination of more than 2,204 conferences. These conferences were selected following a thorough assessment of over 95,378 scientific documents published during the preceding three years by 6,160 leading and well-respected scientists specializing in Electronics and Electrical Engineering. The rigorous methodology ensures that only the most reputable and impactful conferences are represented in this ranking.

Further details regarding the methodology for computing the ranking scores, including the criteria and analytical processes employed, can be found on our Methodology Page.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing at European Microelectronics and Packaging Conference (based on the number of publications) are:

  • Jens Muller (19 papers) published 5 papers at the last edition, 1 less than at the previous edition,
  • Jan Vanfleteren (16 papers) published 1 paper at the last edition,
  • Thomas Maeder (14 papers) absent at the last edition,
  • Dionysios Manessis (14 papers) published 3 papers at the last edition, 2 more than at the previous edition,
  • Peter Ryser (13 papers) absent at the last edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing at European Microelectronics and Packaging Conference (based on the number of publications) are:

  • Fraunhofer Society (56 papers) published 15 papers at the last edition, 7 more than at the previous edition,
  • STMicroelectronics (26 papers) published 4 papers at the last edition,
  • Technical University of Berlin (20 papers) published 6 papers at the last edition, 5 more than at the previous edition,
  • Technische Universität Ilmenau (20 papers) published 5 papers at the last edition, 1 less than at the previous edition,
  • Dresden University of Technology (18 papers) published 3 papers at the last edition the same number as at the previous edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2019 edition, 24.11% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 38.82% were posted by at least one author from the top 10 institutions publishing at the conference. Another 7.06% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 20.00% of all publications and 34.12% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

Related Online Degrees & Career Pathways

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Career changers will find promise in accelerated programs designed to fast-track entry into high-demand fields. With focused curricula, these accelerated programs for career changers help students gain the necessary skills and credentials without lengthy delays.

Best Scientists who published in this Conference

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