The chart shows the distribution of publications by all Research.com ranked scientists in the field of Mechanical and Aerospace Engineering in 2026. The highlighted bar marks where Qiuming Wei sits on this spectrum.
This scientist: 145 publications — 22nd percentile
22% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 659 publications or more.
The chart shows the D-index (discipline H-index) distribution of Mechanical and Aerospace Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Qiuming Wei sits on this spectrum.
This scientist: 50 D-Index — 67th percentile
67% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 93 D-Index or more.
His main research concerns Composite material, Metallurgy, Nanocrystalline material, Strain rate and Shear band. The Composite material study combines topics in areas such as Secondary ion mass spectrometry and Sputter deposition. His work on Metallurgy deals in particular with Tungsten and Tensile testing.
His Nanocrystalline material research is multidisciplinary, relying on both Microstructure, Grain boundary, Strain hardening exponent, Dislocation and Grain size. As part of the same scientific family, Qiuming Wei usually focuses on Microstructure, concentrating on Transmission electron microscopy and intersecting with Nanostructure. His work carried out in the field of Strain rate brings together such families of science as Burgers vector and Severe plastic deformation.
Qiuming Wei mainly investigates Composite material, Metallurgy, Microstructure, Nanocrystalline material and Strain rate. His Composite material study frequently involves adjacent topics like Pulsed laser deposition. In his study, Tensile testing is strongly linked to Plasticity, which falls under the umbrella field of Metallurgy.
His research investigates the link between Microstructure and topics such as Amorphous solid that cross with problems in Silicon nitride. His Nanocrystalline material research is multidisciplinary, incorporating elements of Nanocrystal, Refractory metals and Tantalum. His research in Strain rate intersects with topics in Yield, Dislocation, Compression and Strain hardening exponent.
Composite material, Microstructure, Adiabatic shear band, Metallurgy and Grain size are his primary areas of study. His work in the fields of Composite material, such as Ultimate tensile strength, Deformation mechanism, Shear band and Fracture, overlaps with other areas such as Anisotropy. His Microstructure study combines topics from a wide range of disciplines, such as Alloy and Extrusion.
Qiuming Wei focuses mostly in the field of Adiabatic shear band, narrowing it down to matters related to Stress and, in some cases, Load capacity. His Metallurgy study integrates concerns from other disciplines, such as Transmission electron microscopy and Nanocrystalline material. His research investigates the connection with Grain size and areas like Tungsten which intersect with concerns in Refractory metals and Grain boundary.
His primary areas of study are Adiabatic shear band, Metallurgy, Strain rate, Composite material and Tungsten. His study in Microstructure and Deformation mechanism is done as part of Metallurgy. Qiuming Wei has included themes like Ductility and Grain size in his Microstructure study.
His research investigates the connection between Strain rate and topics such as Strengthening mechanisms of materials that intersect with issues in Nanoindentation, Strain hardening exponent, Toughness, Boron carbide and Flow stress. His work on Transmission electron microscopy expands to the thematically related Composite material. His studies in Tungsten integrate themes in fields like Grain boundary and Nanocrystalline material.
Q Wei;S Cheng;K.T Ramesh;E Ma
Haitao Zhang;Brian E. Schuster;Brian E. Schuster;Qiuming Wei;Kaliat T. Ramesh
Q. Wei;H.T. Zhang;B.E. Schuster;B.E. Schuster;K.T. Ramesh
Q. Wei
Q. Wei;D. Jia;K. T. Ramesh;E. Ma
Q. Wei;L. Kecskes;T. Jiao;K.T. Hartwig
Y.M. Wang;S. Cheng;Q.M. Wei;E. Ma
Y.H. Zhao;Y.Z. Guo;Y.Z. Guo;Q. Wei;A.M. Dangelewicz
Q. Wei;T. Jiao;K.T. Ramesh;E. Ma
X. L. Wu;Y. T. Zhu;Y. G. Wei;Q. Wei
Y.H. Zhao;Y.Z. Guo;Q. Wei;T.D. Topping
B.E. Schuster;B.E. Schuster;Q. Wei;T.C. Hufnagel;K.T. Ramesh
Yazhou Guo;Qichao Ruan;Shengxin Zhu;Q. Wei;Q. Wei
Shun Guo;Qingkun Meng;Xinqing Zhao;Qiuming Wei
K. Jagannadham;A. K. Sharma;Q. Wei;R. Kalyanraman
Q. Wei;Q. Wei;L.J. Kecskes
Q. Wei;T. Jiao;S.N. Mathaudhu;E. Ma
K.A. Darling;M.A. Tschopp;R.K. Guduru;W.H. Yin
Q. Wei;Z.L. Pan;X.L. Wu;B.E. Schuster
Q Wei;Q Wei;Q Wei;A.K Sharma;J Sankar;J Sankar;J Narayan;J Narayan
L.J. Kecskes;K.C. Cho;R.J. Dowding;B.E. Schuster
Q. Wei;K. T. Ramesh;E. Ma;L. J. Kesckes
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