The chart shows the distribution of publications by all Research.com ranked scientists in the field of Materials Science in 2026. The highlighted bar marks where Seung-Wuk Lee sits on this spectrum.
This scientist: 95 publications — 2nd percentile
2% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 1,163 publications or more.
The chart shows the D-index (discipline H-index) distribution of Materials Science scientists ranked by Research.com in 2026. The highlighted bar marks where Seung-Wuk Lee sits on this spectrum.
This scientist: 42 D-Index — 3rd percentile
3% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 165 D-Index or more.
Seung-Wuk Lee is affiliated with the University of California, Berkeley, United States. Their research spans multiple disciplines including engineering, biochemistry, genetics, and molecular biology, with a total of 20 publications in engineering and 10 in biochemistry, genetics, and molecular biology.
The scientist has contributed significantly to various subfields such as mechanical engineering, biomedical engineering, biomaterials, molecular biology, and genetics. These encompass areas with 10, 8, 6, 6, and 3 publications respectively.
Main topics of Seung-Wuk Lee's work include advanced sensor and energy harvesting materials, extraction and separation processes, advanced materials and mechanics, bacteriophages and microbial interactions, connective tissue disorders research, electrospun nanofibers in biomedical applications, and advanced biosensing and bioanalysis techniques. The number of publications in these topics range from 12 in advanced sensor and energy harvesting materials down to 4 in several other specialized areas.
Frequent co-authors collaborating with Lee include Han Kim, Inseok Chae, Oleg Gang, Patrick Huber, and Alamgir Karim, with between 5 to 6 shared publications each.
Lee's publication record contains several recent papers notable for their focus on biomaterials and hydrogels. These include:
Seung-Wuk Lee frequently publishes in venues such as Nano Letters, Advanced Materials, Biomacromolecules, Nature Communications, and the Chemical Engineering Journal. The publication counts in these venues are 4, 3, 3, 1, and 1 respectively.
The scientist also has authored a series of books published by World Scientific, all titled Soft Matter and Biomaterials on the Nanoscale from the year 2020, with varying citation counts.
Seung Wuk Lee;Chuanbin Mao;Christine E. Flynn;Angela M. Belcher
Huicong Liu;Huicong Liu;Junwen Zhong;Chengkuo Lee;Seung-Wuk Lee
Eddie Wang;Malav S. Desai;Malav S. Desai;Seung-Wuk Lee;Seung-Wuk Lee
Woo Jae Chung;Jin Woo Oh;Jin Woo Oh;Kyungwon Kwak;Kyungwon Kwak;Byung Yang Lee;Byung Yang Lee
Byung Yang Lee;Jinxing Zhang;Jinxing Zhang;Chris Zueger;Chris Zueger;Woo Jae Chung;Woo Jae Chung
Xinghua Yu;Xingke Cai;Haodong Cui;Seung-Wuk Lee
Christine E. Flynn;Seung-Wuk Lee;Beau R. Peelle;Angela M. Belcher
Daeyeong Kim;Sang A Han;Sang A Han;Jung Ho Kim;Ju-Hyuck Lee
Seung-Wuk Lee;Woo-Jae Chung;Jin-woo Oh
Seung-Wuk Lee;Angela M. Belcher
Anna Merzlyak;Shyam Indrakanti;Seung-Wuk Lee
Ju-Hyuck Lee;Ju-Hyuck Lee;Kwang Heo;Kwang Heo;Konstantin Schulz-Schönhagen;Konstantin Schulz-Schönhagen;Ju Hun Lee;Ju Hun Lee
Seung-Wuk Lee;Soo Kwan Lee;Angela M. Belcher
Justyn W. Jaworski;Digvijay Raorane;Jin H. Huh;Arunava Majumdar
Sung Jae Chung;Ki Young Kwon;Seung Wuk Lee;Jung Il Jin
Tae Hyun Kim;Byung Yang Lee;Byung Yang Lee;Justyn Jaworski;Justyn Jaworski;Keisuke Yokoyama
Yun Je;Lee Sw;Kim Th;Jun Jb
Ki Tae Nam;Beau R. Peelle;Seung-Wuk Lee,‡,⊥ and;Angela M. Belcher
Anna Merzlyak;Seung-Wuk Lee
Ju Hun Lee;Ju Hun Lee;Benson Fan;Tuan D. Samdin;David A. Monteiro;David A. Monteiro
Seung-Wuk Lee;Bryant M. Wood;Angela M. Belcher
Sung Ho Yang;Sung Ho Yang;Woo-Jae Chung;Woo-Jae Chung;Sean McFarland;Sean McFarland;Seung-Wuk Lee;Seung-Wuk Lee
Woo-Jae Chung;Ki-Young Kwon;Jie Song;Seung-Wuk Lee
Marta Cerruti;Justyn Jaworski;Digvijay Raorane;Chris Zueger
So Young Yoo;Masae Kobayashi;Phin Peng Lee;Seung-Wuk Lee
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