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IEEE

International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Location: Taipei , Taiwan

Conference dates: 10/26/2022 - 10/28/2022

Research H-index
3

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Electronics and Electrical Engineering 805 5 6 2

Call for Papers

SCOPE OF PAPER SOLICITED
*Scope covers from PACKAGING TO PCB, papers relevant to the below scopes are encouraged to submit but NOT limited to.

PACKAGING
P1. Advanced Packaging Technologies

Wafer-level packaging, Panel-level packaging, Flip chip packaging, Chip scale packaging, Fan-in/Fan-out technologies, Multi-chip modules, Fine pitch/high pin packaging solution, Heterogeneous integration (side-by-side integration, vertical stacking integration, chiplet, high bandwidth memory, high performance computing package, Si interposer, organic interposer, fanout package, Si bridge, advanced substrate, 3DIC, hybrid bonding, TSV, wafer bonding, mobile heterogeneous integration (SiP, PoP, PiP), Other new technologies for advanced microelectronics.


P2. Power Electronics Packaging

Si/GaN/SiC based power device and module (IGBT, MOSFET, HEMT, diode, IPM etc.), Power electronic module systems (inverter, converter, rectifier etc.), Fabrication and assembly. Low-temperature bonding, Sintered Ag/Au bonding, Solid-Liquid Interdiffusion (SLID) bonding, Advanced cooling system, Ceramic substrate technologies (DBC, IMS, DPC, AMB etc.), High-performance passive components (Super capacitor, inductor etc.), Other related technologies.


P3. Wearable Technologies

Flexible electronics packaging, Advanced FPC technology, ACF/ACP bonding, Thin packaging, Low-temperature bonding, MEMS sensor packages, any advanced packaging related to IoT (Internet of Things), etc.


P4.Interconnections & Nanotechnology

Interconnect technologies on all packaging levels including wire bonding, flip chip and TSV connections, first-level package. Special emphasis on design and process of solder alternatives (ICP, ACP, ACF, NCP), under bump metallurgy, electromigration, micro-bump, substrate technology, novel enabling techniques, electrical performance, environmental concerns.


P5.Design, Modeling, AI/Machine Learning Applications, and Testing

Electrical, optical, thermal and mechanical modeling & design, Component-, board- and system-level reliability, Interfacial adhesion strength, Advanced testing and measurement techniques, Advances in reliability test methods and failure analysis, Design of experiment, Design optimization, AI/Machine Learning Applications, Design-on-Simulation Technologies and tools, Design rule development, Virtual prototyping in product and/or process design, From micro to macro simulation, Multi-physics simulation, Thermal management (materials, two-phase heat transfer, air cooling/liquid cooling, emerging cooling technology, thermoelectric cooling & generation etc.)


P6. Advanced Sensor &Microsystems Technology (MST)

Microsystem packaging, New MST-enabled possibilities, New sensing and actuation mechanisms, Multi-physics simulation of microsystems, New materials and processes for MST, Testing and calibration of microsystems, Sensing, actuation and control circuits on microsystems.


P7. Advanced Materials, Automatic Process & Assembly

Materials and Automatic processes for 2D/3D microelectronics, MEMS, sensor and microsystem packaging including adhesives, encapsulants, lead free solders and alloys, Thermal interface materials, High/low-k dielectrics and substrates, Thin films, TSV drilling/etching, Plating, Low temperature bonding, Assembly processes and Equipment for Automation.


P8. Emerging Systems Packaging Technologies

Renewable Energy, Energy Storage, Embedded passives & actives on substrates, Packaging solutions for RF-Microwave, flexible electronics, bioelectronics, automotive electronics, optoelectronics and Medical Electronics, Other novel system packaging technologies, Green packaging, LED & Optoelectronics packaging.

PCB
B1. Advanced and Green Materials and Process

Green materials(LF、HF、 Energy saving、 Recycling and Reducing) , Green process and manufacturing , Millimeter-wave materials(Low Dk/Df), Low CTE and low water absorption materials, Photo and non-photo dielectric materials for high density application, Advanced Substrate materials and process.


B2.Test, Quality, Inspection and Reliability

Feature Testing and Verification, Inspection(AOI, Non-destructive testing), Electrical evaluation, Structure integrity, Failure mechanism analysis.


B3. HDI, IC Substrate and FPC Technology

SAP and m-SAP process(Fine pitch line), Build-up board, Micro-vias and copper plating process, Multilayer core and coreless , Embedded devices, Advanced flex and rigid-flex, High speed and high frequency circuitry, High power substrate


B4. Smart Manufacturing and Automation

Mechatronics, Robotics, Control systems, Tele-robotics, Human computer(robot) interaction, Modeling and simulation techniques, Intelligent control and manufacturing, Neuro-control, Fuzzy control and their applications, Automatic control system, Process integration

Overview

The following ranking presents a comprehensive list of scientific conferences within the field of Engineering and Technology. This ranking has been meticulously curated by Research.com, a premier platform recognized for offering trusted data on scientific contributions and research impact since 2014. Research.com serves the global academic community across all major disciplines, with a particular emphasis on Engineering and Technology.

Each conference’s position in this ranking is determined by a uniquely developed bibliometric score, exclusively calculated by Research.com. This score is derived from a combination of the estimated h-index and the number of leading scientists who have contributed to or appeared at the conference within the last three years. The synthesis of these metrics enables a robust and objective assessment of each conference’s academic significance and influence.

The Impact Score values featured in this ranking were collected as of 2024-11-27. The rigorous selection process entailed a thorough examination of over 2,262 conferences, shortlisted following an extensive review and systematic analysis of more than 26,934 scientific documents published during the last three years. These works involved the direct contributions of 9,385 distinguished scientists who are widely acknowledged for their achievements and leadership in Engineering and Technology research.

This meticulous approach underscores the scientific and analytical rigor employed by our expert team in the production of the ranking, ensuring its reliability and authority within the academic community. For a detailed explanation of the methodology and criteria underpinning the computation of ranking scores, please visit our Methodology Page.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing at International Microsystems, Packaging, Assembly and Circuits Technology Conference (based on the number of publications) are:

  • Hideo Miura (6 papers) published 6 papers at the last edition,
  • Ken Suzuki (6 papers) published 6 papers at the last edition,
  • Ludmila Isurin (3 papers) published 3 papers at the last edition,
  • Claudia Maria Riehl (3 papers) published 3 papers at the last edition,
  • Ning-Cheng Lee (3 papers) published 3 papers at the last edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing at International Microsystems, Packaging, Assembly and Circuits Technology Conference (based on the number of publications) are:

  • Tohoku University (6 papers) published 6 papers at the last edition,
  • Intel (6 papers) published 6 papers at the last edition,
  • National Chiao Tung University (4 papers) published 4 papers at the last edition,
  • Indium Corporation (3 papers) published 3 papers at the last edition,
  • Ludwig Maximilian University of Munich (3 papers) published 3 papers at the last edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2017 edition, 26.25% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 54.24% were posted by at least one author from the top 10 institutions publishing at the conference. Another 18.64% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 27.12% of all publications and 0.00% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

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Best Scientists who published in this Conference