The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where David R. S. Cumming sits on this spectrum.
This scientist: 409 publications — 75th percentile
75% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 1,065 publications or more.
The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where David R. S. Cumming sits on this spectrum.
This scientist: 57 D-Index — 72nd percentile
72% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 111 D-Index or more.
David R. S. Cumming is affiliated with the University of Glasgow in the United Kingdom and has a research focus within the field of Engineering. Their work spans several subfields, including Biomedical Engineering, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics and Optics, as well as Bioengineering.
The scientist's research covers key topics such as Plasmonic and Surface Plasmon Research, Metamaterials and Metasurfaces Applications, Analytical Chemistry and Sensors, Biosensors and Analytical Detection, Photonic and Optical Devices, Orbital Angular Momentum in Optics, and Terahertz technology and applications.
Frequent co-authors collaborating with David R. S. Cumming include:
Publications by David R. S. Cumming have appeared recurrently in several scholarly venues. Some of the frequent publication outlets are Laser & Photonics Review, Optics Letters, IEEE Transactions on Biomedical Engineering, IEEE Sensors Journal, and Journal of Biophotonics.
Selected recent papers authored by or involving David R. S. Cumming include:
S S Dhillon;M S Vitiello;E H Linfield;A G Davies
Yong Ma;Qin Chen;James Grant;Shimul C. Saha
James Grant;Yong Ma;Shimul Saha;Ata Khalid
S. S. Dhillon;Vitiello;E. H. Linfield;A. G. Davies
Qin Chen;David R S Cumming
Xin Hu;Gaiqi Xu;Gaiqi Xu;Long Wen;Huacun Wang
M. M. Alkaisi;R. J. Blaikie;S. J. McNab;Rebecca Cheung
P.A. Hammond;D. Ali;D.R.S. Cumming
L.C. Chirwa;P.A. Hammond;S. Roy;D.R.S. Cumming
Jonathan Mark Cooper;David Robert Sime Cumming;Nicholas Wood;Lei Wang
M.J. Milgrew;D.R.S. Cumming
M.J. Milgrew;M.O. Riehle;D.R. S. Cumming
J. Grant;Y. Ma;S. Saha;L. B. Lok
M.J. Milgrew;P.A. Hammond;D.R.S. Cumming
P.A. Hammond;D. Ali;D.R.S. Cumming
Mitchell Kenney;James Grant;Yash D Shah;Ivonne Escorcia-Carranza
Qin Chen;D. Chitnis;K. Walls;T. D. Drysdale
P. A. Hammond;D. R. S. Cumming
E.A. Johannessen;Lei Wang;Li Cui;Tong Boon Tang
M. Ahmadian;B.W. Flynn;A.F. Murray;D.R.S. Cumming
L. Wang;P. A. Hammond;E. A. Johannessen;Tong Tang
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Additionally, competency based masters degree programs focus on mastering specific skills at an individualized pace, offering another flexible pathway for engineers to upskill efficiently in emerging technologies.
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