World's Best Scientists 2026 revealed!
IEEE

31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Location: San Jose , United States

Submission deadline: 7/10/2022

Conference dates: 10/9/2022 - 10/12/2022

Research H-index
6

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Electronics and Electrical Engineering 324 31 70 6

Call for Papers

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, measurement, analysis, synthesis, and design of electronic interconnections, packages, and systems. It also focuses on new methodologies and CAD/design techniques for evaluating signal, power, and thermal integrity and ensuring performance in high‐speed, RF, and wireless designs. EPEPS is jointly sponsored by IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society and IEEE Antennas and Propagation Society. Submitted papers should describe new technical contributions related to the area of electrical performance of high‐performance interconnect systems, covering:

System-level, board-level, package-level and on-chip interconnects
High-speed channels, links, backplanes, serial and parallel interconnects, SerDes
RF/microwave/mm-wave packaging structures and components, antenna-in-package and RFIC co-design, mixed signal modules and wireless switches
Signal and thermal integrity
Power integrity and power distribution networks
Low power mobile and personal applications
Memory and DDR interfaces
Jitter and noise management
Electronic packages and microsystems
Heterogeneous integration, 2.5D/3D interconnects and packages, TSVs and MCMs
Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools, and flows
Macromodeling and model order reduction as it applies to electrical analysis
Advanced and parallel CAD techniques for signal, power, and thermal integrity analysis
Measurement and data analysis techniques for system‐level and on‐chip structures
High volume testing for electronic packages.

Overview

The scientific conference ranking presented on this page highlights leading conferences in the field of Electronics and Electrical Engineering. This comprehensive assessment has been meticulously prepared by Research.com, a foremost authority known for providing trusted scientific data across all major disciplines—including Electronics and Electrical Engineering—since 2014.

Positions in the ranking are determined through Research.com’s exclusive bibliometric score, a sophisticated metric developed specifically for evaluating scientific conferences. This unique score is calculated by considering the estimated h-index and the number of distinguished scientists who have actively participated in each conference during the past three years.

The ranking is based on Impact Score values that were gathered as of 2024-11-27, ensuring the information reflects the most current state of scientific contributions within the field. The selection process involved a thorough examination of over 2,204 conferences, each chosen after rigorous scrutiny. This rigorous selection was supported by an in-depth evaluation of 95,378 scientific documents published over the last three years by 6,160 leading and highly regarded scientists in Electronics and Electrical Engineering.

The methodology underlying this ranking reflects a deep commitment to accuracy and reliability, underscoring the expertise and detailed analysis carried out by our team of specialists. For a comprehensive explanation of the process and the bibliometric criteria involved in computing these ranking scores, please visit our Methodology Page.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing at Electrical Performance of Electronic Packaging (based on the number of publications) are:

  • Madhavan Swaminathan (95 papers) published 3 papers at the last edition the same number as at the previous edition,
  • Joungho Kim (72 papers) published 2 papers at the last edition, 2 less than at the previous edition,
  • Andreas C. Cangellaris (48 papers) published 1 paper at the last edition the same number as at the previous edition,
  • Paul D. Franzon (41 papers) absent at the last edition,
  • Albert E. Ruehli (41 papers) absent at the last edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing at Electrical Performance of Electronic Packaging (based on the number of publications) are:

  • IBM (254 papers) published 3 papers at the last edition, 1 less than at the previous edition,
  • Intel (178 papers) published 6 papers at the last edition, 2 less than at the previous edition,
  • Georgia Institute of Technology (123 papers) published 3 papers at the last edition the same number as at the previous edition,
  • University of Illinois at Urbana–Champaign (98 papers) published 3 papers at the last edition, 1 more than at the previous edition,
  • Rambus (76 papers) absent at the last edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2020 edition, 6.98% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 47.50% were posted by at least one author from the top 10 institutions publishing at the conference. Another 7.50% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 15.00% of all publications and 30.00% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

Related Online Degrees & Career Pathways

For those interested in Electronics and Electrical Engineering, exploring related online degrees and certifications can provide valuable career advantages. Many professionals begin by earning certificates i can get online that enhance specific technical skills, offering faster entry into the workforce or promotion opportunities.

Students seeking simpler and more accessible education options may consider some of the easy degrees to get, which can serve as a foundation before progressing into more specialized fields like electronics engineering. Additionally, for those requiring quick qualifications, there are excellent options for what degree can i get online in 6 months, allowing learners to gain an associate degree within a short period.

For advancing one’s career further, many institutions offer cheapest masters degree online programs in related disciplines, combining affordability with high-quality education. These pathways are ideal for professionals aiming to deepen their expertise while balancing work and study.

Overall, leveraging a combination of certifications, associate degrees, and affordable master’s programs online can open diverse opportunities and strengthen career prospects in the field of electronics and electrical engineering.

Best Scientists who published in this Conference

Recently Published Articles