World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
55
Citations
11418
World Ranking
2190
National Ranking
853

Yongbin Wei publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Yongbin Wei sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 364 publications — 69th percentile

69% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Yongbin Wei D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Yongbin Wei sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 55 D-Index — 69th percentile

69% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

Yongbin Wei is affiliated with Qualcomm in the United States. Their research outputs primarily focus on fields related to Engineering and Computer Science, with specific expertise in Aerospace Engineering and Signal Processing. The main topics explored in their work include Radar Systems and Signal Processing, Advanced SAR Imaging Techniques, and Direction-of-Arrival Estimation Techniques.

The scientist's recent publication record includes the paper titled A robust equalization method for dechirp channels, published in 2021 in the IET conference proceedings.

Yongbin Wei frequently collaborates with several coauthors. Notable coauthors include:

  • Y. Zhang
  • Qi Sun
  • Bowen Zhang
  • Zhongding Lei

Regarding publication venues, their work has appeared in:

  • IET conference proceedings.

Their contributions span multiple subfields and main fields of study as follows:

  • Main fields of study: Engineering, Computer Science
  • Subfields of study: Aerospace Engineering, Signal Processing
  • Main research topics: Radar Systems and Signal Processing, Advanced SAR Imaging Techniques, Direction-of-Arrival Estimation Techniques

Best Publications

  • A survey on 3GPP heterogeneous networks

    A Damnjanovic;J Montojo;Yongbin Wei;Tingfang Ji

  • Multi-media broadcast and multicast service (MBMS) in a wireless communication system

    Serge Willenegger;Tao Chen;Alkinoos Hector Vayanos;Yongbin Wei

  • Method and apparatus for use of licensed spectrum for control channels in cognitive radio communications

    Alan Barbieri;Durga Prasad Malladi;Yongbin Wei;Naga Bhushan

  • Downlink procedures for lte/lte-a communication systems with unlicensed spectrum

    Wanshi Chen;Peter Gaal;Durga Prasad Malladi;Tao Luo

  • Methods and apparatus for facilitating inter-cell interference coordination via over the air load indicator and relative narrowband transmit power

    Aleksandar Damnjanovic;Yongbin Wei;Madhavan Srinivasan Vajapeyam;Durga Prasad Malladi

  • Extended acknowledgement and rate control channel

    Yongbin Wei;Edward G. Tiedemann;Peter Gaal;Durga P. Malladi

  • Power control of serving and non-serving base stations

    Tao Chen;Yongbin Wei;Avinash Jain;Edward G. Tiedemann

  • Broadcast and multicast services in cdma2000

    Jun Wang;R. Sinnarajah;Tao Chen;Yongbin Wei

  • Combining grant, acknowledgement, and rate control

    Tiedemann Edward G;Malladi Durga P;Sarkar Sandip;Lundby Stein A

  • Coordinated downlink multi-point communications in heterogeneous cellular networks

    A. Barbieri;P. Gaal;S. Geirhofer;T. Ji

  • LTE Femtocells: System Design and Performance Analysis

    A. Barbieri;A. Damnjanovic;Tingfang Ji;J. Montojo

  • Method and apparatus for high rate data transmission in wireless communication

    Aleksandar Damnjanovic;Joseph Paul Odenwalder;Stein Arne Lundby;Yongbin Wei

  • COORDINATED MULTI-POINT (CoMP) NETWORK AND PROTOCOL ARCHITECTURE

    Peter A. Barany;Alexei Y. Gorokhov;Vikas Jain;Tao Luo

  • Dynamic shared forward link channel for a wireless communication system

    Tao Chen;Baaziz Achour;Brian K. Butler;Edward G. Tiedemann

  • Dual-enhancement of ferro-/piezoelectric and photoluminescent performance in Pr3+ doped (K0.5Na0.5)NbO3 lead-free ceramics

    Yongbin Wei;Zheng Wu;Yanmin Jia;Jiang Wu

  • CQI Estimation in a Wireless Communication Network

    Alan Barbieri;Tingfang Ji;Parag Arun Agashe;Yongbin Wei

  • System design for user equipment relays

    Aleksandar Damnjanovic;Naga Bhushan;Saiyiu D. Ho;Yongbin Wei

  • LTE-A MIMO SRS ENHANCED SRS TRANSMISSION FOR MIMO OPERATION IN LTE-A

    Chen Wanshi;Gaal Peter;Xu Hao;Wei Yongbin

  • Ultra-low latency LTE uplink frame structure

    Wanshi Chen;Peter Gaal;Shimman Arvind Patel;Durga Prasad Malladi

  • Hsdpa system with reduced inter-user interference

    Durga Prasad Malladi;Peter Gaal;Yongbin Wei

  • FLEXIBLE MULTIPLEXING AND FEEDBACK FOR VARIABLE TIME INTERVALS

    Damnjanovic Jelena;Yoo Taesang;Mallik Siddhartha;Damnjanovic Aleksandar

Frequent Co-Authors

Aleksandar Damnjanovic
Aleksandar Damnjanovic Qualcomm (United States)
Durga Prasad Malladi
Durga Prasad Malladi Qualcomm (United States)
Wanshi Chen
Wanshi Chen Qualcomm (United States)
Edward G. Tiedemann
Edward G. Tiedemann Qualcomm (United States)
Juan Montojo
Juan Montojo Qualcomm (United States)
Gavin Bernard Horn
Gavin Bernard Horn Qualcomm (United States)
Tamer Kadous
Tamer Kadous XCOM Labs
Parag A. Agashe
Parag A. Agashe Qualcomm (United States)
Byoung-Hoon Kim
Byoung-Hoon Kim LG Corporation (South Korea)
Ahmed Kamel Sadek
Ahmed Kamel Sadek Qualcomm (United States)

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Related Online Degrees & Career Pathways

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Additionally, for those interested in education and training within technical fields, pursuing a master's in instructional design can be a valuable option. This helps engineers transition into roles where they develop training content or instructional materials, bridging the gap between technology and learner engagement.

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