Location: Chongqing , China
Submission deadline: 3/31/2022
Conference dates: 9/25/2022 - 9/29/2022
| Discipline name | Position | Best Scientists | Publications | D-Index |
|---|---|---|---|---|
| Materials Science | 34 | 51 | 101 | 5 |
| Electronics and Electrical Engineering | 396 | 28 | 91 | 5 |
| Engineering and Technology | 236 | 15 | 43 | 3 |
This ranking presents a comprehensive and carefully curated list of scientific conferences within the field of Engineering and Technology. The ranking has been meticulously prepared by Research.com, a distinguished source of scientific research data since 2014, acclaimed for providing trusted insights across all major disciplines, including Engineering and Technology.
The conference positions are determined using a proprietary bibliometric score developed uniquely by Research.com. This bibliometric score incorporates the estimated h-index as well as the number of leading scientists who have contributed to each conference over the preceding three years. Such an approach ensures a robust and multi-dimensional assessment of conference impact and academic influence.
The ranking includes Impact Score values collected on 2024-11-27, offering the most up-to-date evaluation of conferences' performances. The selection process encompassed a thorough examination of over 2,262 conferences, which were chosen following stringent scrutiny of more than 26,934 academic documents published in the last three years. These contributions were authored by 9,385 leading and respected scientists specializing in Engineering and Technology, signifying the depth and breadth of expertise considered in the ranking.
For those seeking a deeper understanding of the methodology and criteria involved in computing the ranking scores, further details are available on our Methodology Page.
A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.
The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.
The top authors publishing at IEEE International Conference on High Voltage Engineering and Application (based on the number of publications) are:
The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.
Only papers with recognized affiliations are considered
The top affiliations publishing at IEEE International Conference on High Voltage Engineering and Application (based on the number of publications) are:
The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.
The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.
The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.
During the most recent 2020 edition, 7.46% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 76.46% were posted by at least one author from the top 10 institutions publishing at the conference. Another 7.58% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 9.48% of all publications and 6.48% were from other institutions.
A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.
The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.
The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.
Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).
The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:
The chart below illustrates experience levels of first authors in cases of publications with multiple authors.
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Tsinghua University
University of Manchester
Wuhan University
Xi'an Jiaotong University
Tsinghua University
Tsinghua University
Chinese Academy of Sciences
Soochow University
University of Hong Kong
University of Sydney
Shanghai Jiao Tong University
Beijing University of Posts and Telecommunications
