Yandong Wang is affiliated with the University of Science and Technology Beijing in China and has contributed extensively to the fields of engineering and materials science. Their research output spans numerous topics primarily within mechanical engineering and materials chemistry, with additional work in aerospace engineering, electronic, optical and magnetic materials, and biomedical engineering.
Their publication record includes work focused on key topics such as high entropy alloys studies, crystallization and solubility studies, shape memory alloy transformations, microstructure and mechanical properties of steels, additive manufacturing materials and processes, high-temperature coating behaviors, and the microstructure and mechanical properties of materials.
Among their recent publications are:
Frequent coauthors in their research include Yang Ren, Zhihua Nie, Shilei Li, Dennis E. Brown, and Ronghui Kou, reflecting ongoing collaborative efforts in their fields of study.
The scientist's work is frequently published in venues such as The Cambridge Structural Database, SSRN Electronic Journal, Acta Materialia, Materials Science and Engineering A, and the Journal of Materials Research and Technology.
Yandong Wang's research intersects multiple disciplines within engineering and materials science, encompassing experimental and theoretical studies that explore materials' structural and functional properties. Their contributions cover development and analysis of alloys, advanced manufacturing processes, and functional materials design.
Suihe Jiang;Hui Wang;Yuan Wu;Xiongjun Liu
Y.F. Shen;Y.F. Shen;J. Tang;J. Tang;Z.H. Nie;Y.D. Wang
Yao-Jian Liang;Linjing Wang;Yuren Wen;Baoyuan Cheng
Y.D. Wu;Y.H. Cai;T. Wang;J.J. Si
Peijian Shi;Runguang Li;Yi Li;Yuebo Wen
Zhao-Hui Zhang;Zhen-Feng Liu;Ji-Fang Lu;Xiang-Bo Shen
Daoyong Cong;Wenxin Xiong;Antoni Planes;Yang Ren
Hongquan Song;Fuyang Tian;Qing-Miao Hu;Levente Vitos;Levente Vitos
Shijie Hao;Lishan Cui;Daqiang Jiang;Xiaodong Han
M.X. Yang;F.P. Yuan;Q.G. Xie;Y.D. Wang
Y.D. Wu;Y.H. Cai;X.H. Chen;T. Wang
N. Jia;ZH Cong;Xin Sun;S. Cheng
Junheng Gao;Suihe Jiang;Huairuo Zhang;Yuhe Huang
Z. Yang;D.Y. Cong;X.M. Sun;Z.H. Nie
Y.F. Shen;J. Tang;J. Tang;Z.H. Nie;Y.D. Wang;Y.D. Wang
L. Huang;D. Y. Cong;H. L. Suo;Y. D. Wang
Y.H. Qu;D.Y. Cong;X.M. Sun;Z.H. Nie
Yuxian Cao;Xianglin Zhou;Daoyong Cong;Hongxing Zheng
Y.H. Qu;D.Y. Cong;S.H. Li;W.Y. Gui
Y.L. Yang;Y.D. Wang;Y. Ren;Y. Ren;C.S. He
Haiyang Chen;Yan-Dong Wang;Zhihua Nie;Runguang Li
N. Jia;R. Lin Peng;Y.D. Wang;Y.D. Wang;S. Johansson
D. Y. Cong;P. Zetterström;Y. D. Wang;R. Delaplane
If you think any of the details on this page are incorrect, let us know.
Dongguk University
J. Craig Venter Institute
Polish Academy of Sciences
University of Strathclyde
University of York
Northwestern University
Southwest Research Institute
Arizona State University
University of Edinburgh
Mayo Clinic
Chinese Academy of Sciences
Technical University of Denmark
Lord Corporation (United States)
University of Colorado Boulder
Universiti Teknologi Petronas
Bundeswehr University Munich
