Smart Photonic and Optoelectronic Integrated Circuits (SPOIC)

Scientists and engineers from academic institutions, research laboratories, and the industry are strongly encouraged to submit papers in the following areas:
physics, theory, design, modeling, simulation, and scaling of photonic integrated circuits (PICs) and optoelectronic integrated circuits (OEICs)
PIC/OEIC materials (semiconductors, graphene, glasses, polymers, ferroelectrics, magnetics, metals, biomaterials, DNA, molecules, etc.)
integration, interconnection, fabrication, assembly, packaging, characterization, and roadmap of micro/nano silicon and compound semiconductor photonic and optoelectronic devices
electronics and photonics convergence on a silicon CMOS platform
integration of different photonic and optoelectronic structure types (dots, wires, wells, planar, free space, 1D/2D/3D photonic bandgap devices, plasmonic devices, etc.)
integration of miniature (micro/nano/quantum-scale) photonic and optoelectronic devices, circuits, and systems; photonic/optoelectronic system on a chip; VLSI/ULSI photonics and optoelectronics
integration of novel devices using micro-rings, micro-disks, micro-spheres, micro-cavities, nano-optic/nano-photonic devices, nano-lasers, nano-detectors, nano-wires, plasmonics, and metamaterials
integration and assembly of micro- and nano-scale imaging systems
integration and assembly of micro- and nano-scale smart sensor and detector systems
miniaturization and integration of THz and microwave photonic devices, components, and systems
integration and interconnection of different functions (lasers, amplifiers, detectors, sensors, modulators, isolators, circulators, switches, attenuators, couplers, phased arrays, multi/demultiplexers, filters, wavelength converters, polarization controllers, PMD/CD compensators, control electronics, etc.)
integration of dynamic devices actuated through thermo-optic, electro-optic, acousto-optic, magneto-optic, and all-optical mechanisms
monolithic and hybrid integration of optical, photonic, optoelectronic, electronic, and biological devices
parallel and serial integration of optical, photonic, and optoelectronic devices
fabrication and processing techniques (UV/deep UV/X-ray/e-beam lithography, casting, molding, embossing, etching, passivation, etc.)
alignment, tolerance, coupling, and interconnections; designs for alignment tolerance relaxation
optical interconnection and integration on photonic PCBs
integration on novel flexible and rigid substrates
assembly and packaging approaches and processes
characterization (optical, electrical, optoelectronic, thermal, structural, etc.)
standards, quality, reliability, qualification, and certification
components, modules, subsystems, and systems
smart PIC- and OEIC-based systems with artificial intelligence
smart systems of special interest include nodes in self-healing optical communication networks, light detection and ranging (LiDAR) sensing systems with object detection, tracking, identification, and classification capability
applications: communications, quantum information services, computing, data storage, sensing, scanning, imaging, mapping, displays, printing, industrial automation, robotization, autonomous vehicles, etc.
subsystem-on-chip for bio-detection, sensing and communications.